KAJINO; Hidetada
Patent Applications and Registrations
Patent applications and USPTO patent grants for KAJINO; Hidetada.The latest application filed is for "electronic component module provided with substrate on which electronic components are mounted and heat sink and manufacturing m".
- KAJINO; Hidetada - Kariya-city Aichi-pref.
- Kajino; Hidetada - Nagoya JP
- Kajino; Hidetada - Nagoya-city JP
| Patent | Date |
|---|---|
| Electronic Component Module Provided With Substrate On Which Electronic Components Are Mounted And Heat Sink And Manufacturing M App 20200258805 - A1 | 2020-08-13 |
| Radiation heater apparatus Grant 9,769,879 - Ota , et al. September 19, 2 | 2017-09-19 |
| Radiation Heater Apparatus App 20150110477 - Ota; Koji ; et al. | 2015-04-23 |
| Multilayer board Grant 8,963,017 - Masuda , et al. February 24, 2 | 2015-02-24 |
| Multilayer Board App 20130048345 - MASUDA; Gentaro ; et al. | 2013-02-28 |
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