K.C.Tech Co., Ltd.

Patent Applications and Registrations

Patent applications and USPTO patent grants for K.C.Tech Co., Ltd..The latest application filed is for "chemical mechanical polishing slurry composition and method of fabricating semiconductor device using the same".

Company Profile

3.28.41

K.C.Tech Co., Ltd. - Anseong-si, Gyeonggi-do N/A KR
K.C. Tech Co., Ltd. - Anseong-si Gyeonggi-Do KR
K.C.TECH CO., LTD - Anseong-si KR
K.C. TECH CO., LTD. - Gyeonggi-Do KR
K.C. Tech Co., Ltd. - KR KR
K.C. TECH CO., LTD. -
K.C. Tech Co., Ltd. - Ansong-shi Kyonggi-do KR
K.C. Tech Co., Ltd - Kyonggi KR
K. C. Tech Co., Ltd. - Kyonggi-Do KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Substrate processing system Grant 10,518,382 - Kweon , et al. Dec	2019-12-31
Polishing compositions and methods of manufacturing semiconductor devices using the same Grant 10,435,587 - Park , et al. O	2019-10-08
Slurry composition for chemical mechanical polishing Grant 10,428,242 - Moon , et al. October 1, 2	2019-10-01
Chemical Mechanical Polishing Slurry Composition And Method Of Fabricating Semiconductor Device Using The Same App 20180362806 - PARK; Seung Ho ; et al.	2018-12-20
Abrasive particle-dispersion layer composite and polishing slurry composition including the same Grant 10,138,395 - Kwon , et al. Nov	2018-11-27
Slurry Composition For Chemical Mechanical Polishing App 20180282581 - MOON; Doo-sik ; et al.	2018-10-04
Polishing slurry composition Grant 10,077,381 - Choi , et al. September 18, 2	2018-09-18
Substrate processing system and substrate processing method Grant 10,002,777 - Kweon , et al. June 19, 2	2018-06-19
Slurry composition for polishing tungsten Grant 9,994,735 - Hwang , et al. June 12, 2	2018-06-12
Method of fabricating integrated circuit device by using slurry composition Grant 9,991,127 - Park , et al. June 5, 2	2018-06-05
Substrate Processing System App 20170320188 - Kweon; Young Kyu ; et al.	2017-11-09
Substrate Processing System And Substrate Processing Method App 20170323807 - Kweon; Young Kyu ; et al.	2017-11-09
Substrate cleaning apparatus and method and brush assembly used therein Grant 9,704,729 - Cho , et al. July 11, 2	2017-07-11
Abrasive Particle-dispersion Layer Composite And Polishing Slurry Composition Including The Same App 20170183539 - KWON; Jang Kuk ; et al.	2017-06-29
Polishing Slurry Composition App 20170183537 - YOON; Joo Hyoung ; et al.	2017-06-29
Additive Composition And Positive Polishing Slurry Composition Including The Same App 20170183538 - KWON; Jang Kuk ; et al.	2017-06-29
Abrasive Particle-dispersion Layer Composite And Polishing Slurry Composition Including The Same App 20170166780 - KWON; Jang Kuk ; et al.	2017-06-15
Slot die coating apparatus and coating method using the same Grant 9,581,872 - Park , et al. February 28, 2	2017-02-28
Method For Preparing Slurry Composition And Slurry Composition Prepared Thereby App 20170051180 - KWON; Jang Kuk ; et al.	2017-02-23
Polishing Compositions And Methods Of Manufacturing Semiconductor Devices Using The Same App 20170029664 - PARK; Seung-Ho ; et al.	2017-02-02
Polishing Slurry Composition App 20170022391 - CHOI; Dong Kyu ; et al.	2017-01-26
Slurry Composition For Polishing Tungsten App 20170009353 - HWANG; Jin Sook ; et al.	2017-01-12
Thin Film Manufacturing Method And Atomic Layer Deposition Apparatus App 20160108518 - PARK; Sung Hyun ; et al.	2016-04-21
Slot Die Coating Apparatus And Coating Method Using The Same App 20160016185 - Park; Jae Cheol ; et al.	2016-01-21
Atomic layer deposition apparatus Grant 8,968,476 - Shin , et al. March 3, 2	2015-03-03
Membrane assembly and carrier head having the membrane assembly Grant 8,939,817 - Son January 27, 2	2015-01-27
Substrate Cleaning Apparatus And Method And Brush Assembly Used Therein App 20140366913 - CHO; Moon Gi ; et al.	2014-12-18
Chemical mechanical polishing system Grant 8,882,563 - Boo , et al. November 11, 2	2014-11-11
Conditioner of chemical mechanical polishing apparatus Grant 8,662,956 - Seo , et al. March 4, 2	2014-03-04
Abrasive particles, method of manufacturing the abrasive particles, and method of manufacturing chemical mechanical polishing slurry Grant 8,491,682 - Hong , et al. July 23, 2	2013-07-23
Polishing slurry, method of producing same, and method of polishing substrate Grant 8,361,177 - Kim , et al. January 29, 2	2013-01-29
Membrane Assembly And Carrier Head Having The Membrane Assembly App 20120309275 - Son; Jun Ho	2012-12-06
CMP slurry, preparation method thereof and method of polishing substrate using the same Grant 8,062,547 - Paik , et al. November 22, 2	2011-11-22
Conditioner Of Chemical Mechanical Polishing Apparatus App 20110275289 - SEO; Keon Sik ; et al.	2011-11-10
Chemical Mechanical Polishing System App 20110269378 - Boo; Jae Phil ; et al.	2011-11-03
Loading device of chemical mechanical polishing equipment for semiconductor wafers Grant 7,892,069 - Na , et al. February 22, 2	2011-02-22
Atomic Layer Deposition Apparatus App 20100186669 - Shin; In Chul ; et al.	2010-07-29
Nozzle for spraying sublimable solid particles entrained in gas for cleaning surface Grant 7,762,869 - Yoon July 27, 2	2010-07-27
Cleaning device for chemical mechanical polishing equipment Grant 7,674,156 - Son , et al. March 9, 2	2010-03-09
Abrasive Particles, Method Of Manufacturing The Abrasive Particles, And Method Of Manufacturing Chemical Mechanical Polishing Slurry App 20090193721 - HONG; Suk Min ; et al.	2009-08-06
Polishing Slurry, Method Of Producing Same, And Method Of Polishing Substrate App 20090133336 - Kim; Dae Hyeong ; et al.	2009-05-28
Polishing Slurry, Method Of Producing Same, And Method Of Polishing Substrate App 20090100765 - Kim; Dae Hyeong ; et al.	2009-04-23
Nozzle For Spraying Sublimable Solid Particles Entrained In Gas For Cleaning Surface App 20090039178 - Yoon; Cheol-Nam	2009-02-12
Polishing slurry, method of producing same, and method of polishing substrate Grant 7,470,295 - Kim , et al. December 30, 2	2008-12-30
Nozzle for spraying sublimable solid particles entrained in gas for cleaning surface Grant 7,442,112 - Yoon October 28, 2	2008-10-28
Slurry for CMP and method of polishing substrate using same Grant 7,364,600 - Kim , et al. April 29, 2	2008-04-29
Apparatus and method for measuring widthwise ejection uniformity of slit nozzle App 20070275157 - Cho; Kang II	2007-11-29
Apparatus and method for measuring widthwise ejection uniformity of slit nozzle App 20070272146 - Cho; Kang Il	2007-11-29
Apparatus for cleaning the edges of wafers Grant 7,270,136 - Ko , et al. September 18, 2	2007-09-18
Manufacturing Method Of Electrode For Atmospheric Pressure Plasma, Electrode Structure, And Atmospheric Pressure Plasma Apparatus Using The Same App 20070182327 - KIM; Tae Wook ; et al.	2007-08-09
Abrasive particles, polishing slurry, and producing method thereof App 20060156635 - Kim; Dae Hyeong ; et al.	2006-07-20
System for forming aerosols and cooling device incorporated therein Grant 7,013,660 - Kim March 21, 2	2006-03-21
Nozzle for injecting sublimable solid particles entrained in gas for cleaning a surface Grant 7,008,306 - Yoon , et al. March 7, 2	2006-03-07
Polishing slurry, method of producing same, and method of polishing substrate App 20060032149 - Kim; Dae Hyeong ; et al.	2006-02-16
System for forming aerosols and cooling device incorporated therein Grant 6,978,625 - Kim December 27, 2	2005-12-27
Nozzle for spraying sublimable solid particles entrained in gas for cleaning surface and method of cleaning surface using the same App 20050266777 - Yoon, Cheol-Nam	2005-12-01
Slurry for CMP and method of polishing substrate using same App 20050252092 - Kim, Dae Hyeong ; et al.	2005-11-17
Polishing slurry, method of producing same, and method of polishing substrate App 20050198912 - Kim, Dae Hyung ; et al.	2005-09-15

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