Jung; Won Duck

Patent Applications and Registrations

Patent applications and USPTO patent grants for Jung; Won Duck.The latest application filed is for "semiconductor packages".

Company Profile

5.9.10

Jung; Won Duck - Icheon-si KR
JUNG; Won Duck - Icheon-si Gyeonggi-do KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor packages including chips stacked on a base module Grant 11,233,033 - Jung January 25, 2	2022-01-25
Semiconductor Packages App 20210242176 - JUNG; Won Duck	2021-08-05
Semiconductor Packages Including Chips Stacked On A Base Module App 20210233891 - JUNG; Won Duck	2021-07-29
Semiconductor Packages App 20210118800 - JUNG; Won Duck	2021-04-22
Semiconductor packages Grant 10,741,529 - Jung , et al. A	2020-08-11
Package substrates having an electromagnetic bandgap structure and semiconductor packages employing the package substrates Grant 10,629,543 - Lim , et al.	2020-04-21
Semiconductor package having an electro-magnetic interference shielding or electro-magnetic wave scattering structure Grant 10,615,129 - Jung , et al.	2020-04-07
Package Substrates Having An Electromagnetic Bandgap Structure And Semiconductor Packages Employing The Package Substrates App 20190393164 - LIM; Sung Mook ; et al.	2019-12-26
Semiconductor Packages App 20190139940 - JUNG; Won Duck ; et al.	2019-05-09
Semiconductor Package Having An Electro-magnetic Interference Shielding Or Electro-magnetic Wave Scattering Structure App 20190081009 - JUNG; Won Duck ; et al.	2019-03-14
Semiconductor packages Grant 10,224,314 - Jung , et al.	2019-03-05
Semiconductor package having an electro-magnetic interference shielding or electro-magnetic wave scattering structure Grant 10,157,858 - Jung , et al. Dec	2018-12-18
Semiconductor Package Having An Electro-magnetic Interference Shielding Or Electro-magnetic Wave Scattering Structure App 20180247897 - JUNG; Won Duck ; et al.	2018-08-30
Semiconductor Packages App 20170309600 - JUNG; Won Duck ; et al.	2017-10-26
Semiconductor packages having interconnection members Grant 9,668,344 - Jung , et al. May 30, 2	2017-05-30
Semiconductor package Grant 9,543,384 - Bae , et al. January 10, 2	2017-01-10
Semiconductor Packages Having Interconnection Members App 20160316559 - JUNG; Won Duck ; et al.	2016-10-27
Semiconductor Device App 20160254251 - BAE; Han Jun ; et al.	2016-09-01
Package substrates, semiconductor packages including the same, electronic systems including the same, and memory cards including the same Grant 9,345,136 - Kim , et al. May 17, 2	2016-05-17

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