JUNG; Ky-hyun

Patent Applications and Registrations

Patent applications and USPTO patent grants for JUNG; Ky-hyun.The latest application filed is for "wave soldering apparatus to apply buoyancy, soldering method, and method of forming solder bumps for flip chips on a substrate".

Company Profile

0.4.8

JUNG; Ky-hyun - Cheonan-si KR
Jung; Ky-Hyun - Chungcheongnam-do KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Wave Soldering Apparatus To Apply Buoyancy, Soldering Method, And Method Of Forming Solder Bumps For Flip Chips On A Substrate App 20110293903 - JUNG; Ky-hyun ; et al.	2011-12-01
Method of forming at least one bonding structure Grant 8,053,351 - Ryu , et al. November 8, 2	2011-11-08
Printed circuit board and method thereof and a solder ball land and method thereof Grant 8,039,972 - Jung , et al. October 18, 2	2011-10-18
Method Of Forming At Least One Bonding Structure App 20110136334 - Ryu; Hwang-Bok ; et al.	2011-06-09
Printed circuit board and method thereof and a solder ball land and method thereof App 20090278249 - Jung; Ky-hyun ; et al.	2009-11-12
Printed circuit board and method thereof and a solder ball land and method thereof Grant 7,576,438 - Jung , et al. August 18, 2	2009-08-18
Method Of Manufacturing A Semiconductor Package App 20090200362 - JUNG; Ky-Hyun ; et al.	2009-08-13
Cleaning solutions and methods of cleaning boards using the same App 20080110477 - Jung; Ky-Hyun ; et al.	2008-05-15
Substrate For Semiconductor Package And Method Of Manufacturing The Same App 20080061434 - JUNG; Ky-Hyun ; et al.	2008-03-13
Printed circuit board and method thereof and a solder ball land and method thereof App 20070040282 - Jung; Ky-hyun ; et al.	2007-02-22
Contact pin, connection device and method of testing Grant 7,102,369 - Jung September 5, 2	2006-09-05
Contact pin, connection device and method of testing App 20050030050 - Jung, Ky-Hyun	2005-02-10

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