Junge; Joachim
Patent Applications and Registrations
Patent applications and USPTO patent grants for Junge; Joachim.The latest application filed is for "single-layered winding of sawing wire with fixedly bonded abrasive grain for wire saws for slicing wafers from a workpiece".
- Junge; Joachim - Burghausen DE
| Patent | Date |
|---|---|
| Single-layered Winding Of Sawing Wire With Fixedly Bonded Abrasive Grain For Wire Saws For Slicing Wafers From A Workpiece App 20130061842 - Junge; Joachim ; et al. | 2013-03-14 |
| Simultaneous double-side grinding of semiconductor wafers Grant 8,197,300 - Junge , et al. June 12, 2 | 2012-06-12 |
| Method for grinding semiconductor wafers Grant 7,666,064 - Junge , et al. February 23, 2 | 2010-02-23 |
| Simultaneous Double-Side Grinding Of Semiconductor Wafers App 20090104846 - Junge; Joachim ; et al. | 2009-04-23 |
| Method For Grinding Semiconductor Wafers App 20090011683 - Junge; Joachim ; et al. | 2009-01-08 |
| Device for the simultaneous double-side grinding of a workpiece in wafer form Grant 6,997,779 - Junge , et al. February 14, 2 | 2006-02-14 |
| Device for the simultaneous double-side grinding of a workpiece in wafer form App 20050202757 - Junge, Joachim ; et al. | 2005-09-15 |
| Method and device for cutting a multiplicity of disks from a hard brittle workpiece Grant 6,390,896 - Huber , et al. May 21, 2 | 2002-05-21 |
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