KAKEN TECH CO., LTD.

Patent Applications and Registrations

Patent applications and USPTO patent grants for KAKEN TECH CO., LTD..The latest application filed is for "conductive paste and die bonding method".

Company Profile

3.12.7

KAKEN TECH CO., LTD. - Osaka N/A JP
KAKEN TECH CO., LTD. - Tokyo JP
Kaken Tech Co., Ltd -

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Trademarks

Patent Activity

Patent	Date
Conductive paste and die bonding method Grant 10,615,144 - Hori , et al.	2020-04-07
Cleaning composition and cleaning method Grant 10,508,255 - Hori , et al. Dec	2019-12-17
Conductive Paste And Die Bonding Method App 20190139930 - HORI; Shigeo ; et al.	2019-05-09
Flake-like silver powder, conductive paste, and method for producing flake-like silver powder Grant 10,071,420 - Hori , et al. September 11, 2	2018-09-11
Conductive paste and die bonding method Grant 9,818,718 - Hori , et al. November 14, 2	2017-11-14
Flake-like Silver Powder, Conductive Paste, And Method For Producing Flake-like Silver Powder App 20160114390 - HORI; Shigeo ; et al.	2016-04-28
Liquid concentrate for cleaning composition, cleaning composition and cleaning method Grant 9,085,751 - Hori , et al. July 21, 2	2015-07-21
Conductive Paste And Die Bonding Method App 20150115018 - Hori; Shigeo ; et al.	2015-04-30
Liquid Concentrate For Cleaning Composition, Cleaning Composition And Cleaning Method App 20130096044 - Hori; Shigeo ; et al.	2013-04-18
Conductive powder, conductive composition, and producing method of the same Grant 7,799,408 - Hori , et al. September 21, 2	2010-09-21
Cleaning agent for removing solder flux and method for cleaning solder flux Grant 7,776,808 - Hori , et al. August 17, 2	2010-08-17
Cleaning agent for removing solder flux and method for cleaning solder flux App 20080305979 - Hori; Shigeo ; et al.	2008-12-11
Cleaning agent for removing solder flux and method for cleaning solder flux Grant 7,435,711 - Hori , et al. October 14, 2	2008-10-14
Conductiv powder and conductive composition App 20030201427 - Hori, Shigeo ; et al.	2003-10-30

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