Kalidas; Navinchandra

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kalidas; Navinchandra.The latest application filed is for "structure and method of high performance two layer ball grid array substrate".

Company Profile

0.9.8

Kalidas; Navinchandra - Houston TX

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Structure and method of high performance two layer ball grid array substrate Grant 7,795,072 - Lamson , et al. September 14, 2	2010-09-14
Structure and method of high performance two layer ball grid array substrate App 20080195990 - Lamson; Michael A. ; et al.	2008-08-14
Low profile, chip-scale package and method of fabrication Grant 7,309,648 - Kalidas , et al. December 18, 2	2007-12-18
Low Profile, Chip-Scale Package and Method of Fabrication App 20070020808 - Kalidas; Navinchandra ; et al.	2007-01-25
Low profile, chip-scale package and method of fabrication Grant 7,135,781 - Kalidas , et al. November 14, 2	2006-11-14
Universal pattern of contact pads for semiconductor reflow interconnections App 20060185895 - Kalidas; Navinchandra	2006-08-24
Structure and method of high performance two layer ball grid array substrate App 20060063304 - Lamson; Michael A. ; et al.	2006-03-23
Low profile, chip-scale package and method of fabrication App 20060033219 - Kalidas; Navinchandra ; et al.	2006-02-16
Structure and method of high performance two layer ball grid array substrate Grant 6,995,037 - Lamson , et al. February 7, 2	2006-02-07
Integrated interconnect package App 20050093170 - Kalidas, Navinchandra ; et al.	2005-05-05
Structure and method of high performance two layer ball grid array substrate Grant 6,794,743 - Lamson , et al. September 21, 2	2004-09-21
Structure and method of high performance two layer ball grid array substrate App 20040108586 - Lamson, Michael A. ; et al.	2004-06-10
Ball Grid Package With Multiple Power/ Ground Planes App 20010013654 - KALIDAS, NAVINCHANDRA ; et al.	2001-08-16
Ball grid array package Grant 6,084,777 - Kalidas , et al. July 4, 2	2000-07-04
Ball grid array package having a deformable metal layer and method Grant 5,895,967 - Stearns , et al. April 20, 1	1999-04-20
Plastic packaging for a surface mounted integrated circuit Grant 5,777,382 - Abbott , et al. July 7, 1	1998-07-07
Intelligent electronic connection socket Grant 4,540,226 - Thompson , et al. September 10, 1	1985-09-10

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