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Patent applications and USPTO patent grants for Jung; Seung Boo.The latest application filed is for "method for transient liquid-phase bonding between metal materials using a magnetic force".
Patent | Date |
---|---|
Method for transient liquid-phase bonding between metal materials using a magnetic force Grant 11,094,663 - Jung , et al. August 17, 2 | 2021-08-17 |
Flip chip and method of making flip chip Grant RE48,421 - Jung , et al. February 2, 2 | 2021-02-02 |
Method of making flip chip Grant RE48,422 - Jung , et al. February 2, 2 | 2021-02-02 |
Method For Transient Liquid-phase Bonding Between Metal Materials Using A Magnetic Force App 20200381385 - JUNG; Seung Boo ;   et al. | 2020-12-03 |
Flip chip for electrical function test and manufacturing method thereof Grant 8,048,793 - Jung , et al. November 1, 2 | 2011-11-01 |
Printed circuit board assembly and manufacturing method for the same App 20090139758 - Shin; Hyo Young ;   et al. | 2009-06-04 |
Flip Chip For Electrical Function Test And Manufacturing Method Thereof App 20090057921 - JUNG; Seung Boo ;   et al. | 2009-03-05 |
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