KAINUMA; NORIO

Patent Applications and Registrations

Patent applications and USPTO patent grants for KAINUMA; NORIO.The latest application filed is for "optical module".

Company Profile

4.38.51

KAINUMA; NORIO - Nagano JP
Kainuma; Norio - Kawasaki JP
Kainuma, Norio - Kawasaki-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Optical Module App 20210191048 - Matsumura; Takayoshi ; et al.	2021-06-24
Holding member and optical module Grant 10,718,907 - Kainuma	2020-07-21
Optical Module, Optical Communication Device, And Manufacturing Method Thereof App 20200144213 - KAINUMA; NORIO	2020-05-07
Optical Module, Optical Communication Device, And Manufacturing Method Thereof App 20200144787 - KAINUMA; NORIO	2020-05-07
Optical module Grant 10,586,770 - Matsumura , et al.	2020-03-10
Optical module Grant 10,444,450 - Matsumura , et al. Oc	2019-10-15
Holding Member And Optical Module App 20190258007 - KAINUMA; NORIO	2019-08-22
Optical Module App 20190157207 - Matsumura; Takayoshi ; et al.	2019-05-23
Optical module and method of manufacturing optical module Grant 10,261,249 - Kainuma , et al.	2019-04-16
Optical Module App 20180341075 - Matsumura; Takayoshi ; et al.	2018-11-29
Optical module and method of manufacturing optical module Grant 10,103,510 - Kainuma , et al. October 16, 2	2018-10-16
Laminated semiconductor device and manufacturing method of laminated semiconductor device Grant 10,103,126 - Kira , et al. October 16, 2	2018-10-16
Optical Module App 20180217343 - Matsumura; Takayoshi ; et al.	2018-08-02
Optical Module And Method Of Manufacturing Optical Module App 20180159300 - KAINUMA; NORIO ; et al.	2018-06-07
Optical Module And Method Of Manufacturing Optical Module App 20180156972 - KAINUMA; NORIO ; et al.	2018-06-07
Semiconductor device mounting method Grant 9,793,221 - Kira , et al. October 17, 2	2017-10-17
Optical module, method for manufacturing optical module, and optical transceiver Grant 9,719,848 - Kainuma , et al. August 1, 2	2017-08-01
Laminated Semiconductor Device And Manufacturing Method Of Laminated Semiconductor Device App 20170207199 - Kira; Hidehiko ; et al.	2017-07-20
Optical waveguide sheet, optical unit, and method for manufacturing the same Grant 9,547,126 - Iijima , et al. January 17, 2	2017-01-17
Heating header of semiconductor mounting apparatus and bonding method for semiconductor Grant 9,536,857 - Kira , et al. January 3, 2	2017-01-03
Semiconductor Device Mounting Method App 20160284566 - Kira; Hidehiko ; et al.	2016-09-29
Fabrication method for optical connector and optical connector Grant 9,453,973 - Kubota , et al. September 27, 2	2016-09-27
Laminated Chip And Laminated Chip Manufacturing Method App 20160211243 - SUWADA; MAKOTO ; et al.	2016-07-21
Optical Waveguide Sheet, Optical Unit, And Method For Manufacturing The Same App 20150362675 - IIJIMA; Sanae ; et al.	2015-12-17
Fabrication Method For Optical Connector And Optical Connector App 20150346434 - Kubota; Takashi ; et al.	2015-12-03
Optical Module, Method For Manufacturing Optical Module, And Optical Transceiver App 20150212285 - Kainuma; Norio ; et al.	2015-07-30
Semiconductor device manufacturing method and semiconductor device Grant 9,013,048 - Kainuma April 21, 2	2015-04-21
Semiconductor Device Manufacturing Method And Semiconductor Device App 20140339713 - KAINUMA; Norio	2014-11-20
Rfid Tag App 20140103117 - TAKEUCHI; Shuichi ; et al.	2014-04-17
Method of forming electrode connecting portion Grant 8,076,233 - Ishikawa , et al. December 13, 2	2011-12-13
Method of manufacturing an electronic component and an electronic device Grant 7,833,831 - Kainuma , et al. November 16, 2	2010-11-16
Method of mounting an electronic component and mounting apparatus Grant 7,828,193 - Ishikawa , et al. November 9, 2	2010-11-09
Method of mounting a semiconductor chip Grant 7,712,650 - Matsumura , et al. May 11, 2	2010-05-11
Method Of Forming Electrode Connecting Portion App 20100075493 - Ishikawa; Kuniko ; et al.	2010-03-25
Method of manufacturing a semiconductor device Grant 7,566,586 - Kainuma , et al. July 28, 2	2009-07-28
Slider tester App 20090146652 - Kainuma; Norio ; et al.	2009-06-11
Slider tester App 20090146653 - Kainuma; Norio ; et al.	2009-06-11
Structure of mounting electronic component Grant 7,514,788 - Kobae , et al. April 7, 2	2009-04-07
Method for mounting electronic element on a circuit board Grant 7,507,654 - Kobae , et al. March 24, 2	2009-03-24
Slider tester Grant 7,471,081 - Kainuma , et al. December 30, 2	2008-12-30
Method of ultrasonic mounting and ultrasonic mounting apparatus using the same App 20080265003 - Kainuma; Norio ; et al.	2008-10-30
Method of ultrasonic mounting and ultrasonic mounting apparatus using the same App 20080265002 - Kainuma; Norio ; et al.	2008-10-30
Semiconductor chip element, semiconductor chip element mounting structure, semiconductor chip element mounting device and mounting method Grant 7,436,062 - Kainuma , et al. October 14, 2	2008-10-14
Method of ultrasonic mounting and ultrasonic mounting apparatus using the same Grant 7,424,966 - Kainuma , et al. September 16, 2	2008-09-16
Method of mounting an electronic component and mounting apparatus App 20080203138 - Ishikawa; Kuniko ; et al.	2008-08-28
Method Of Manufacturing An Electronic Component And An Electronic Device App 20080206587 - Kainuma; Norio ; et al.	2008-08-28
Method for flip-chip mounting utilizing a delay curing-type adhesive with two-part hardening resin Grant 7,416,921 - Kainuma , et al. August 26, 2	2008-08-26
Method of mounting semiconductor chip Grant 7,394,163 - Baba , et al. July 1, 2	2008-07-01
Structure of mounting electronic component Grant 7,355,285 - Kobae , et al. April 8, 2	2008-04-08
Method of mounting electronic component Grant 7,350,685 - Matsumura , et al. April 1, 2	2008-04-01
Head assembly, disk unit, and bonding method and apparatus Grant 7,347,347 - Kira , et al. March 25, 2	2008-03-25
Structure of mounting electronic component and method of mounting the same App 20080061435 - Kobae; Kenji ; et al.	2008-03-13
Method of manufacturing a semiconductor device App 20070264752 - Kainuma; Norio ; et al.	2007-11-15
Method of ultrasonic-mounting electronic component and ultrasonic mounting machine Grant 7,208,059 - Matsumura , et al. April 24, 2	2007-04-24
Method of mounting a semiconductor chip App 20070080190 - Matsumura; Takayoshi ; et al.	2007-04-12
Magnetic head tester Grant 7,196,512 - Kainuma , et al. March 27, 2	2007-03-27
Structure of mounting electronic component and method of mounting the same App 20070015311 - Kobae; Kenji ; et al.	2007-01-18
Slider tester App 20060172575 - Kainuma; Norio ; et al.	2006-08-03
Method of flip-chip mounting a semiconductor chip and mounting apparatus using the same App 20060099809 - Kainuma; Norio ; et al.	2006-05-11
Method of ultrasonic mounting and ultrasonic mounting apparatus using the same App 20060097028 - Kainuma; Norio ; et al.	2006-05-11
Method of flip-chip bonding App 20060097029 - Kainuma; Norio ; et al.	2006-05-11
Method of ultrasonic-mounting electronic component and ultrasonic mounting machine App 20060090833 - Matsumura; Takayoshi ; et al.	2006-05-04
Method of mounting electronic component App 20060091185 - Matsumura; Takayoshi ; et al.	2006-05-04
Structure of mounting electronic component and method of mounting the same App 20060094157 - Kobae; Kenji ; et al.	2006-05-04
Semiconductor device App 20060030076 - Kobayashi; Hiroshi ; et al.	2006-02-09
Slider tester Grant 6,943,971 - Kainuma , et al. September 13, 2	2005-09-13
Resin coating method and apparatus App 20050196529 - Baba, Shunji ; et al.	2005-09-08
Resin coating method and apparatus App 20050196703 - Baba, Shunji ; et al.	2005-09-08
Resin coating method and apparatus App 20050196704 - Baba, Shunji ; et al.	2005-09-08
Head assembly having integrated circuit chip covered by layer which prevents foreign particle generation Grant 6,885,522 - Kira , et al. April 26, 2	2005-04-26
Head assembly, disk unit, and bonding method and apparatus App 20050057856 - Kira, Hidehiko ; et al.	2005-03-17
Method of mounting electronic part and flux-fill App 20050001014 - Takeuchi, Shuichi ; et al.	2005-01-06
Semiconductor device App 20040251543 - Kobayashi, Hiroshi ; et al.	2004-12-16
Resin coating method and apparatus App 20040213894 - Baba, Shunji ; et al.	2004-10-28
Mounting method of semiconductor device Grant 6,787,925 - Tsunoi , et al. September 7, 2	2004-09-07
Resin coating method Grant 6,770,319 - Baba , et al. August 3, 2	2004-08-03
Magnetic head tester App 20040104722 - Kainuma, Norio ; et al.	2004-06-03
Method of mounting chip onto printed circuit board in shortened working time Grant 6,716,665 - Baba , et al. April 6, 2	2004-04-06
Slider tester App 20040036994 - Kainuma, Norio ; et al.	2004-02-26
Method of underfilling semiconductor device Grant 6,582,993 - Baba , et al. June 24, 2	2003-06-24
Semiconductor chip element, semiconductor chip element mounting structure, semiconductor chip element mounting device and mounting method App 20030057552 - Kainuma, Norio ; et al.	2003-03-27
Head assembly of a disk apparatus having a head IC chip mounted on a suspension by ultrasonic bonding App 20020195476 - Baba, Shunji ; et al.	2002-12-26
Semiconductor chip element, semiconductor chip element mounting structure, semiconductor chip element mounting device and mounting method Grant 6,483,190 - Kainuma , et al. November 19, 2	2002-11-19
Method of mounting semiconductor chip App 20020164837 - Baba, Shunji ; et al.	2002-11-07
Mounting method of semiconductor device Grant 6,458,237 - Tsunoi , et al. October 1, 2	2002-10-01
Resin coating method and apparatus App 20020037363 - Baba, Shunji ; et al.	2002-03-28
Method of mounting chip onto printed circuit board in shortened working time App 20010040298 - Baba, Shunji ; et al.	2001-11-15
Mounting method of semiconductor device App 20010011774 - Tsunoi, Kazuhisa ; et al.	2001-08-09
Method of producing a multichip package module in which rough-pitch and fine-pitch chips are mounted on a board Grant 6,240,634 - Kira , et al. June 5, 2	2001-06-05