| Patent | Date |
|---|
Precision analog metal-metal capacitor
Grant 6,008,083 - Brabazon , et al. December 28, 1 | 1999-12-28 |
Reducing pitch with continuously adjustable line and space dimensions
Grant 5,795,830 - Cronin , et al. August 18, 1 | 1998-08-18 |
Precision analog metal-metal capacitor
Grant 5,708,559 - Brabazon , et al. January 13, 1 | 1998-01-13 |
Method of making overpass mask/insulator for local interconnects
Grant 5,496,771 - Cronin , et al. March 5, 1 | 1996-03-05 |
Method of forming borderless contacts using a removable mandrel
Grant 5,466,636 - Cronin , et al. November 14, 1 | 1995-11-14 |
Gray level mask
Grant 5,334,467 - Cronin , et al. August 2, 1 | 1994-08-02 |
Process for forming multi-level coplanar conductor/insulator films employing photosensitive polymide polymer compositions
Grant 5,229,257 - Cronin , et al. July 20, 1 | 1993-07-20 |
Method of making a gray level mask
Grant 5,213,916 - Cronin , et al. May 25, 1 | 1993-05-25 |
Method and structure for providing improved insulation in VLSI and ULSI circuits
Grant 5,144,411 - Kaanta , et al. September 1, 1 | 1992-09-01 |
Method of forming conductors within an insulating substrate
Grant 5,136,124 - Cronin , et al. August 4, 1 | 1992-08-04 |
Plural level chip masking
Grant 5,126,006 - Cronin , et al. June 30, 1 | 1992-06-30 |
Process for forming multi-level coplanar conductor/insulator films employing photosensitive polyimide polymer compositions
Grant 5,091,289 - Cronin , et al. February 25, 1 | 1992-02-25 |
Radial uniformity control of semiconductor wafer polishing
Grant 5,036,630 - Kaanta , et al. August 6, 1 | 1991-08-06 |
Process for forming refractory metal silicide layers of different thicknesses in an integrated circuit
Grant 5,034,348 - Hartswick , et al. July 23, 1 | 1991-07-23 |
Method of forming conductors within an insulating substrate
Grant 4,985,990 - Cronin , et al. January 22, 1 | 1991-01-22 |
Method for providing improved insulation in VLSI and ULSI circuits
Grant 4,987,101 - Kaanta , et al. January 22, 1 | 1991-01-22 |
Via-filling and planarization technique
Grant 4,956,313 - Cote , et al. September 11, 1 | 1990-09-11 |
Method of forming borderless contacts
Grant 4,944,682 - Cronin , et al. July 31, 1 | 1990-07-31 |
Etching metal films with complexing chloride plasma
Grant 4,919,750 - Bausmith , et al. April 24, 1 | 1990-04-24 |
In situ conductivity monitoring technique for chemical/mechanical planarization endpoint detection
Grant 4,793,895 - Kaanta , et al. December 27, 1 | 1988-12-27 |
Method for producing coplanar multi-level metal/insulator films on a substrate and for forming patterned conductive lines simultaneously with stud vias
Grant 4,789,648 - Chow , et al. December 6, 1 | 1988-12-06 |
Stud formation method optimizing insulator gap-fill and metal hole-fill
Grant 4,758,306 - Cronin , et al. July 19, 1 | 1988-07-19 |
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