KAGA, INC.
Patent Applications and Registrations
Patent applications and USPTO patent grants for KAGA, INC..The latest application filed is for "heat sink and electronic component package".
- KAGA, INC. - Tokyo JP
- KAGA, INC. - Chuo-ku, Tokyo N/A JP
- KAGA, INC. - Kanagawa JP
- KAGA, INC. - Yokohama-shi, Kanagawa N/A JP
- KAGA, INC. - Yokohama-shi JP
Trademarks
| Patent | Date |
|---|---|
| Heat Sink And Electronic Component Package App 20220167532 - NAKAMURA; Yousuke ; et al. | 2022-05-26 |
| Heat sink and electronic component package Grant 10,499,537 - Nozaki , et al. De | 2019-12-03 |
| Heat Sink And Electronic Component Package App 20190335614 - NOZAKI; Masaaki ; et al. | 2019-10-31 |
| Forging device and forging method Grant 9,522,422 - Kaneko December 20, 2 | 2016-12-20 |
| Lid body portion and electronic device package using the lid body portion and electronic device Grant 9,370,104 - Satoh , et al. June 14, 2 | 2016-06-14 |
| Forging Device And Forging Method App 20160074929 - KANEKO; Shuhei | 2016-03-17 |
| Lid Body Portion And Electronic Device Package Using The Lid Body Portion And Electronic Device App 20150022988 - SATOH; Masayuki ; et al. | 2015-01-22 |
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