Kabushiki Kaisha Shinkawa
Patent Applications and Registrations
Patent applications and USPTO patent grants for Kabushiki Kaisha Shinkawa.The latest application filed is for "semiconductor device".
Company Profile
0.163.133
- Kabushiki Kaisha Shinkawa - Tokyo JP
- Kabushiki Kaisha Shinkawa -
Patent Activity
| Patent | Date |
|---|---|
| Wire bonding method Grant 8,678,266 - Mii , et al. March 25, 2 | 2014-03-25 |
| Ultrasonic horn Grant 8,511,534 - Kakutani , et al. August 20, 2 | 2013-08-20 |
| Ultrasonic horn Grant 8,434,656 - Kakutani , et al. May 7, 2 | 2013-05-07 |
| Wire cleaning guide Grant 8,283,593 - Horino , et al. October 9, 2 | 2012-10-09 |
| Semiconductor device Grant 8,232,656 - Mii , et al. July 31, 2 | 2012-07-31 |
| Ultrasonic horn Grant 8,152,043 - Kakutani , et al. April 10, 2 | 2012-04-10 |
| Wire bonding method and semiconductor device Grant 8,143,155 - Mii , et al. March 27, 2 | 2012-03-27 |
| Ultrasonic horn Grant 8,052,026 - Kakutani , et al. November 8, 2 | 2011-11-08 |
| Wire bonding method Grant 7,934,634 - Mii , et al. May 3, 2 | 2011-05-03 |
| Apparatus for detecting press-bonded ball at bonding portion in bonding apparatus and method for detecting press-bonded ball at bonding portion Grant 7,929,152 - Sugawara , et al. April 19, 2 | 2011-04-19 |
| Semiconductor device App 20110079904 - Mii; Tatsunari ; et al. | 2011-04-07 |
| Method of manufacturing semiconductor device Grant 7,910,472 - Mii , et al. March 22, 2 | 2011-03-22 |
| Bonding apparatus and method for cleaning tip of a bonding tool Grant 7,893,383 - Fujita February 22, 2 | 2011-02-22 |
| Wire bonding apparatus, record medium storing bonding control program, and bonding method Grant 7,857,190 - Takahashi , et al. December 28, 2 | 2010-12-28 |
| Wire bonding method and semiconductor device Grant 7,851,347 - Mii , et al. December 14, 2 | 2010-12-14 |
| Imaging device and method for a bonding apparatus Grant 7,848,022 - Hayata December 7, 2 | 2010-12-07 |
| Bonding apparatus Grant 7,842,897 - Miyahara , et al. November 30, 2 | 2010-11-30 |
| Semiconductor device and wire bonding method Grant 7,808,116 - Mii , et al. October 5, 2 | 2010-10-05 |
| Method of manufacturing semiconductor device App 20100248470 - Mii; Tatsunari ; et al. | 2010-09-30 |
| Horn attachment arm Grant 7,780,056 - Seyama August 24, 2 | 2010-08-24 |
| Wire bonding apparatus, record medium storing bonding control program, and bonding method App 20100206849 - Takahashi; Kuniyuki ; et al. | 2010-08-19 |
| Wire bonding method and semiconductor device App 20100207280 - Mii; Tatsunari ; et al. | 2010-08-19 |
| Offset measuring mechanism and offset measuring method in a bonding apparatus Grant RE41,506 - Haraguchi August 17, 2 | 2010-08-17 |
| Wire bonding method App 20100155455 - Mii; Tatsunari ; et al. | 2010-06-24 |
| Wire bonding method and semiconductor device App 20100148369 - Mii; Tatsunari ; et al. | 2010-06-17 |
| Wire bonding apparatus Grant 7,735,707 - Seyama June 15, 2 | 2010-06-15 |
| Wire bonding apparatus, record medium storing bonding control program , and bonding method App 20100133322 - Takahashi; Kuniyuki ; et al. | 2010-06-03 |
| Wire bonding apparatus, record medium storing bonding control program, and bonding method Grant 7,699,209 - Tei April 20, 2 | 2010-04-20 |
| Method for securing a curved circuit board in die bonder and recording medium containing program for securing a curved circuit board in die bonder App 20100078125 - Fujino; Noboru ; et al. | 2010-04-01 |
| Wire bonding apparatus and ball forming method App 20100078464 - Nishiura; Shinichi | 2010-04-01 |
| Die pickup method App 20100077590 - Fujisawa; Kazuhiro ; et al. | 2010-04-01 |
| Wire bonding apparatus, record medium storing bonding control program, and bonding method Grant 7,686,204 - Takahashi , et al. March 30, 2 | 2010-03-30 |
| Wire bonding method App 20100072262 - Sugawara; Kenji ; et al. | 2010-03-25 |
| Imaging device for a bonding apparatus App 20100067123 - Hayata; Shigeru | 2010-03-18 |
| Wire bonding method Grant 7,661,576 - Mii , et al. February 16, 2 | 2010-02-16 |
| Tail wire cutting method and bonding apparatus Grant 7,658,314 - Tei , et al. February 9, 2 | 2010-02-09 |
| Ball forming device in a bonding apparatus and ball forming method Grant 7,658,313 - Nishiura , et al. February 9, 2 | 2010-02-09 |
| Bonding apparatus, ball forming device in said bonding apparatus, and ball forming method using said bonding apparatus Grant 7,644,852 - Nishiura , et al. January 12, 2 | 2010-01-12 |
| Wire Bonding Method App 20090308914 - Mii; Tatsunari ; et al. | 2009-12-17 |
| Wire bonding method Grant 7,621,436 - Mii , et al. November 24, 2 | 2009-11-24 |
| Semiconductor device Grant 7,617,966 - Mii , et al. November 17, 2 | 2009-11-17 |
| Horn-holder pivot type bonding apparatus App 20090272498 - Seyama; Kohei | 2009-11-05 |
| Horn-holder pivot type bonding apparatus Grant 7,578,421 - Seyama August 25, 2 | 2009-08-25 |
| Bonding apparatus and method Grant 7,576,297 - Fujita , et al. August 18, 2 | 2009-08-18 |
| Wire bonding method App 20090194577 - Mii; Tatsunari ; et al. | 2009-08-06 |
| Wire bonding apparatus Grant 7,565,994 - Kondo July 28, 2 | 2009-07-28 |
| Imaging device and method for a bonding apparatus App 20090124028 - Hayata; Shigeru | 2009-05-14 |
| Apparatus and method for picking-up semiconductor dies App 20090101282 - Fujino; Noboru ; et al. | 2009-04-23 |
| Apparatus and method for picking-up semiconductor dies App 20090075459 - Sato; Yasushi ; et al. | 2009-03-19 |
| Imaging device and method for a bonding apparatus App 20090059361 - Hayata; Shigeru | 2009-03-05 |
| Semiconductor device and wire bonding method App 20090001608 - Mii; Tatsunari ; et al. | 2009-01-01 |
| Hydrostatic guide system App 20080304772 - Kakutani; Osamu ; et al. | 2008-12-11 |
| Semiconductor device and a wire bonding method Grant 7,458,498 - Mii , et al. December 2, 2 | 2008-12-02 |
| Apparatus for detecting press-bonded ball at bonding portion in bonding apparatus and method for detecting press-bonded ball at bonding portion App 20080259352 - Sugawara; Kenji ; et al. | 2008-10-23 |
| Horn attachment arm App 20080203136 - Seyama; Kohei | 2008-08-28 |
| Wire Cleaning Guide App 20080197168 - Horino; Masayuki ; et al. | 2008-08-21 |
| Semiconductor device and wire bonding method App 20080197510 - Mii; Tatsunari ; et al. | 2008-08-21 |
| Bonding apparatus Grant 7,405,500 - Maeda July 29, 2 | 2008-07-29 |
| Bonding arm swinging type bonding apparatus Grant 7,389,805 - Kakutani , et al. June 24, 2 | 2008-06-24 |
| Wire bonding method and apparatus Grant 7,370,785 - Takahashi May 13, 2 | 2008-05-13 |
| Wire bonding and wire bonding method App 20080093416 - Utano; Tetsuya ; et al. | 2008-04-24 |
| Guide rails for conveying band-form members Grant 7,334,754 - Sato February 26, 2 | 2008-02-26 |
| Bonding apparatus, ball forming device in said bonding apparatus, and ball forming method using said bonding apparatus App 20080035709 - Nishiura; Shinichi ; et al. | 2008-02-14 |
| Bonding program Grant 7,330,582 - Enokido , et al. February 12, 2 | 2008-02-12 |
| Bonding apparatus and method for cleaning tip of a bonding tool App 20080023028 - Fujita; Kazuo | 2008-01-31 |
| Bonding apparatus App 20080023525 - Maeda; Toru ; et al. | 2008-01-31 |
| Bonding apparatus Grant 7,324,684 - Enokido , et al. January 29, 2 | 2008-01-29 |
| Bonding pattern discrimination device Grant 7,324,683 - Enokido January 29, 2 | 2008-01-29 |
| Bonding pattern discrimination program Grant 7,321,681 - Enokido January 22, 2 | 2008-01-22 |
| Wire bonding apparatus App 20080011809 - Seyama; Kohei | 2008-01-17 |
| Ball forming device in a bonding apparatus and ball forming method App 20080000950 - Nishiura; Shinichi ; et al. | 2008-01-03 |
| Actuator and bonding apparatus Grant 7,312,541 - Haraguchi December 25, 2 | 2007-12-25 |
| Method of fixing curved circuit board and wire bonding apparatus App 20070287222 - Natsume; Ryuichi | 2007-12-13 |
| Bonding apparatus Grant 7,306,132 - Kakutani , et al. December 11, 2 | 2007-12-11 |
| Initial ball forming method for wire bonding wire and wire bonding apparatus Grant 7,299,966 - Nishiura , et al. November 27, 2 | 2007-11-27 |
| Bonding apparatus Grant 7,293,686 - Kakutani November 13, 2 | 2007-11-13 |
| Tail wire cutting method and bonding apparatus App 20070246513 - Tei; Shinsuke ; et al. | 2007-10-25 |
| Horn-holder pivot type bonding apparatus App 20070205252 - Seyama; Kohei | 2007-09-06 |
| Actuator and bonding apparatus Grant 7,265,461 - Haraguchi September 4, 2 | 2007-09-04 |
| Method for forming a stud bump App 20070187467 - Toyama; Toshihiko ; et al. | 2007-08-16 |
| Wire bonding apparatus, record medium storing bonding control program, and bonding method App 20070187138 - Takahashi; Kuniyuki ; et al. | 2007-08-16 |
| Wire bonding apparatus, record medium storing bonding control program, and bonding method App 20070187470 - Tei; Shinsuke | 2007-08-16 |
| Method for setting capillary contact position data and wire bonding apparatus using the same App 20070181651 - Takahashi; Kuniyuki ; et al. | 2007-08-09 |
| Semiconductor device App 20070182026 - Nishiura; Shinichi | 2007-08-09 |
| Bonding pattern discrimination method, bonding pattern discrimination device and bonding pattern discrimination program Grant 7,224,829 - Enokido May 29, 2 | 2007-05-29 |
| Wire bonding method App 20070108256 - Mii; Tatsunari ; et al. | 2007-05-17 |
| Bonding method, bonding apparatus and bonding program Grant 7,209,583 - Enokido , et al. April 24, 2 | 2007-04-24 |
| Ultrasonic horn App 20070080193 - Kakutani; Osamu ; et al. | 2007-04-12 |
| Die pickup apparatus, method for using the same and die pickup method App 20070082529 - Nishio; Hideji ; et al. | 2007-04-12 |
| Bonding program App 20070041632 - Enokido; Satoshi ; et al. | 2007-02-22 |
| Actuator and bonding apparatus App 20070040455 - Haraguchi; Manabu | 2007-02-22 |
| Bonding pattern discrimination device App 20070036424 - Enokido; Satoshi | 2007-02-15 |
| Bonding pattern discrimination program App 20070036423 - Enokido; Satoshi | 2007-02-15 |
| Semiconductor device App 20070034674 - Mii; Tatsunari ; et al. | 2007-02-15 |
| Bonding apparatus App 20070036425 - Enokido; Satoshi ; et al. | 2007-02-15 |
| Semiconductor Device App 20070029367 - Mii; Tatsunari | 2007-02-08 |
| Bonding apparatus and method App 20070000878 - Fujita; Kazuo ; et al. | 2007-01-04 |
| Bonding apparatus and method App 20070001320 - Maeda; Toru | 2007-01-04 |
| Wire bonding method and apparatus Grant 7,140,529 - Kondo November 28, 2 | 2006-11-28 |
| Bonding apparatus Grant 7,096,912 - Kakutani August 29, 2 | 2006-08-29 |
| Wire bonding method App 20060186177 - Mii; Tatsunari ; et al. | 2006-08-24 |
| Bonding apparatus App 20060186839 - Miyahara; Toshimichi ; et al. | 2006-08-24 |
| Wire bonding method App 20060175383 - Mii; Tatsunari ; et al. | 2006-08-10 |
| Die bonding method and apparatus Grant 7,087,457 - Ogata , et al. August 8, 2 | 2006-08-08 |
| Die pickup apparatus App 20060137828 - Fujisawa; Kazuhiro ; et al. | 2006-06-29 |
| Bump formation method and wire bonding method Grant 7,044,357 - Mii May 16, 2 | 2006-05-16 |
| Bonding apparatus and bonding external appearance inspection device Grant 7,044,355 - Haraguchi May 16, 2 | 2006-05-16 |
| Bonding apparatus with position deviation correction Grant 7,044,182 - Haraguchi May 16, 2 | 2006-05-16 |
| Wire bonding method Grant 7,025,247 - Mii , et al. April 11, 2 | 2006-04-11 |
| Bonding apparatus App 20060065372 - Maeda; Toru | 2006-03-30 |
| Wire bonding method, wire bonding apparatus and wire bonding program Grant 7,014,095 - Mochida March 21, 2 | 2006-03-21 |
| Image processing method, an image processing device and a bonding apparatus Grant 7,013,039 - Sugawara March 14, 2 | 2006-03-14 |
| Bonding apparatus App 20050274771 - Kakutani, Osamu ; et al. | 2005-12-15 |
| Bonding apparatus and bonding method Grant 6,961,457 - Sugawara November 1, 2 | 2005-11-01 |
| Wire bonding apparatus App 20050219777 - Sasakura, Kazumasa | 2005-10-06 |
| Bonding apparatus App 20050211746 - Kakutani, Osamu ; et al. | 2005-09-29 |
| Wire bonding method and apparatus Grant 6,945,446 - Hayata September 20, 2 | 2005-09-20 |
| Bump bonding apparatus and bump bonding method App 20050194422 - Takahashi, Kuniyuki ; et al. | 2005-09-08 |
| Wire bonding apparatus App 20050184128 - Kondo, Yutaka | 2005-08-25 |
| Wire bonding method and apparatus App 20050184131 - Kondo, Yutaka | 2005-08-25 |
| Actuator and bonding apparatus App 20050184600 - Haraguchi, Manabu | 2005-08-25 |
| Bonding arm swinging type bonding apparatus App 20050184127 - Kakutani, Osamu ; et al. | 2005-08-25 |
| Bonding pattern discrimination method, bonding pattern discrimination device and bonding pattern discrimination program App 20050167470 - Enokido, Satoshi | 2005-08-04 |
| Bonding method, bonding apparatus and bonding program App 20050167471 - Enokido, Satoshi ; et al. | 2005-08-04 |
| Bonding apparatus Grant 6,923,361 - Maeda August 2, 2 | 2005-08-02 |
| Image processing method, an image processing device and a bonding apparatus Grant 6,917,699 - Sugawara July 12, 2 | 2005-07-12 |
| Offset measuring mechanism and offset measuring method in a bonding apparatus Grant 6,915,827 - Haraguchi July 12, 2 | 2005-07-12 |
| Bonding apparatus and bonding external appearance inspection apparatus App 20050127136 - Haraguchi, Manabu | 2005-06-16 |
| Bonding data setting device and method Grant 6,901,305 - Kimura , et al. May 31, 2 | 2005-05-31 |
| Bonding apparatus App 20050109815 - Kakutani, Osamu | 2005-05-26 |
| Semiconductor device and wire bonding method App 20050092815 - Mii, Tatsunari | 2005-05-05 |
| Semiconductor device having bumps Grant 6,879,027 - Sato April 12, 2 | 2005-04-12 |
| Initial ball forming method for wire bonding wire and wire bonding apparatus Grant 6,874,673 - Nishiura , et al. April 5, 2 | 2005-04-05 |
| Wire bonding apparatus Grant 6,871,772 - Kyomasu , et al. March 29, 2 | 2005-03-29 |
| Wire bonding method and apparatus App 20050061849 - Takahashi, Koichi | 2005-03-24 |
| Image processing method and device Grant 6,868,176 - Sugawara March 15, 2 | 2005-03-15 |
| Bonding apparatus Grant 6,863,206 - Kyomasu , et al. March 8, 2 | 2005-03-08 |
| Die pickup method and die pickup device App 20050036884 - Takeuchi, Takashi ; et al. | 2005-02-17 |
| Ultrasonic horn for a bonding apparatus Grant 6,845,897 - Nishiura January 25, 2 | 2005-01-25 |
| Bonding apparatus App 20040261947 - Haraguchi, Manabu | 2004-12-30 |
| Semiconductor device and a wire bonding method App 20040262369 - Mii, Tatsunari ; et al. | 2004-12-30 |
| Discharge electrode for a wire bonding apparatus Grant 6,818,861 - Maeda November 16, 2 | 2004-11-16 |
| Bonding apparatus Grant 6,814,121 - Hayata , et al. November 9, 2 | 2004-11-09 |
| Bonding apparatus App 20040188026 - Kakutani, Osamu | 2004-09-30 |
| Conveying apparatus for plate-form members Grant 6,793,066 - Ushiki , et al. September 21, 2 | 2004-09-21 |
| Ball formation method and ball forming device used in a wire bonding apparatus Grant 6,784,394 - Nishiura August 31, 2 | 2004-08-31 |
| Bump formation method and wire bonding method App 20040164128 - Mii, Tatsunari | 2004-08-26 |
| Wire bonding method App 20040164127 - Mii, Tatsunari ; et al. | 2004-08-26 |
| Wire bonding apparatus Grant 6,776,324 - Morita August 17, 2 | 2004-08-17 |
| Die bonding method and apparatus App 20040157368 - Ogata, Yoshiyuki ; et al. | 2004-08-12 |
| Transducer and a bonding apparatus using the same Grant 6,766,936 - Kyomasu , et al. July 27, 2 | 2004-07-27 |
| Die packing device Grant 6,760,968 - Mimata , et al. July 13, 2 | 2004-07-13 |
| Offset measurement method, tool position detection method and bonding apparatus Grant 6,762,848 - Hayata , et al. July 13, 2 | 2004-07-13 |
| Transducer for a bonding apparatus Grant 6,758,383 - Nishiura , et al. July 6, 2 | 2004-07-06 |
| XY table for a semiconductor manufacturing apparatus Grant 6,727,666 - Kyomasu , et al. April 27, 2 | 2004-04-27 |
| Wafer ring supplying and returning apparatus Grant 6,722,840 - Fujisawa , et al. April 20, 2 | 2004-04-20 |
| Transducer and a bonding apparatus using the same Grant 6,719,183 - Kyomasu , et al. April 13, 2 | 2004-04-13 |
| Offset measuring mechanism and offset measuring method in a bonding apparatus App 20040060663 - Haraguchi, Manabu | 2004-04-01 |
| Discharge electrode for a wire bonding apparatus App 20040060915 - Maeda, Toru | 2004-04-01 |
| Conveying apparatus for plate-form members App 20040040823 - Ushiki, Hiroshi ; et al. | 2004-03-04 |
| Wire bonding method, wire bonding apparatus and wire bonding program App 20040041008 - Mochida, Toru | 2004-03-04 |
| Method for manufacturing a semiconductor device Grant 6,692,990 - Sato February 17, 2 | 2004-02-17 |
| Method for forming pin-form wires and the like Grant 6,687,988 - Sugiura , et al. February 10, 2 | 2004-02-10 |
| Bonding apparatus Grant 6,683,731 - Hayata January 27, 2 | 2004-01-27 |
| Wire bonding apparatus App 20040007609 - Kyomasu, Ryuichi ; et al. | 2004-01-15 |
| Initial ball forming method for wire bonding wire and wire bonding apparatus App 20040000578 - Nishiura, Shinichi ; et al. | 2004-01-01 |
| Initial ball forming method for wire bonding wire and wire bonding apparatus App 20040000577 - Nishiura, Shinichi ; et al. | 2004-01-01 |
| Wire bonding apparatus Grant 6,657,799 - Hayata December 2, 2 | 2003-12-02 |
| Bonding apparatus App 20030218048 - Maeda, Tooru | 2003-11-27 |
| Semiconductor manufacturing apparatus App 20030217460 - Nishiura, Shinichi | 2003-11-27 |
| Workpiece retainer for a bonding apparatus Grant 6,651,868 - Kawamura November 25, 2 | 2003-11-25 |
| Workpiece holding device for a bonding apparatus Grant 6,645,346 - Mii , et al. November 11, 2 | 2003-11-11 |
| Method and apparatus for positioning a semiconductor pellet Grant 6,632,703 - Ushiki , et al. October 14, 2 | 2003-10-14 |
| Bonding apparatus App 20030183672 - Kyomasu, Ryuichi ; et al. | 2003-10-02 |
| Wire bonding apparatus Grant 6,619,530 - Ushiki , et al. September 16, 2 | 2003-09-16 |
| Bonding apparatus App 20030123866 - Hayata, Shigeru | 2003-07-03 |
| Method for forming pin-form wires and the like Grant 6,581,283 - Sugiura , et al. June 24, 2 | 2003-06-24 |
| Semiconductor device manufacturing method App 20030113991 - Maeda, Tooru | 2003-06-19 |
| Wire bonding method and apparatus App 20030098426 - Hayata, Shigeru | 2003-05-29 |
| Wire bonding apparatus App 20030099049 - Hayata, Shigeru | 2003-05-29 |
| Wire bonding apparatus App 20030098330 - Morita, Naoki | 2003-05-29 |
| Ultrasonic horn for a bonding apparatus App 20030090003 - Nishiura, Shinichi | 2003-05-15 |
| Transducer for a bonding apparatus App 20030080173 - Nishiura, Shinichi ; et al. | 2003-05-01 |
| Ball formation method and ball forming device used in a wire bonding apparatus App 20030075586 - Nishiura, Shinichi | 2003-04-24 |
| Tool position measurement method, offset measurement method, reference member and bonding apparatus Grant 6,542,783 - Takahashi , et al. April 1, 2 | 2003-04-01 |
| Transducer and a bonding apparatus using the same App 20030047583 - Kyomasu, Ryuichi ; et al. | 2003-03-13 |
| Single-point bonding apparatus Grant 6,527,027 - Sugiura , et al. March 4, 2 | 2003-03-04 |
| Bonding apparatus App 20030030821 - Hayata, Shigeru ; et al. | 2003-02-13 |
| Image processing method, an image processing device and a bonding apparatus App 20030016860 - Sugawara, Kenji | 2003-01-23 |
| Transducer and a bonding apparatus using the same App 20030000994 - Kyomasu, Ryuichi ; et al. | 2003-01-02 |
| Wafer ring supplying and returning apparatus App 20020168256 - Fujisawa, Kazuhiro ; et al. | 2002-11-14 |
| Image processing method, an image processing device and a bonding apparatus App 20020166885 - Sugawara, Kenji | 2002-11-14 |
| Wire bonding method Grant 6,467,679 - Kyomasu , et al. October 22, 2 | 2002-10-22 |
| Bonding apparatus and bonding method Grant 6,467,673 - Enokido , et al. October 22, 2 | 2002-10-22 |
| Method for manufacturing a semiconductor device App 20020149093 - Sato, Koji | 2002-10-17 |
| Die pickup method and die pickup apparatus App 20020129899 - Mimata, Tsutomu ; et al. | 2002-09-19 |
| Bonding method and apparatus Grant 6,449,516 - Kyomasu , et al. September 10, 2 | 2002-09-10 |
| Image processing method and device App 20020122584 - Sugawara, Kenji | 2002-09-05 |
| Position detection device and method App 20020114520 - Sugawara, Kenji | 2002-08-22 |
| Workpiece holding device for a bonding apparatus App 20020105130 - Mii, Tatsunari ; et al. | 2002-08-08 |
| Inner lead bonding apparatus App 20020100558 - Sato, Koji | 2002-08-01 |
| Image processing method and device App 20020102016 - Yamazaki, Nobuto ; et al. | 2002-08-01 |
| Ultrasonic horn for a bonding apparatus Grant 6,422,448 - Kyomasu , et al. July 23, 2 | 2002-07-23 |
| Bonding data setting device and method App 20020079348 - Kimura, Kazumasa ; et al. | 2002-06-27 |
| Method and apparatus for processing semiconductor pellets App 20020062916 - Mimata, Tsutomu | 2002-05-30 |
| Semiconductor device and a method for manufacturing the same App 20020063316 - Sato, Koji | 2002-05-30 |
| Bonding apparatus and bonding method App 20020039437 - Sugawara, Kenji | 2002-04-04 |
| Method for manufacturing semiconductor devices App 20020037631 - Mimata, Tsutomu | 2002-03-28 |
| Wire bonding apparatus App 20020027152 - Ushiki, Hiroshi ; et al. | 2002-03-07 |
| Wire bonding apparatus App 20020023942 - Terakado, Yoshimitsu ; et al. | 2002-02-28 |
| Single-point bonding apparatus App 20020011313 - Sugiura, Kazuo ; et al. | 2002-01-31 |
| Electronic part inspection method and an electronic part assembly apparatus App 20020008528 - Sato, Koji ; et al. | 2002-01-24 |
| Semiconductor device App 20010054759 - Nishiura, Shinichi | 2001-12-27 |
| Conveyor apparatus for dies and small components App 20010051092 - Mimata, Tsutomu ; et al. | 2001-12-13 |
| Offset measurement method, tool position detection method and bonding apparatus App 20010042770 - Hayata, Shigeru ; et al. | 2001-11-22 |
| Wire bonding method App 20010042777 - Kyomasu, Ryuichi ; et al. | 2001-11-22 |
| Flip-chip bonding apparatus Grant 6,311,391 - Fuke , et al. November 6, 2 | 2001-11-06 |
| Flip-chip bonding method and apparatus Grant 6,302,313 - Tanaka October 16, 2 | 2001-10-16 |
| Ultrasonic horn for a bonding apparatus App 20010027987 - Kyomasu, Ryuichi ; et al. | 2001-10-11 |
| Bent wire forming method App 20010023534 - Tamai, Hideaki ; et al. | 2001-09-27 |
| Bonding apparatus and bonding method App 20010016062 - Enokido, Satoshi ; et al. | 2001-08-23 |
| Tool position measurement method, offset measurement method, reference member and bonding apparatus App 20010016786 - Takahashi, Kuniyuki ; et al. | 2001-08-23 |
| Bonding apparatus and bonding method App 20010011669 - Hayata, Shigeru ; et al. | 2001-08-09 |
| Multi-chip bonding method and apparatus App 20010005602 - Mimata, Tsutomu ; et al. | 2001-06-28 |
| Apparatus for positioning a semiconductor pellet App 20010005640 - Ushiki, Hiroshi ; et al. | 2001-06-28 |
| Wire bonding method and apparatus App 20010004991 - Mochida, Tooru ; et al. | 2001-06-28 |
| Die bonding method and apparatus App 20010004002 - Arai, Tsuneharu ; et al. | 2001-06-21 |
| Die bonding apparatus Grant 6,244,493 - Shimazaki , et al. June 12, 2 | 2001-06-12 |
| Wire bonding apparatus App 20010002031 - Mochida, Tooru ; et al. | 2001-05-31 |
| Wire bonding apparatus App 20010002032 - Terakado, Yoshimitsu ; et al. | 2001-05-31 |
| Spool holder structure for a wire bonder App 20010002038 - Terakado, Yoshimitsu ; et al. | 2001-05-31 |
| Control method for wire bonding apparatus Grant 6,206,266 - Takahashi , et al. March 27, 2 | 2001-03-27 |
| Method for forming a ball in wire bonding Grant 6,173,885 - Takahashi , et al. January 16, 2 | 2001-01-16 |
| Flip-chip bonding parts, flip-chip bonding confirmation parts and a flip-chip bonding method Grant 6,116,493 - Tanaka September 12, 2 | 2000-09-12 |
| Bonding load correction method and wire bonding apparatus Grant 6,095,396 - Takahashi , et al. August 1, 2 | 2000-08-01 |
| Wire bonding apparatus and control method thereof Grant 6,070,778 - Takahashi , et al. June 6, 2 | 2000-06-06 |
| Wafer ring feeding apparatus Grant 6,062,795 - Fuke , et al. May 16, 2 | 2000-05-16 |
| Wire bonding method Grant 6,041,995 - Takahashi , et al. March 28, 2 | 2000-03-28 |
| Lead frame separating and conveying apparatus Grant 6,003,655 - Tanaka , et al. December 21, 1 | 1999-12-21 |
| Semiconductor device and wire bonding method therefor Grant 5,989,995 - Nishiura , et al. November 23, 1 | 1999-11-23 |
| Wire bonding method Grant 5,967,401 - Nishiura , et al. October 19, 1 | 1999-10-19 |
| Method for forming a ball in wire bonding Grant 5,958,259 - Miyano , et al. September 28, 1 | 1999-09-28 |
| Method for wire-bonding a covered wire Grant 5,891,796 - Nakamura , et al. April 6, 1 | 1999-04-06 |
| Ball detection method and apparatus for wire-bonded parts Grant 5,870,489 - Yamazaki , et al. February 9, 1 | 1999-02-09 |
| Clamping mechanism for a bonding apparatus Grant 5,826,778 - Sato , et al. October 27, 1 | 1998-10-27 |
| Wafer ring supply and return device Grant 5,824,185 - Nakamura , et al. October 20, 1 | 1998-10-20 |
| Wire bend inspection method and apparatus Grant 5,818,958 - Tomiyama , et al. October 6, 1 | 1998-10-06 |
| Wire-bonding apparatus and method using a covered wire Grant 5,797,388 - Nakamura , et al. August 25, 1 | 1998-08-25 |
| Clamping device Grant 5,746,422 - Harada , et al. May 5, 1 | 1998-05-05 |
| Magazine conveying device Grant 5,727,917 - Fuke , et al. March 17, 1 | 1998-03-17 |
| Lead frame suction holding device Grant 5,685,589 - Kikuchi , et al. November 11, 1 | 1997-11-11 |
| Lead frame baking oven Grant 5,647,740 - Kobaru July 15, 1 | 1997-07-15 |
| Wire bonding method and apparatus Grant 5,615,821 - Sasano April 1, 1 | 1997-04-01 |
| Bonding apparatus Grant 5,603,446 - Kikuchi , et al. February 18, 1 | 1997-02-18 |
| Bonding apparatus Grant 5,540,807 - Akiike , et al. July 30, 1 | 1996-07-30 |
| Method and apparatus for inspecting bent portions in wire loops Grant 5,485,398 - Yamazaki , et al. January 16, 1 | 1996-01-16 |
| Wire clampers Grant 5,435,477 - Torihata , et al. July 25, 1 | 1995-07-25 |
| Conveying devices used in a semiconductor assembly line Grant 5,397,213 - Ushiki March 14, 1 | 1995-03-14 |
| Bonding wire inspection apparatus Grant 5,396,334 - Sugawara March 7, 1 | 1995-03-07 |
| Bonding wire inspection apparatus and method Grant 5,394,246 - Sugawara February 28, 1 | 1995-02-28 |
| Wire clamper Grant 5,388,751 - Harada , et al. February 14, 1 | 1995-02-14 |
| Bonding apparatus Grant 5,385,288 - Kyomasu , et al. January 31, 1 | 1995-01-31 |
| Tape bonding apparatus Grant 5,372,292 - Sato , et al. December 13, 1 | 1994-12-13 |
| Capillary-retaining structure for an ultrasonic horn Grant 5,368,216 - Sakakura , et al. November 29, 1 | 1994-11-29 |
| Bonding wire inspection apparatus Grant 5,369,492 - Sugawara November 29, 1 | 1994-11-29 |
| Ultrasonic wire bonding method Grant 5,364,009 - Takahashi , et al. November 15, 1 | 1994-11-15 |
| Bonding wire inspection apparatus Grant 5,365,341 - Sugawara November 15, 1 | 1994-11-15 |
| Bonding apparatus Grant 5,340,010 - Torihata , et al. August 23, 1 | 1994-08-23 |
| Wire clamper Grant 5,323,948 - Yamazaki , et al. June 28, 1 | 1994-06-28 |
| Microscope supporting mechanism Grant 5,320,315 - Kawamura , et al. June 14, 1 | 1994-06-14 |
| Bonding wire inspection apparatus Grant 5,293,217 - Sugawara March 8, 1 | 1994-03-08 |
| Wire bonding apparatus Grant 5,275,324 - Yamazaki , et al. January 4, 1 | 1994-01-04 |
| Bonding machine with oxidization preventive means Grant 5,265,788 - Ozawa , et al. November 30, 1 | 1993-11-30 |
| Tape clamping mechanism Grant 5,249,726 - Sato October 5, 1 | 1993-10-05 |
| Bonding method and apparatus therefor Grant 5,225,026 - Ozawa , et al. July 6, 1 | 1993-07-06 |
| Wire bonding method and apparatus Grant 5,221,037 - Terakado , et al. June 22, 1 | 1993-06-22 |
| Method and apparatus for forming a ball at a bonding wire end Grant 5,214,259 - Terakado , et al. May 25, 1 | 1993-05-25 |
| Conveying apparatus used in assembling semicondutors Grant 5,203,443 - Toriumi , et al. April 20, 1 | 1993-04-20 |
| Wire bonding method and apparatus with lead pressing means Grant 5,197,652 - Yamazaki March 30, 1 | 1993-03-30 |
| Wire bonding method Grant 5,192,018 - Terakado , et al. March 9, 1 | 1993-03-09 |
| Ultrasonic bonding apparatus for bonding a semiconductor device to a tab tape Grant 5,156,318 - Suzuki , et al. October 20, 1 | 1992-10-20 |
| Marking method and apparatus Grant 5,136,948 - Fujino , et al. August 11, 1 | 1992-08-11 |
| Wire bonding method Grant 5,137,201 - Yamazaki , et al. August 11, 1 | 1992-08-11 |
| Plate base fixing structure Grant 5,121,690 - Yamaguchi , et al. June 16, 1 | 1992-06-16 |
| Tape bonding apparatus Grant 5,120,391 - Ishida June 9, 1 | 1992-06-09 |
| Wire bonding method Grant 5,078,312 - Ohashi , et al. January 7, 1 | 1992-01-07 |
| Method for forming bump on semiconductor elements Grant 5,058,798 - Yamazaki , et al. October 22, 1 | 1991-10-22 |
| Detection method for wire bonding failures Grant 5,058,797 - Terakado , et al. October 22, 1 | 1991-10-22 |
| Method for manufacturing semiconductor elements equipped with leads Grant 5,056,217 - Yamazaki , et al. October 15, 1 | 1991-10-15 |
| Device for detecting height of bonding surface Grant 5,046,655 - Ohashi , et al. September 10, 1 | 1991-09-10 |
| Wire bonding method and apparatus Grant 5,044,543 - Yamazaki , et al. September 3, 1 | 1991-09-03 |
| Aligning method and apparatus for attaching a printing plate to a plate holder Grant 5,031,334 - Takamura July 16, 1 | 1991-07-16 |
| Dispensing apparatus Grant 4,989,756 - Kagamihara , et al. February 5, 1 | 1991-02-05 |
| Method of wire bonding Grant 4,932,584 - Yamazaki , et al. June 12, 1 | 1990-06-12 |
| Method of tape bonding Grant 4,913,336 - Yamazaki April 3, 1 | 1990-04-03 |
| Apparatus for connecting external leads Grant 4,887,758 - Suzuki , et al. December 19, 1 | 1989-12-19 |
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