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Patent applications and USPTO patent grants for Kajihara; Kazuki.The latest application filed is for "wiring substrate and method for manufacturing same".
Patent | Date |
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Printed wiring board and method for manufacturing printed wiring board Grant 10,398,038 - Kajihara , et al. A | 2019-08-27 |
Interposer and method for manufacturing interposer Grant 10,262,930 - Kajihara | 2019-04-16 |
Wiring substrate and method for manufacturing same Grant 10,051,740 - Kajihara , et al. August 14, 2 | 2018-08-14 |
Wiring Substrate And Method For Manufacturing Same App 20180146554 - Kajihara; Kazuki ;   et al. | 2018-05-24 |
Printed Wiring Board And Method For Manufacturing Printed Wiring Board App 20180116057 - KAJIHARA; Kazuki ;   et al. | 2018-04-26 |
Interposer And Method For Manufacturing Interposer App 20170309558 - KAJIHARA; Kazuki | 2017-10-26 |
Printed wiring board Grant 9,668,361 - Kajihara May 30, 2 | 2017-05-30 |
Printed Wiring Board And Semiconductor Package App 20170053878 - KAJIHARA; Kazuki ;   et al. | 2017-02-23 |
Printed Wiring Board, Semiconductor Package, And Method For Manufacturing Printed Wiring Board App 20170033036 - KAJIHARA; Kazuki ;   et al. | 2017-02-02 |
Printed wiring board Grant 9,313,901 - Kajihara , et al. April 12, 2 | 2016-04-12 |
Printed Wiring Board App 20150034378 - KAJIHARA; Kazuki ;   et al. | 2015-02-05 |
Printed Wiring Board App 20140338965 - KAJIHARA; Kazuki | 2014-11-20 |
Printed Wiring Board And Method For Manufacturing Printed Wiring Board App 20140060904 - KAJIHARA; Kazuki | 2014-03-06 |
Printed Wiring Board And Method For Manufacturing Printed Wiring Board App 20140060905 - KAJIHARA; Kazuki | 2014-03-06 |
Printed Wiring Board And Method For Manufacturing The Same App 20130146345 - KAJIHARA; Kazuki ;   et al. | 2013-06-13 |
Printed wiring board and method for manufacturing the same Grant 8,431,833 - Kajihara April 30, 2 | 2013-04-30 |
Printed Wiring Board And Method For Manufacturing The Same App 20100163297 - KAJIHARA; Kazuki | 2010-07-01 |
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