Kajiwara; Ryoichi
Patent Applications and Registrations
Patent applications and USPTO patent grants for Kajiwara; Ryoichi.The latest application filed is for "metal-resin composite, method for producing the same, busbar, module case, and resinous connector part".
Company Profile
0.37.32
- Kajiwara; Ryoichi - Tokyo JP
- Kajiwara; Ryoichi - Hitachi JP
- KAJIWARA; Ryoichi - Chiyoda-ku Tokyo
- Kajiwara; Ryoichi - Mito JP
- KAJIWARA; Ryoichi - Hitachi-shi JP
Patent Activity
| Patent | Date |
|---|---|
| Vehicle-mounted electronic module Grant 9,736,952 - Kajiwara , et al. August 15, 2 | 2017-08-15 |
| Metal-resin Composite, Method For Producing The Same, Busbar, Module Case, And Resinous Connector Part App 20160010213 - Kajiwara; Ryoichi ; et al. | 2016-01-14 |
| Vehicle-Mounted Electronic Module App 20150366086 - KAJIWARA; Ryoichi ; et al. | 2015-12-17 |
| Metal-resin composite, method for producing the same, busbar, module case, and resinous connector part Grant 9,209,044 - Kajiwara , et al. December 8, 2 | 2015-12-08 |
| Semiconductor device and method of manufacturing the same Grant 9,177,833 - Nakajo , et al. November 3, 2 | 2015-11-03 |
| Wiring material and semiconductor module using the same Grant 8,975,747 - Ando , et al. March 10, 2 | 2015-03-10 |
| Semiconductor Device And Manufacturing Method Of The Same App 20140264383 - KAJIWARA; Ryoichi ; et al. | 2014-09-18 |
| Mosfet package Grant 8,816,411 - Kajiwara , et al. August 26, 2 | 2014-08-26 |
| Wiring Material And Semiconductor Module Using The Same App 20140191399 - Ando; Takashi ; et al. | 2014-07-10 |
| Semiconductor apparatus, manufacturing method of semiconductor apparatus, and joint material Grant 8,643,185 - Kajiwara , et al. February 4, 2 | 2014-02-04 |
| Enameled insulated wire and manufacturing method thereof Grant 8,629,352 - Ando , et al. January 14, 2 | 2014-01-14 |
| Semiconductor Device App 20130264696 - KAJIWARA; Ryoichi ; et al. | 2013-10-10 |
| Semiconductor Device And Method Of Manufacturing The Same App 20130228907 - NAKAJO; Takuya ; et al. | 2013-09-05 |
| Semiconductor device and method of manufacturing the same Grant 8,492,202 - Kajiwara , et al. July 23, 2 | 2013-07-23 |
| Mosfet package Grant 8,455,986 - Kajiwara , et al. June 4, 2 | 2013-06-04 |
| Semiconductor Device And Method Of Manufacturing The Same App 20130071971 - KAJIWARA; Ryoichi ; et al. | 2013-03-21 |
| Fabrication method for resin-encapsulated semiconductor device Grant 8,313,983 - Kajiwara , et al. November 20, 2 | 2012-11-20 |
| Semiconductor device and method of manufacturing the same Grant 8,314,484 - Kajiwara , et al. November 20, 2 | 2012-11-20 |
| Sintering silver paste material and method for bonding semiconductor chip Grant 8,303,854 - Kajiwara , et al. November 6, 2 | 2012-11-06 |
| Semiconductor Device App 20120217556 - Kajiwara; Ryoichi ; et al. | 2012-08-30 |
| Metal-resin Composite, Method For Producing The Same, Busbar, Module Case, And Resinous Connector Part App 20120141818 - KAJIWARA; Ryoichi ; et al. | 2012-06-07 |
| Semiconductor device Grant 8,183,607 - Kajiwara , et al. May 22, 2 | 2012-05-22 |
| Semiconductor Device App 20110298020 - KAJIWARA; Ryoichi ; et al. | 2011-12-08 |
| Sintering Silver Paste Material And Method For Bonding Semiconductor Chip App 20110290863 - KAJIWARA; Ryoichi ; et al. | 2011-12-01 |
| Fabrication Method For Resin-encapsulated Semiconductor Device App 20110223720 - Kajiwara; Ryoichi ; et al. | 2011-09-15 |
| MOSFET package Grant 7,985,991 - Kajiwara , et al. July 26, 2 | 2011-07-26 |
| Metal-resin-boned structured body and resin-encapsulated semiconductor device, and fabrication method for them Grant 7,964,975 - Kajiwara , et al. June 21, 2 | 2011-06-21 |
| Enameled Insulated Wire And Manufanturing Method Thereof App 20110024156 - Ando; Yoshiyuki ; et al. | 2011-02-03 |
| High-temperature solder, high-temperature solder paste and power semiconductor using same Grant 7,879,455 - Kajiwara , et al. February 1, 2 | 2011-02-01 |
| Semiconductor apparatus and manufacturing method of semiconductor apparatus Grant 7,816,780 - Kajiwara , et al. October 19, 2 | 2010-10-19 |
| Semiconductor Device And Method Of Manufacturing The Same App 20100187678 - KAJIWARA; Ryoichi ; et al. | 2010-07-29 |
| Power semiconductor module Grant 7,608,917 - Kajiwara , et al. October 27, 2 | 2009-10-27 |
| Metal-resin-boned structured body and resin-encapsulated semiconductor device, and fabrication method for them App 20090197375 - Kajiwara; Ryoichi ; et al. | 2009-08-06 |
| Semiconductor Apparatus, Manufacturing Method Of Semiconductor Apparatus, And Joint Material App 20090096100 - KAJIWARA; Ryoichi ; et al. | 2009-04-16 |
| Semiconductor Device App 20080169537 - KAJIWARA; Ryoichi ; et al. | 2008-07-17 |
| MOSFET package Grant 7,400,002 - Kajiwara , et al. July 15, 2 | 2008-07-15 |
| MOSFET package Grant 7,394,146 - Kajiwara , et al. July 1, 2 | 2008-07-01 |
| Semiconductor apparatus and manufacturing method of semiconductor apparatus App 20080145607 - Kajiwara; Ryoichi ; et al. | 2008-06-19 |
| MOSFET package Grant 7,342,267 - Kajiwara , et al. March 11, 2 | 2008-03-11 |
| MOSFET package Grant 7,332,757 - Kajiwara , et al. February 19, 2 | 2008-02-19 |
| Power Semiconductor Module App 20070267739 - Kajiwara; Ryoichi ; et al. | 2007-11-22 |
| High-temperature solder, high-temperature solder paste and power semiconductor device using same App 20070125449 - Kajiwara; Ryoichi ; et al. | 2007-06-07 |
| Semiconductor device App 20070040250 - Kajiwara; Ryoichi ; et al. | 2007-02-22 |
| Semiconductor device App 20070040248 - Kajiwara; Ryoichi ; et al. | 2007-02-22 |
| Semiconductor device App 20070040249 - Kajiwara; Ryoichi ; et al. | 2007-02-22 |
| Semiconductor device App 20070029540 - Kajiwara; Ryoichi ; et al. | 2007-02-08 |
| Semiconductor device App 20060197200 - Kajiwara; Ryoichi ; et al. | 2006-09-07 |
| Semiconductor device App 20060197196 - Kajiwara; Ryoichi ; et al. | 2006-09-07 |
| Semiconductor device App 20040217474 - Kajiwara, Ryoichi ; et al. | 2004-11-04 |
| Flip chip assembly structure for semiconductor device and method of assembling therefor Grant 6,798,072 - Kajiwara , et al. September 28, 2 | 2004-09-28 |
| Semiconductor device and manufacturing method thereof Grant 6,784,554 - Kajiwara , et al. August 31, 2 | 2004-08-31 |
| Semiconductor device Grant 6,774,466 - Kajiwara , et al. August 10, 2 | 2004-08-10 |
| Semiconductor device App 20040150082 - Kajiwara, Ryoichi ; et al. | 2004-08-05 |
| Semiconductor device and manufacturing method thereof App 20030127747 - Kajiwara, Ryoichi ; et al. | 2003-07-10 |
| Method of manufacturing a semiconductor package by attaching a lead frame to a semiconductor chip via projecting electrodes and an insulating sheet of resin material Grant 6,569,764 - Hirashima , et al. May 27, 2 | 2003-05-27 |
| Semiconductor package and flip chip bonding method therein App 20030001286 - Kajiwara, Ryoichi ; et al. | 2003-01-02 |
| Flip chip assembly structure for semiconductor device and method of assembling therefor App 20020056906 - Kajiwara, Ryoichi ; et al. | 2002-05-16 |
| Ultrasonic bonding method and ultrasonic bonding apparatus Grant 5,884,835 - Kajiwara , et al. March 23, 1 | 1999-03-23 |
| Ultrasonic bonding apparatus and quality monitoring method Grant 5,431,324 - Kajiwara , et al. July 11, 1 | 1995-07-11 |
| Bonding apparatus and testing apparatus of a bonded portion Grant 5,323,952 - Kato , et al. June 28, 1 | 1994-06-28 |
| Semiconductor module and cooling device of the same Grant 4,996,589 - Kajiwara , et al. February 26, 1 | 1991-02-26 |
| Integrated circuit device Grant 4,809,058 - Funamoto , et al. February 28, 1 | 1989-02-28 |
| Sealed-type liquid cooling device with expandable bellow for semiconductor chips Grant 4,740,866 - Kajiwara , et al. April 26, 1 | 1988-04-26 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.
| 