KAIMORI; Shingo

Patent Applications and Registrations

Patent applications and USPTO patent grants for KAIMORI; Shingo.The latest application filed is for "method for manufacturing dielectric sheet, method for manufacturing substrate for high-frequency printed wiring board, dielectric sheet, and substrate for high-frequency printed wiring board".

Company Profile

3.8.26

KAIMORI; Shingo - Osaka JP
KAIMORI; Shingo - Osaka-shi Osaka

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method For Manufacturing Dielectric Sheet, Method For Manufacturing Substrate For High-frequency Printed Wiring Board, Dielectric Sheet, And Substrate For High-frequency Printed Wiring Board App 20220272838 - KAIMORI; Shingo ; et al.	2022-08-25
Substrate for high-frequency printed wiring board Grant 10,485,102 - Kaimori , et al. Nov	2019-11-19
Substrate For High-frequency Printed Wiring Board App 20190215957 - KAIMORI; Shingo ; et al.	2019-07-11
Adhesive composition for printed wiring boards, bonding film, coverlay, copper-clad laminate and printed wiring board Grant 10,244,626 - Yonezawa , et al.	2019-03-26
Adhesive Composition For Printed Wiring Boards, Bonding Film, Coverlay, Copper-clad Laminate And Printed Wiring Board App 20160198570 - YONEZAWA; Takayuki ; et al.	2016-07-07
Piezoelectric element including fluororesin film Grant 9,343,653 - Kaimori , et al. May 17, 2	2016-05-17
Metal-resin Composite Body, Wiring Material, And Method For Producing Metal-resin Composite Body App 20160107376 - NAKAJIMA; Shingo ; et al.	2016-04-21
Adhesive resin compositions, and laminates and flexible printed wiring boards using same Grant 9,181,464 - Kaimori , et al. November 10, 2	2015-11-10
Piezoelectric Element Including Fluororesin Film App 20150015120 - Kaimori; Shingo ; et al.	2015-01-15
Biosensor measurement machine, biosensor measurement system and biosensor measurement method Grant 8,282,813 - Kaimori , et al. October 9, 2	2012-10-09
Adhesive Resin Composition, And Laminate And Flexible Printed Wiring Board Using The Same App 20120048598 - Kaimori; Shingo ; et al.	2012-03-01
Adhesive Resin Composition, And Laminate And Flexible Printed Wiring Board Using The Same App 20120043118 - Kaimori; Shingo ; et al.	2012-02-23
Adhesive Resin Compositions, And Laminates And Flexible Printed Wiring Boards Using Same App 20110305883 - Kaimori; Shingo ; et al.	2011-12-15
Adhesive Resin Compositions, And Laminates And Flexible Printed Wiring Boards Using Same App 20110303439 - Kaimori; Shingo ; et al.	2011-12-15
Biosensor chip, biosensor system and measuring instrument thereof Grant 8,012,321 - Ichino , et al. September 6, 2	2011-09-06
Sensor Device App 20100228149 - Fujimura; Tsuyoshi ; et al.	2010-09-09
Biosensor Cartridge, Biosensor Device, Sample Collecting Method, Manufacturing Method Of Biosensor Cartridge, And Needle Integral Sensor App 20100069792 - Fujimura; Tsuyoshi ; et al.	2010-03-18
Biosensor Cartridge, Method Of Using Biosensor Cartridge, Biosensor Device, And Needle Integral Sensor App 20100004559 - Fujimura; Tsuyoshi ; et al.	2010-01-07
Biosensor Chip App 20090299225 - Kitamura; Takahiko ; et al.	2009-12-03
Sensor Chip and Sensor Chip Production Method App 20090257917 - Nakamura; Hideaki ; et al.	2009-10-15
Biosensor Chip, Biosensor System And Measuring Instrument Thereof App 20090255810 - Ichino; Moriyasu ; et al.	2009-10-15
Biosensor Measurement Machine , Biosensor Measurement System and Biosensor Measurement Method App 20090152127 - Kaimori; Shingo ; et al.	2009-06-18
Sensor Chip and Sensor System App 20090123335 - Nakamura; Hideaki ; et al.	2009-05-14
Method for Fabricating Sensor Chip, and Sensor Chip App 20090050986 - Kaimori; Shingo ; et al.	2009-02-26
Sensor Chip App 20090053105 - Hosoya; Toshifumi ; et al.	2009-02-26
Biosensor Chip and Biosensor Chip Production Method App 20090020420 - Kitamura; Takahiko ; et al.	2009-01-22
Sensor Chip and Manufacturing Method Thereof App 20080248457 - Hosoya; Toshifumi ; et al.	2008-10-09
Coupled Member Made of a Plurality of Sensor Chips and Manufacturing Method Thereof App 20080129280 - Kaimori; Shingo ; et al.	2008-06-05
Bonding Wire and Integrated Circuit Device Using the Same App 20070235887 - Kaimori; Shingo ; et al.	2007-10-11
Bonding wire and an integrated circuit device using the same App 20050151253 - Nonaka, Tsuyoshi ; et al.	2005-07-14
Bonding wire App 20040245320 - Fukagaya, Mesato ; et al.	2004-12-09
Method for etching laminated assembly including polyimide layer Grant 6,783,921 - Kaimori , et al. August 31, 2	2004-08-31
Method for etching laminated assembly including polyimide layer App 20030054293 - Kaimori, Shingo ; et al.	2003-03-20

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