Junker; Kurt H.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Junker; Kurt H..The latest application filed is for "semiconductor device having a metal oxide metal (mom) capacitor and a plurality of series capacitors and method for forming".

Company Profile

0.20.22

Junker; Kurt H. - Austin TX US
JUNKER; KURT H. - DRIPPING SPRINGS TX

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Methods for forming semiconductor devices with stepped bond pads Grant 9,780,051 - Tran , et al. October 3, 2	2017-10-03
Semiconductor Device Having A Metal Oxide Metal (mom) Capacitor And A Plurality Of Series Capacitors And Method For Forming App 20170053930 - PRINZ; ERWIN J. ; et al.	2017-02-23
Method of making a die with recessed aluminum die pads Grant 9,209,078 - Spencer , et al. December 8, 2	2015-12-08
Methods For Forming Semiconductor Devices With Stepped Bond Pads App 20150171035 - TRAN; TU-ANH N. ; et al.	2015-06-18
Method Of Making A Die With Recessed Aluminum Die Pads App 20140213050 - SPENCER; GREGORY S. ; et al.	2014-07-31
Method of making a die with recessed aluminum die pads Grant 8,722,530 - Spencer , et al. May 13, 2	2014-05-13
Method Of Making A Die With Recessed Alumium Die Pads App 20130029485 - Spencer; Gregory S. ; et al.	2013-01-31
Semiconductor device having an organic anti-reflective coating (ARC) and method therefor Grant 8,039,389 - Reber , et al. October 18, 2	2011-10-18
Multilayer Silicon Nitride Deposition For A Semiconductor Device App 20110210401 - Junker; Kurt H. ; et al.	2011-09-01
Method for forming a through silicon via layout Grant 7,799,678 - Kropewnicki , et al. September 21, 2	2010-09-21
Method of removing defects from a dielectric material in a semiconductor Grant 7,776,731 - Junker , et al. August 17, 2	2010-08-17
Multilayer silicon nitride deposition for a semiconductor device Grant 7,700,499 - Junker , et al. April 20, 2	2010-04-20
Method of forming a semiconductor device with multiple tensile stressor layers Grant 7,678,698 - Bo , et al. March 16, 2	2010-03-16
Deep STI trench and SOI undercut enabling STI oxide stressor Grant 7,678,665 - Turner , et al. March 16, 2	2010-03-16
Disposable organic spacers Grant 7,579,228 - Grudowski , et al. August 25, 2	2009-08-25
Method For Forming A Through Silicon Via Layout App 20090191708 - Kropewnicki; Thomas J. ; et al.	2009-07-30
Method Of Removing Defects From A Dielectric Material In A Semiconductor App 20090075434 - Junker; Kurt H. ; et al.	2009-03-19
Disposable organic spacers App 20090017587 - Grudowski; Paul A. ; et al.	2009-01-15
Semiconductor Device With Multiple Tensile Stressor Layers And Method App 20080272411 - Bo; Xiangzheng ; et al.	2008-11-06
Deep STI trench and SOI undercut enabling STI oxide stressor App 20080220617 - Turner; Michael D. ; et al.	2008-09-11
Multilayer silicon nitride deposition for a semiconductor device App 20080173986 - Junker; Kurt H. ; et al.	2008-07-24
Multilayer silicon nitride deposition for a semiconductor device App 20080173908 - Junker; Kurt H. ; et al.	2008-07-24
Method For Forming A Stressor Layer App 20080026517 - Grudowski; Paul A. ; et al.	2008-01-31
Semiconductor Device Having An Organic Anti-reflective Coating (arc) And Method Therefor App 20070141770 - Reber; Douglas M. ; et al.	2007-06-21
Semiconductor device having an organic anti-reflective coating (ARC) and method therefor Grant 7,199,429 - Reber , et al. April 3, 2	2007-04-03
Plasma treatment for surface of semiconductor device Grant 7,176,130 - Shen , et al. February 13, 2	2007-02-13
Methods of forming boron carbo-nitride layers for integrated circuit devices Grant 7,144,803 - Engbrecht , et al. December 5, 2	2006-12-05
Capping layer for reducing amorphous carbon contamination of photoresist in semiconductor device manufacture; and process for making same Grant 7,109,101 - Wright , et al. September 19, 2	2006-09-19
Plasma treatment for surface of semiconductor device App 20060105568 - Shen; Jin Miao ; et al.	2006-05-18
Integration of ultra low K dielectric in a semiconductor fabrication process Grant 6,992,003 - Spencer , et al. January 31, 2	2006-01-31
Semiconductor device having an organic anti-reflective coating (ARC) and method therefor Grant 6,972,255 - Reber , et al. December 6, 2	2005-12-06
Semiconductor device having an organic anti-reflective coating (ARC) and method therefor App 20050181596 - Reber, Douglas M. ; et al.	2005-08-18
Integration of ultra low K dielectric in a semiconductor fabrication process App 20050059245 - Spencer, Gregory S. ; et al.	2005-03-17
Semiconductor device having an organic anti-reflective coating (ARC) and method therefor App 20050026338 - Reber, Douglas M. ; et al.	2005-02-03
Methods of forming boron carbo-nitride layers for integrated circuit devices App 20040259353 - Engbrecht, Edward R. ; et al.	2004-12-23
UV cure process and tool for low k film formation Grant 6,475,930 - Junker , et al. November 5, 2	2002-11-05

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