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name:-0.12346386909485
name:-0.045739889144897
name:-0.0075168609619141
Kaji; Tetsunori Patent Filings

Kaji; Tetsunori

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kaji; Tetsunori.The latest application filed is for "plasma processing apparatus and a plasma processing method".

Company Profile
0.31.35
  • Kaji; Tetsunori - Tokuyama-shi JP
  • Kaji; Tetsunori - Tokuyama JP
  • Kaji; Tetsunori - Yamaguchi JP
  • Kaji; Tetsunori - Kudamatsu JP
  • Kaji; Tetsunori - Kokubunji JA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Plasma processing apparatus and a plasma processing method
App 20090008363 - Takahashi; Kazue ;   et al.
2009-01-08
Emission spectroscopic processing apparatus and plasma processing method using it
Grant 7,455,790 - Kaji , et al. November 25, 2
2008-11-25
Film thickness measuring method of member to be processed using emission spectroscopy and processing method of the member using the measuring method
Grant 7,411,684 - Usui , et al. August 12, 2
2008-08-12
Film Thickness Measuring Method Of Member To Be Processed Using Emission Spectroscopy And Processing Method Of The Member Using The Measuring Method
App 20070229845 - Usui; Tatehito ;   et al.
2007-10-04
Film thickness measuring method of member to be processed using emission spectroscopy and processing method of the member using the measuring method
Grant 7,230,720 - Usui , et al. June 12, 2
2007-06-12
Method and apparatus for determining endpoint of semiconductor element fabricating process
Grant 7,126,697 - Usui , et al. October 24, 2
2006-10-24
Plasma processing apparatus and a plasma processing method
App 20060157449 - Takahashi; Kazue ;   et al.
2006-07-20
Plasma processing apparatus and plasma processing method
App 20060144518 - Kaji; Tetsunori ;   et al.
2006-07-06
Method and apparatus for determining endpoint of semiconductor element fabricating process
App 20060132798 - Usui; Tatehito ;   et al.
2006-06-22
Plasma processing apparatus and a plasma processing method
Grant 7,048,869 - Takahashi , et al. May 23, 2
2006-05-23
Method and apparatus for determining endpoint of semiconductor element fabricating process and method and apparatus for processing member to be processed
Grant 7,009,715 - Usui , et al. March 7, 2
2006-03-07
Film thickness measuring method of member to be processed using emission spectroscopy and processing method of the member using the measuring method
App 20060039008 - Usui; Tatehito ;   et al.
2006-02-23
Method and apparatus for transferring substrate
Grant 6,979,168 - Uchimaki , et al. December 27, 2
2005-12-27
Film thickness measuring method of member to be processed using emission spectroscopy and processing method of the member using the measuring method
Grant 6,961,131 - Usui , et al. November 1, 2
2005-11-01
Plasma etching apparatus and plasma etching method
App 20050236109 - Masuda, Toshio ;   et al.
2005-10-27
Emission spectroscopic processing apparatus and plasma processing method using it
App 20050155952 - Kaji, Tetsunori ;   et al.
2005-07-21
Plasma processing apparatus and plasma processing method
Grant 6,902,683 - Kaji , et al. June 7, 2
2005-06-07
Method and apparatus for determining endpoint of semiconductor element fabricating process
Grant 6,903,826 - Usui , et al. June 7, 2
2005-06-07
Plasma processing method using spectroscopic processing unit
Grant 6,890,771 - Kaji , et al. May 10, 2
2005-05-10
Plasma processing apparatus
App 20050082006 - Kaji, Tetsunori ;   et al.
2005-04-21
Method and apparatus for determining endpoint of semiconductor element fabricating process and method and apparatus for processing member to be processed
App 20050062982 - Usui, Tatehito ;   et al.
2005-03-24
Film thickness measuring method of member to be processed using emission spectroscopy and processing method of the member using the measuring method
App 20050018207 - Usui, Tatehito ;   et al.
2005-01-27
Plasma etching apparatus and plasma etching method
Grant 6,815,365 - Masuda , et al. November 9, 2
2004-11-09
Film thickness measuring method of member to be processed using emission spectroscopy and processing method of the member using the measuring method
Grant 6,815,228 - Usui , et al. November 9, 2
2004-11-09
Plasma processing apparatus
App 20040178180 - Kaji, Tetsunori ;   et al.
2004-09-16
Method and apparatus for forming damascene structure, and damascene structure
App 20040166676 - Kaji, Tetsunori ;   et al.
2004-08-26
Method and apparatus for forming damascene structure, and damascene structure
App 20040166445 - Kaji, Tetsunori ;   et al.
2004-08-26
System and method of producing wafer
App 20040146379 - Kaji, Tetsunori ;   et al.
2004-07-29
System for producing wafers
Grant 6,758,647 - Kaji , et al. July 6, 2
2004-07-06
Emission spectroscopic processing apparatus
Grant 6,716,300 - Kaji , et al. April 6, 2
2004-04-06
Method and apparatus for forming damascene structure, and damascene structure
App 20040053498 - Kaji, Tetsunori ;   et al.
2004-03-18
Plasma processing method using spectroscopic processing unit
App 20040045933 - Kaji, Tetsunori ;   et al.
2004-03-11
Plasma etching apparatus
App 20040045675 - Masuda, Toshio ;   et al.
2004-03-11
Plasma etching apparatus and plasma etching method
App 20040016508 - Masuda, Toshio ;   et al.
2004-01-29
Plasma etching apparatus and plasma etching method
App 20040009617 - Masuda, Toshio ;   et al.
2004-01-15
Plasma etching apparatus
App 20030203640 - Masuda, Toshio ;   et al.
2003-10-30
Method and apparatus for transferring substrate
App 20030185655 - Uchimaki, Yoichi ;   et al.
2003-10-02
Etching end point judging method, etching end point judging device, and insulating film etching method using these methods
Grant 6,596,551 - Usui , et al. July 22, 2
2003-07-22
System and method of producing wafer
App 20030113189 - Kaji, Tetsunori ;   et al.
2003-06-19
Emission spectroscopic processing apparatus and plasma processing method using it
App 20030098290 - Kaji, Tetsunori ;   et al.
2003-05-29
Method and apparatus for determining endpoint of semiconductor element fabricating process and method and apparatus for processing member to be processed
App 20030043383 - Usui, Tatehito ;   et al.
2003-03-06
Etching end point judging device
App 20030036282 - Usui, Tatehito ;   et al.
2003-02-20
Plasma etching apparatus and plasma etching method
App 20030024646 - Masuda, Toshio ;   et al.
2003-02-06
Plasma processing apparatus and plasma processing method
App 20030010453 - Tanaka, Jyunichi ;   et al.
2003-01-16
Plasma Etching Apparatus And Plasma Etching Method
App 20020119670 - MASUDA, TOSHIO ;   et al.
2002-08-29
Plasma processing apparatus and plasma processing method
App 20020069971 - Kaji, Tetsunori ;   et al.
2002-06-13
Plasma etching apparatus and plasma etching method
App 20020043338 - Masuda, Toshio ;   et al.
2002-04-18
Plasma etching apparatus and plasma etching method
App 20020042206 - Masuda, Toshio ;   et al.
2002-04-11
Plasma Processing Apparatus And A Plasma Processing Method
App 20020040766 - TAKAHASHI, KAZUE ;   et al.
2002-04-11
Film thickness measuring method of member to be processed using emission spectroscopy and processing method of the member using the measuring method
App 20020009814 - Usui, Tatehito ;   et al.
2002-01-24
Plasma Etching Apparatus And Plasma Etching Method
App 20020005252 - MASUDA, TOSHIO ;   et al.
2002-01-17
Plasma processing system and plasma processing method
Grant 6,245,190 - Masuda , et al. June 12, 2
2001-06-12
Plasma processing apparatus and plasma processing method
Grant 6,197,151 - Kaji , et al. March 6, 2
2001-03-06
Plasma processing apparatus and plasma processing method
Grant 6,171,438 - Masuda , et al. January 9, 2
2001-01-09
Plasma processing apparatus and plasma processing method
Grant 6,129,806 - Kaji , et al. October 10, 2
2000-10-10
Plasma processing apparatus and plasma processing method in which a part of the processing chamber is formed using a pre-fluorinated material of aluminum
Grant 5,895,586 - Kaji , et al. April 20, 1
1999-04-20
Microwave plasma processing method and apparatus
Grant 5,804,033 - Kanai , et al. September 8, 1
1998-09-08
Plasma generator with mode restricting means
Grant 5,646,489 - Kakehi , et al. July 8, 1
1997-07-08
Methods and apparatus for generating plasma, and semiconductor processing methods using mode restricted microwaves
Grant 5,433,789 - Kakehi , et al. July 18, 1
1995-07-18
Plasma process apparatus including ground electrode with protection film
Grant 5,432,315 - Kaji , et al. July 11, 1
1995-07-11
Microwave plasma processing device
Grant 5,290,993 - Kaji , et al. March 1, 1
1994-03-01
Apparatus for detecting an end point of etching
Grant 5,118,378 - Moroi , et al. June 2, 1
1992-06-02
Line progressive scanning method for liquid crystal display panel
Grant 3,973,252 - Mitomo , et al. August 3, 1
1976-08-03
Apparatus for displaying colored image
Grant 3,935,590 - Kaji , et al. January 27, 1
1976-01-27
Quick response liquid crystal display device
Grant 3,895,372 - Kaji , et al. July 15, 1
1975-07-15
Method Of Driving Liquid Cell Display Panel
Grant 3,863,221 - Kaji January 28, 1
1975-01-28

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