JUNG; Ki Sung

Patent Applications and Registrations

Patent applications and USPTO patent grants for JUNG; Ki Sung.The latest application filed is for "operation method and system for point enhancement service, and computer-readable recording medium in which operation method is recorded".

Company Profile

0.7.10

JUNG; Ki Sung - Gwangju KR
Jung; Ki Sung - Gunpo-si N/A KR
Jung; Ki Sung - Ansan-Si KR
Jung; Ki Sung - Uiwang-si KR
Jung; Ki-Sung - Yongin-shi KR
Jung; Ki-Sung - Ansan KR
Jung; Ki-Sung - Kyonggi-do KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Operation Method And System For Point Enhancement Service, And Computer-readable Recording Medium In Which Operation Method Is Recorded App 20170039589 - JUNG; Ki Sung ; et al.	2017-02-09
Bonding film composition for semiconductor assembly, bonding film therefrom, and dicing die bond film comprising the same Grant 8,394,493 - Hong , et al. March 12, 2	2013-03-12
Environmentally Friendly Coated Yarn And Coating Composition Therefor App 20130052900 - JUNG; Ki Sung ; et al.	2013-02-28
Adhesive film composition, associated dicing die bonding film, and die package Grant 7,863,758 - Jung , et al. January 4, 2	2011-01-04
Anisotropic conductive film forming composition Grant 7,700,007 - Jung , et al. April 20, 2	2010-04-20
Adhesive film composition, associated dicing die bonding film, and die package App 20080145668 - Jung; Ki Sung ; et al.	2008-06-19
Photocurable pressure-sensitive adhesive composition including acrylic binder resin, adhesive tape using the same, and associated methods App 20080108721 - Ha; Kyoung Jin ; et al.	2008-05-08
Bonding film composition for semiconductor assembly, bonding film therefrom, and dicing die bond film comprising the same App 20080102284 - Hong; Yong Woo ; et al.	2008-05-01
Adhesive film composition for semiconductor assembly, associated dicing die bonding film and semiconductor package App 20080063871 - Jung; Ki Sung ; et al.	2008-03-13
Film for anisotropic conductivity and electronic circuits and devices using the film App 20070040153 - Jung; Ki Sung ; et al.	2007-02-22
Anisotropic conductive film forming composition App 20060148956 - Jung; Ki Sung ; et al.	2006-07-06
Method of continuously transmitting user data on a reverse common channel in a mobile communication system Grant 6,845,089 - Gu , et al. January 18, 2	2005-01-18
Resin composition for manufacturing optical fiber ribbon and method for preparing resin for manufacturing optical fiber ribbon using the same Grant 6,770,685 - Chang , et al. August 3, 2	2004-08-03
Device and method for transmitting common channel message in CDMA communication system Grant 6,621,807 - Jung , et al. September 16, 2	2003-09-16

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