Kaltalioglu; Erdem
Patent Applications and Registrations
Patent applications and USPTO patent grants for Kaltalioglu; Erdem.The latest application filed is for "ic structure with interdigitated conductive elements between metal guard structures".
Company Profile
10.80.80
- Kaltalioglu; Erdem - Newburgh NY
- Kaltalioglu; Erdem - Iselin NJ
- Kaltalioglu; Erdem - Hsin-Chu TW
- Kaltalioglu; Erdem - Wappingers Falls NY
- Kaltalioglu; Erdem - Hsinchu TW
- Kaltalioglu; Erdem - Fishkill NY
- Kaltalioglu; Erdem - Hopewell Junction NY
- Kaltalioglu; Erdem - Wappinger Falls NY
Patent Activity
| Patent | Date |
|---|---|
| IC structure with interdigitated conductive elements between metal guard structures Grant 10,770,407 - Wu , et al. Sep | 2020-09-08 |
| Ic Structure With Interdigitated Conductive Elements Between Metal Guard Structures App 20200219826 - Wu; Zhuojie ; et al. | 2020-07-09 |
| Interconnect structure having power rail structure and related method Grant 10,438,890 - Kaltalioglu , et al. O | 2019-10-08 |
| Mechanically anchored C4 pad and method of forming same Grant 10,388,617 - Kaltalioglu , et al. A | 2019-08-20 |
| Wafer rigidity with reinforcement structure Grant 10,325,862 - Filippi , et al. | 2019-06-18 |
| Wafer reinforcement to reduce wafer curvature Grant 10,304,783 - Kaltalioglu , et al. | 2019-05-28 |
| Interconnect structures for a security application Grant 10,297,546 - Kaltalioglu , et al. | 2019-05-21 |
| Mechanically Anchored C4 Pad And Method Of Forming Same App 20190123005 - Kaltalioglu; Erdem ; et al. | 2019-04-25 |
| Interconnect Structures For A Security Application App 20190027433 - Kaltalioglu; Erdem ; et al. | 2019-01-24 |
| Interconnect Structure Having Power Rail Structure And Related Method App 20180261538 - Kaltalioglu; Erdem ; et al. | 2018-09-13 |
| Interconnect structure having power rail structure and related method Grant 9,997,456 - Kaltalioglu , et al. June 12, 2 | 2018-06-12 |
| IC structure integrity sensor having interdigitated conductive elements Grant 9,947,602 - Wu , et al. April 17, 2 | 2018-04-17 |
| Ic Structure Integrity Sensor Having Interdigitated Conductive Elements App 20180047648 - Wu; Zhuojie ; et al. | 2018-02-15 |
| Interconnect Structure Having Power Rail Structure And Related Method App 20180033718 - Kaltalioglu; Erdem ; et al. | 2018-02-01 |
| Wafer Rigidity With Reinforcement Structure App 20180019214 - FILIPPI; Ronald G. ; et al. | 2018-01-18 |
| Wafer Reinforcement To Reduce Wafer Curvature App 20180005961 - Kaltalioglu; Erdem ; et al. | 2018-01-04 |
| Wafer reinforcement to reduce wafer curvature Grant 9,852,999 - Kaltalioglu , et al. December 26, 2 | 2017-12-26 |
| Interconnect structures with variable dopant levels Grant 9,768,065 - Wang , et al. September 19, 2 | 2017-09-19 |
| Wafer rigidity with reinforcement structure Grant 9,761,539 - Filippi , et al. September 12, 2 | 2017-09-12 |
| TSV deep trench capacitor and anti-fuse structure Grant 9,741,657 - Filippi , et al. August 22, 2 | 2017-08-22 |
| Wafer Reinforcement To Reduce Wafer Curvature App 20170098616 - Kaltalioglu; Erdem ; et al. | 2017-04-06 |
| Strain detection structures for bonded wafers and chips Grant 9,553,054 - Farooq , et al. January 24, 2 | 2017-01-24 |
| Selective local metal cap layer formation for improved electromigration behavior Grant 9,536,779 - Filippi , et al. January 3, 2 | 2017-01-03 |
| Wafer Rigidity With Reinforcement Structure App 20160379934 - FILIPPI; Ronald G. ; et al. | 2016-12-29 |
| Structures and methods for determining TDDB reliability at reduced spacings using the structures Grant 9,524,916 - Filippi , et al. December 20, 2 | 2016-12-20 |
| Mechanically anchored backside C4 pad Grant 9,478,509 - Filippi , et al. October 25, 2 | 2016-10-25 |
| Selective local metal cap layer formation for improved electromigration behavior Grant 9,431,293 - Filippi , et al. August 30, 2 | 2016-08-30 |
| Passivated copper chip pads Grant 9,373,596 - Goebel , et al. June 21, 2 | 2016-06-21 |
| Through level vias and methods of formation thereof Grant 9,330,974 - Kim , et al. May 3, 2 | 2016-05-03 |
| Strain Detection Structures For Bonded Wafers And Chips App 20160118348 - FAROOQ; Mukta G. ; et al. | 2016-04-28 |
| E-fuse with hybrid metallization Grant 9,305,879 - Filippi , et al. April 5, 2 | 2016-04-05 |
| Selective Local Metal Cap Layer Formation For Improved Electromigration Behavior App 20150255328 - Filippi; Ronald G. ; et al. | 2015-09-10 |
| Facilitating Chip Dicing For Metal-metal Bonding And Hybrid Wafer Bonding App 20150255417 - Farooq; Mukta G. ; et al. | 2015-09-10 |
| Mechanically Anchored Backside C4 Pad App 20150255410 - Filippi; Ronald G. ; et al. | 2015-09-10 |
| Selective Local Metal Cap Layer Formation For Improved Electromigration Behavior App 20150255387 - Filippi; Ronald G. ; et al. | 2015-09-10 |
| Selective local metal cap layer formation for improved electromigration behavior Grant 9,123,726 - Filippi , et al. September 1, 2 | 2015-09-01 |
| Tsv Deep Trench Capacitor And Anti-fuse Structure App 20150235944 - Filippi; Ronald G. ; et al. | 2015-08-20 |
| Semiconductor article having a zig-zag guard ring and method of forming the same Grant 9,082,781 - Filippi , et al. July 14, 2 | 2015-07-14 |
| Electronic fuse line with modified cap Grant 9,059,173 - Filippi , et al. June 16, 2 | 2015-06-16 |
| Interconnect with hybrid metallization Grant 9,059,166 - Filippi , et al. June 16, 2 | 2015-06-16 |
| Facilitating chip dicing for metal-metal bonding and hybrid wafer bonding Grant 9,059,333 - Farooq , et al. June 16, 2 | 2015-06-16 |
| Electronic fuse having a damaged region Grant 9,059,170 - Bao , et al. June 16, 2 | 2015-06-16 |
| Random local metal cap layer formation for improved integrated circuit reliability Grant 9,054,108 - Filippi , et al. June 9, 2 | 2015-06-09 |
| Facilitating Chip Dicing For Metal-metal Bonding And Hybrid Wafer Bonding App 20150155263 - Farooq; Mukta G. ; et al. | 2015-06-04 |
| Semiconductor Article Having A Zig-zag Guard Ring App 20150097297 - Filippi; Ronald G. ; et al. | 2015-04-09 |
| Devices Formed With Dual Damascene Process App 20150084196 - Riess; Philipp ; et al. | 2015-03-26 |
| 3d Chip Crackstop App 20150069609 - Farooq; Mukta G. ; et al. | 2015-03-12 |
| Crack Sensors for Semiconductor Devices App 20150035556 - Kaltalioglu; Erdem | 2015-02-05 |
| Random Local Metal Cap Layer Formation For Improved Integrated Circuit Reliability App 20150028484 - Filippi; Ronald G. ; et al. | 2015-01-29 |
| Electronic Fuse Line With Modified Cap App 20150021736 - Filippi; Ronald G. ; et al. | 2015-01-22 |
| Random local metal cap layer formation for improved integrated circuit reliability Grant 8,906,799 - Filippi , et al. December 9, 2 | 2014-12-09 |
| Crack sensors for semiconductor devices Grant 8,890,560 - Kaltalioglu November 18, 2 | 2014-11-18 |
| Method of forming electronic fuse line with modified cap Grant 8,889,491 - Filippi , et al. November 18, 2 | 2014-11-18 |
| Interconnect With Hybrid Metallization App 20140332963 - Filippi; Ronald G. ; et al. | 2014-11-13 |
| E-fuse With Hybrid Metallization App 20140332923 - Filippi; Ronald G. ; et al. | 2014-11-13 |
| Devices formed with dual damascene process Grant 8,860,225 - Riess , et al. October 14, 2 | 2014-10-14 |
| Passivated Copper Chip Pads App 20140295661 - Goebel; Thomas ; et al. | 2014-10-02 |
| Passivated copper chip pads Grant 8,822,324 - Goebel , et al. September 2, 2 | 2014-09-02 |
| Electronic Fuse Having A Damaged Region App 20140217612 - Bao; Junjing ; et al. | 2014-08-07 |
| Electronic Fuse Line With Modified Cap App 20140210040 - FILIPPI; RONALD G. ; et al. | 2014-07-31 |
| Selective Local Metal Cap Layer Formation For Improved Electromigration Behavior App 20140203436 - Filippi; Ronald G. ; et al. | 2014-07-24 |
| Pads with different width in a scribe line region and method for manufacturing these pads Grant 8,748,295 - Kaltalioglu , et al. June 10, 2 | 2014-06-10 |
| Structures And Methods For Determining Tddb Reliability At Reduced Spacings Using The Structures App 20140118020 - Filippi; Ronald G. ; et al. | 2014-05-01 |
| Crack stop trenches Grant 8,610,238 - Kaltalioglu , et al. December 17, 2 | 2013-12-17 |
| Capacitor having a plurality of parallel conductive members Grant 8,569,820 - Barth , et al. October 29, 2 | 2013-10-29 |
| Passivated Copper Chip Pads App 20130224946 - Goebel; Thomas ; et al. | 2013-08-29 |
| Methods of manufacturing semiconductor devices and structures thereof Grant 8,378,439 - Beck , et al. February 19, 2 | 2013-02-19 |
| Crack stops for semiconductor devices Grant 8,309,435 - Kaltalioglu , et al. November 13, 2 | 2012-11-13 |
| Through Level Vias and Methods of Formation Thereof App 20120104622 - Kim; Sunoo ; et al. | 2012-05-03 |
| Semiconductor Devices and Methods of Manufacture Thereof App 20120099243 - Barth; Hans-Joachim ; et al. | 2012-04-26 |
| Crack sensors for semiconductor devices Grant 8,159,254 - Kaltalioglu April 17, 2 | 2012-04-17 |
| Methods of Manufacturing Semiconductor Devices and Structures Thereof App 20120074536 - Beck; Michael ; et al. | 2012-03-29 |
| Semiconductor devices and methods of manufacture thereof Grant 8,138,539 - Barth , et al. March 20, 2 | 2012-03-20 |
| Crack Sensors for Semiconductor Devices App 20120049884 - Kaltalioglu; Erdem | 2012-03-01 |
| Devices Formed With Dual Damascene Process App 20120025382 - Riess; Philipp ; et al. | 2012-02-02 |
| Methods of manufacturing semiconductor devices and structures thereof Grant 8,093,150 - Beck , et al. January 10, 2 | 2012-01-10 |
| Dual damascene process Grant 8,062,971 - Riess , et al. November 22, 2 | 2011-11-22 |
| Crack Stops for Semiconductor Devices App 20110244658 - Kaltalioglu; Erdem ; et al. | 2011-10-06 |
| Crack stops for semiconductor devices Grant 8,008,750 - Kaltalioglu , et al. August 30, 2 | 2011-08-30 |
| Crack Stop Trenches App 20110074033 - Kaltalioglu; Erdem ; et al. | 2011-03-31 |
| Crack stop trenches Grant 7,871,902 - Kaltalioglu , et al. January 18, 2 | 2011-01-18 |
| Method of forming support structures for semiconductor devices Grant 7,858,448 - Goebel , et al. December 28, 2 | 2010-12-28 |
| Test Structures and Methods for Semiconductor Devices App 20100314619 - Kaltalioglu; Erdem ; et al. | 2010-12-16 |
| MIM capacitors with catalytic activation layer Grant 7,843,035 - Barth , et al. November 30, 2 | 2010-11-30 |
| Capacitor integrated in a structure surrounding a die Grant 7,795,615 - Goebel , et al. September 14, 2 | 2010-09-14 |
| Method and apparatus of stress relief in semiconductor structures Grant 7,786,007 - Hoinkis , et al. August 31, 2 | 2010-08-31 |
| Method of Forming Support Structures for Semiconductor Devices App 20100022085 - Goebel; Thomas ; et al. | 2010-01-28 |
| Support structures for semiconductor devices Grant 7,626,268 - Goebel , et al. December 1, 2 | 2009-12-01 |
| Capacitor and method of manufacturing a capacitor Grant 7,615,440 - Felsner , et al. November 10, 2 | 2009-11-10 |
| Dual Damascene Process App 20090239375 - Riess; Philipp ; et al. | 2009-09-24 |
| Crack Stop Trenches App 20090203192 - Kaltalioglu; Erdem ; et al. | 2009-08-13 |
| Passivated Copper Chip Pads App 20090200675 - Goebel; Thomas ; et al. | 2009-08-13 |
| Crack Sensors for Semiconductor Devices App 20090201043 - Kaltalioglu; Erdem | 2009-08-13 |
| Crack Stops for Semiconductor Devices App 20090194850 - Kaltalioglu; Erdem ; et al. | 2009-08-06 |
| Methods of forming an interconnect structure Grant 7,553,703 - Herold , et al. June 30, 2 | 2009-06-30 |
| Semiconductor Devices and Methods of Manufacture Thereof App 20090141424 - Barth; Hans-Joachim ; et al. | 2009-06-04 |
| Back end interconnect with a shaped interface Grant 7,494,915 - Clevenger , et al. February 24, 2 | 2009-02-24 |
| MIM Capacitors App 20080290459 - Barth; Hans-Joachim ; et al. | 2008-11-27 |
| MIM capacitor with a cap layer over the conductive plates Grant 7,436,016 - Barth , et al. October 14, 2 | 2008-10-14 |
| Method and Apparatus of Stress Relief in Semiconductor Structures App 20080213993 - Hoinkis; Mark ; et al. | 2008-09-04 |
| Memory Card with Connecting Portions for Connection to an Adapter App 20080119039 - Herold; Klaus ; et al. | 2008-05-22 |
| Method and apparatus of stress relief in semiconductor structures Grant 7,368,804 - Hoinkis , et al. May 6, 2 | 2008-05-06 |
| Methods of manufacturing semiconductor devices and structures thereof App 20080070404 - Beck; Michael ; et al. | 2008-03-20 |
| Memory card with connecting portions for connection to an adapter Grant 7,332,812 - Herold , et al. February 19, 2 | 2008-02-19 |
| Capacitor and Method of Manufacturing a Capacitor App 20070294871 - Felsner; Petra ; et al. | 2007-12-27 |
| Final passivation scheme for integrated circuits Grant 7,307,346 - Kaltalioglu , et al. December 11, 2 | 2007-12-11 |
| Capacitor and method of manufacturing a capacitor Grant 7,268,383 - Felsner , et al. September 11, 2 | 2007-09-11 |
| Bilayered metal hardmasks for use in dual damascene etch schemes Grant 7,241,681 - Kumar , et al. July 10, 2 | 2007-07-10 |
| Capacitor integrated in a structure surrounding a die App 20070102787 - Goebel; Thomas ; et al. | 2007-05-10 |
| Support structures for semiconductor devices App 20070080464 - Goebel; Thomas ; et al. | 2007-04-12 |
| Polishing methods and apparatus Grant 7,201,634 - Naujok , et al. April 10, 2 | 2007-04-10 |
| Back End Interconnect With A Shaped Interface App 20060292852 - Clevenger; Lawrence A. ; et al. | 2006-12-28 |
| Dual damascene structure and method Grant 7,125,792 - Kumar , et al. October 24, 2 | 2006-10-24 |
| Conductive line end extension App 20060231955 - Herold; Klaus ; et al. | 2006-10-19 |
| Back end interconnect with a shaped interface Grant 7,122,462 - Clevenger , et al. October 17, 2 | 2006-10-17 |
| Dual damascene structure and method Grant 7,091,612 - Kumar , et al. August 15, 2 | 2006-08-15 |
| Reduction of the shear stress in copper via's in organic interlayer dielectric material Grant 7,060,619 - Cowley , et al. June 13, 2 | 2006-06-13 |
| Bilayered metal hardmasks for use in dual damascene etch schemes App 20060113278 - Kumar; Kaushik ; et al. | 2006-06-01 |
| Bilayered metal hardmasks for use in Dual Damascene etch schemes Grant 7,052,621 - Kumar , et al. May 30, 2 | 2006-05-30 |
| MIM capacitors App 20050282346 - Barth, Hans-Joachim ; et al. | 2005-12-22 |
| Final passivation scheme for integrated circuits App 20050260842 - Kaltalioglu, Erdem ; et al. | 2005-11-24 |
| Stress-relief layer for semiconductor applications Grant 6,960,835 - Barth , et al. November 1, 2 | 2005-11-01 |
| Method and apparatus of stress relief in semiconductor structures App 20050221610 - Hoinkis, Mark ; et al. | 2005-10-06 |
| Methods of forming MIM capacitors Grant 6,949,442 - Barth , et al. September 27, 2 | 2005-09-27 |
| Bilayer HDP CVD/PE CVD cap in advanced BEOL interconnect structures and method thereof Grant 6,914,320 - Chen , et al. July 5, 2 | 2005-07-05 |
| Back End Interconnect With a Shaped Interface App 20050112864 - Clevenger, Lawrence A. ; et al. | 2005-05-26 |
| Stress-relief layer for semiconductor applications App 20050093159 - Barth, Hans-Joachim ; et al. | 2005-05-05 |
| Bilayer HDP CVD/PE CVD cap in advance BEOL interconnect structures and method thereof Grant 6,887,783 - Chen , et al. May 3, 2 | 2005-05-03 |
| Dual damascene structure and method App 20050079706 - Kumar, Kaushik ; et al. | 2005-04-14 |
| Dual damascene structure and method App 20050077628 - Kumar, Kaushik ; et al. | 2005-04-14 |
| Bilayered metal hardmasks for use in dual damascene etch schemes App 20040251234 - Kumar, Kaushik ; et al. | 2004-12-16 |
| Method and apparatus of stress relief in semiconductor structures App 20040227214 - Hoinkis, Mark ; et al. | 2004-11-18 |
| Single mask MIM capacitor top plate App 20040224474 - Barth, Hans-Joachim ; et al. | 2004-11-11 |
| Method for eliminating via resistance shift in organic ILD Grant 6,806,182 - Restaino , et al. October 19, 2 | 2004-10-19 |
| Robust via structure and method Grant 6,806,579 - Cowley , et al. October 19, 2 | 2004-10-19 |
| Reduction of the shear stress in copper via's in organic interlayer dielectric material App 20040175921 - Cowley, Andy ; et al. | 2004-09-09 |
| Bilayer HDP CVD / PE CVD cap in advanced BEOL interconnect structures and method thereof App 20040173907 - Chen, Tze-Chiang ; et al. | 2004-09-09 |
| Capacitor and method of manufacturing a capacitor App 20040164339 - Felsner, Petra ; et al. | 2004-08-26 |
| Robust Via Structure And Method App 20040157442 - Cowley, Andy ; et al. | 2004-08-12 |
| FBEOL process for Cu metallizations free from Al-wirebond pads Grant 6,730,982 - Barth , et al. May 4, 2 | 2004-05-04 |
| Via liner integration to avoid resistance shift and resist mechanical stress App 20040058526 - Cowley, Andrew ; et al. | 2004-03-25 |
| Method for eliminating VIA resistance shift in organic ILD App 20030207559 - Restaino, Darryl ; et al. | 2003-11-06 |
| Dual hardmask single damascene integration scheme in an organic low k ILD Grant 6,638,851 - Cowley , et al. October 28, 2 | 2003-10-28 |
| Barbed vias for electrical and mechanical connection between conductive layers in semiconductor devices Grant 6,613,664 - Barth , et al. September 2, 2 | 2003-09-02 |
| Bilayer HDP CVD / PE CVD cap in advanced BEOL interconnect structures and method thereof App 20030134499 - Chen, Tze-Chiang ; et al. | 2003-07-17 |
| Elimination of via-resistance-shift by increasing via size at a last level App 20030042580 - Hoinkis, Mark ; et al. | 2003-03-06 |
| Dual damascene integration scheme using a bilayer interlevel dielectric App 20020173079 - Kaltalioglu, Erdem | 2002-11-21 |
| Dual hardmask single damascene integration scheme in an organic low k ILD App 20020164870 - Cowley, Andy ; et al. | 2002-11-07 |
| FBEOL process for Cu metallizations free from Al-wirebond pads App 20020142592 - Barth, Hans-Joachim ; et al. | 2002-10-03 |
| Barbed vias for electrical and mechanical connection between conductive layers in semiconductor devices App 20020086517 - Barth, Hans-Joachin ; et al. | 2002-07-04 |
| Barbed vias for electrical and mechanical connection between conductive layers in semiconductor devices App 20020086523 - Barth, Hans-Joachin ; et al. | 2002-07-04 |
| Method of forming an on-chip decoupling capacitor with bottom hardmask Grant 6,387,754 - Dalton , et al. May 14, 2 | 2002-05-14 |
| Method of forming an on-chip decoupling capacitor with bottom hardmask App 20010036753 - Dalton, Timothy J. ; et al. | 2001-11-01 |
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