Jung; Yang Gyoo

Patent Applications and Registrations

Patent applications and USPTO patent grants for Jung; Yang Gyoo.The latest application filed is for "semiconductor package".

Company Profile

6.6.8

Jung; Yang Gyoo - Hwaseong-si KR
Jung; Yang Gyoo - Seoul KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor package having logic semiconductor chip and memory packages on interposer Grant 11,217,503 - Jung , et al. January 4, 2	2022-01-04
Semiconductor Package App 20210398916 - KIM; Chul Woo ; et al.	2021-12-23
Semiconductor package Grant 11,139,253 - Kim , et al. October 5, 2	2021-10-05
System And Method For Laser Assisted Bonding Of An Electronic Device App 20210082717 - Yoon; Tae Ho ; et al.	2021-03-18
Semiconductor Package App 20200395346 - JUNG; Yang Gyoo ; et al.	2020-12-17
Semiconductor Package App 20200312789 - KIM; Chul Woo ; et al.	2020-10-01
System and method for laser assisted bonding of an electronic device Grant 10,763,129 - Yoon , et al. Sep	2020-09-01
System And Method For Laser Assisted Bonding Of An Electronic Device App 20190287816 - Yoon; Tae Ho ; et al.	2019-09-19
System and method for laser assisted bonding of semiconductor die Grant 10,304,698 - Yoon , et al.	2019-05-28
System And Method For Laser Assisted Bonding Of Semiconductor Die App 20180204740 - Yoon; Tae Ho ; et al.	2018-07-19
System and method for laser assisted bonding of semiconductor die Grant 9,916,989 - Yoon , et al. March 13, 2	2018-03-13
System And Method For Laser Assisted Bonding Of Semiconductor Die App 20170301560 - Yoon; Tae Ho ; et al.	2017-10-19
Laser assisted bonding for semiconductor die interconnections Grant 9,627,348 - Ryu , et al. April 18, 2	2017-04-18
Laser Assisted Bonding For Semiconductor Die Interconnections App 20160049381 - Ryu; Dong Su ; et al.	2016-02-18

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