Kajiyama; Keiichi
Patent Applications and Registrations
Patent applications and USPTO patent grants for Kajiyama; Keiichi.The latest application filed is for "dividing method for wafer having die bonding film attached to the back side thereof".
- Kajiyama; Keiichi - Ota-Ku N/A JP
- Kajiyama; Keiichi - Tokyo JP
| Patent | Date |
|---|---|
| Dividing method for wafer having die bonding film attached to the back side thereof Grant 8,415,232 - Kajiyama , et al. April 9, 2 | 2013-04-09 |
| Optical device wafer processing method Grant 8,268,656 - Kajiyama September 18, 2 | 2012-09-18 |
| Dividing Method For Wafer Having Die Bonding Film Attached To The Back Side Thereof App 20120100694 - Kajiyama; Keiichi ; et al. | 2012-04-26 |
| Method of grinding wafer Grant 8,025,556 - Kajiyama , et al. September 27, 2 | 2011-09-27 |
| Wafer Processing Method App 20110097875 - Gokita; Yohei ; et al. | 2011-04-28 |
| Processing method for wafer and processing apparatus therefor Grant 7,858,530 - Kajiyama , et al. December 28, 2 | 2010-12-28 |
| Wafer processing method Grant 7,858,496 - Kajiyama , et al. December 28, 2 | 2010-12-28 |
| Optical Device Wafer Processing Method App 20100267219 - Kajiyama; Keiichi | 2010-10-21 |
| Wafer processing method Grant 7,816,264 - Kajiyama , et al. October 19, 2 | 2010-10-19 |
| Processing method for wafer Grant 7,718,511 - Kajiyama , et al. May 18, 2 | 2010-05-18 |
| Grinding method for wafer Grant 7,677,955 - Kajiyama , et al. March 16, 2 | 2010-03-16 |
| Wafer Processing Method App 20100055877 - Kajiyama; Keiichi ; et al. | 2010-03-04 |
| Wafer processing method Grant 7,629,230 - Sekiya , et al. December 8, 2 | 2009-12-08 |
| Wafer processing method Grant 7,625,810 - Kajiyama , et al. December 1, 2 | 2009-12-01 |
| Method Of Grinding Wafer App 20090186562 - Kajiyama; Keiichi ; et al. | 2009-07-23 |
| Wafer processing method Grant 7,527,547 - Kajiyama , et al. May 5, 2 | 2009-05-05 |
| Grinding Method For Wafer App 20090098808 - Kajiyama; Keiichi ; et al. | 2009-04-16 |
| Wafer processing method App 20090042368 - Sekiya; Kazuma ; et al. | 2009-02-12 |
| Wafer Processing Method App 20090017623 - Kajiyama; Keiichi ; et al. | 2009-01-15 |
| Wafer processing method App 20070264912 - Kajiyama; Keiichi ; et al. | 2007-11-15 |
| Processing method for wafer App 20070231929 - Kajiyama; Keiichi ; et al. | 2007-10-04 |
| Processing method for wafer and processing apparatus therefor App 20070227655 - Kajiyama; Keiichi ; et al. | 2007-10-04 |
| Wafer processing method App 20060292826 - Kajiyama; Keiichi ; et al. | 2006-12-28 |
| Semiconductor wafer processing method and processing apparatus App 20060094210 - Kajiyama; Keiichi | 2006-05-04 |
| Process for manufacturing a semiconductor chip Grant 6,939,785 - Kajiyama , et al. September 6, 2 | 2005-09-06 |
| Semiconductor wafer processing method and processing apparatus App 20050054274 - Kajiyama, Keiichi | 2005-03-10 |
| Process for manufacturing a semiconductor chip App 20040266138 - Kajiyama, Keiichi ; et al. | 2004-12-30 |
| Electrodeposited grinding tool Grant 4,547,998 - Kajiyama October 22, 1 | 1985-10-22 |
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