Kajinami; Masato

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kajinami; Masato.The latest application filed is for "apparatus for manufacturing semiconductor device and method of manufacturing semiconductor device".

Company Profile

5.7.10

Kajinami; Masato - Yokohama JP
KAJINAMI; Masato - Yokohama city JP
KAJINAMI; Masato - Yokohama-shi JP
Kajinami; Masato - Kanagawa JP
Kajinami; Masato - Tokyo JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Apparatus For Manufacturing Semiconductor Device And Method Of Manufacturing Semiconductor Device App 20220216077 - Nagatomo; Daisuke ; et al.	2022-07-07
Wafer Bonding Apparatus App 20220157633 - KAJINAMI; Masato ; et al.	2022-05-19
Semiconductor Manufacturing Apparatus And Chip Handling Method App 20220139755 - TAKADA; Naoyuki ; et al.	2022-05-05
Lighting device and inspection apparatus having the same Grant 11,314,073 - Hidaka , et al. April 26, 2	2022-04-26
Wafer bonding method, method for manufacturing semiconductor device, and apparatus therefor Grant 10,847,369 - Ueyama , et al. November 24, 2	2020-11-24
Water measurement apparatus Grant 10,823,682 - Sugiura , et al. November 3, 2	2020-11-03
Water Measurement Apparatus App 20200217805 - SUGIURA; Takamasa ; et al.	2020-07-09
Wafer Bonding Method, Method For Manufacturing Semiconductor Device, And Apparatus Therefor App 20200209164 - UEYAMA; Shinji ; et al.	2020-07-02
Lighting Device And Inspection Apparatus Having The Same App 20200132977 - HIDAKA; YASUHIRO ; et al.	2020-04-30
Method of testing an object and apparatus for performing the same Grant 10,444,162 - Ueyama , et al. Oc	2019-10-15
Method Of Testing An Object And Apparatus For Performing The Same App 20180284032 - UEYAMA; SHINJI ; et al.	2018-10-04
Fluid pressure actuator Grant 9,726,204 - Kajinami , et al. August 8, 2	2017-08-08
Semiconductor manufacturing apparatuses comprising bonding heads Grant 9,508,577 - Lee , et al. November 29, 2	2016-11-29
Semiconductor chip bonding apparatus and method of forming semiconductor device using the same Grant 9,082,885 - Yukimori , et al. July 14, 2	2015-07-14
Fluid Pressure Actuator App 20150159681 - KAJINAMI; Masato ; et al.	2015-06-11
Semiconductor Manufacturing Apparatuses And Methods Thereof App 20150155210 - LEE; Byung Joon ; et al.	2015-06-04
Semiconductor Chip Bonding Apparatus And Method Of Forming Semiconductor Device Using The Same App 20150024551 - YUKIMORI; Yoshiaki ; et al.	2015-01-22

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.