Kajikawa; Yasuhiro
Patent Applications and Registrations
Patent applications and USPTO patent grants for Kajikawa; Yasuhiro.The latest application filed is for "flux composition, solder paste, solder joint and solder joining method".
- Kajikawa; Yasuhiro - Tochigi JP
| Patent | Date |
|---|---|
| Flux composition, solder paste, solder joint and solder joining method Grant 11,407,068 - Kajikawa , et al. August 9, 2 | 2022-08-09 |
| Flux and solder paste Grant 11,179,813 - Kajikawa , et al. November 23, 2 | 2021-11-23 |
| Flux Composition, Solder Paste, Solder Joint and Solder Joining Method App 20210245306 - Kajikawa; Yasuhiro ; et al. | 2021-08-12 |
| Flux and Solder Paste App 20210069837 - Kajikawa; Yasuhiro ; et al. | 2021-03-11 |
| Flux and Solder Paste App 20200047291 - Shiratori; Masato ; et al. | 2020-02-13 |
| Flux with dibasic acid mixture Grant 10,357,852 - Kajikawa , et al. July 23, 2 | 2019-07-23 |
| Flux App 20190091809 - Kawasaki; Hiroyoshi ; et al. | 2019-03-28 |
| Flux App 20180257182 - Kajikawa; Yasuhiro ; et al. | 2018-09-13 |
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