Jung; JinHee

Patent Applications and Registrations

Patent applications and USPTO patent grants for Jung; JinHee.The latest application filed is for "mask design for improved attach position".

Company Profile

7.12.16

Jung; JinHee - Incheon KR
Jung; Jinhee - Paju-si KR
JUNG; Jinhee - Seoul KR
Jung; Jinhee - Samcheok-si KR
Jung; JinHee - Busan KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Mask Design for Improved Attach Position App 20220310408 - Kim; ChangOh ; et al.	2022-09-29
Data driving circuit and display device Grant 11,450,284 - Jung , et al. September 20, 2	2022-09-20
Mask design for improved attach position Grant 11,393,698 - Kim , et al. July 19, 2	2022-07-19
Selective EMI Shielding Using Preformed Mask with Fang Design App 20220199545 - Kim; ChangOh ; et al.	2022-06-23
Mask Design for Improved Attach Position App 20220199423 - Kim; ChangOh ; et al.	2022-06-23
Data Driving Circuit And Display Device App 20220189416 - Jung; Jinhee ; et al.	2022-06-16
Display Device And Driving Circuit App 20220180814 - JUNG; Jinhee ; et al.	2022-06-09
Selective EMI Shielding Using Preformed Mask App 20220157739 - Lee; HunTeak ; et al.	2022-05-19
Display device Grant 11,100,870 - Jung August 24, 2	2021-08-24
Semiconductor device and method of forming substrate including embedded component with symmetrical structure Grant 10,665,662 - Jung , et al.	2020-05-26
Display Device App 20200143752 - Jung; Jinhee	2020-05-07
Semiconductor device and method of forming SIP with electrical component terminals extending out from encapsulant Grant 10,629,565 - Jung , et al.	2020-04-21
Semiconductor Device and Method of Forming SIP with Electrical Component Terminals Extending Out from Encapsulant App 20190355695 - Jung; JinHee ; et al.	2019-11-21
Semiconductor device and method of forming SIP with electrical component terminals extending out from encapsulant Grant 10,418,341 - Jung , et al. Sept	2019-09-17
Semiconductor Device and Method of Forming Substrate Including Embedded Component with Symmetrical Structure App 20190172902 - Jung; JinHee ; et al.	2019-06-06
Semiconductor device and method of forming substrate including embedded component with symmetrical structure Grant 10,236,337 - Jung , et al.	2019-03-19
Semiconductor Device and Method of Forming SIP with Electrical Component Terminals Extending Out from Encapsulant App 20180061806 - Jung; JinHee ; et al.	2018-03-01
Semiconductor Device and Method of Forming Substrate Including Embedded Component with Symmetrical Structure App 20180053819 - Jung; JinHee ; et al.	2018-02-22
Semiconductor device and method of forming substrate including embedded component with symmetrical structure Grant 9,837,484 - Jung , et al. December 5, 2	2017-12-05
Semiconductor Device and Method of Forming Substrate Including Embedded Component with Symmetrical Structure App 20160351486 - Jung; JinHee ; et al.	2016-12-01
Integrated circuit packaging system with embedded component and method of manufacture thereof Grant 9,171,795 - Jeon , et al. October 27, 2	2015-10-27
Integrated Circuit Packaging System With Embedded Component And Method Of Manufacture Thereof App 20150171002 - Jeon; Dong Ju ; et al.	2015-06-18
Integrated circuit packaging system with coreless substrate and method of manufacture thereof Grant 8,975,665 - Jung , et al. March 10, 2	2015-03-10
Integrated Circuit Packaging System With Coreless Substrate And Method Of Manufacture Thereof App 20140097475 - Jung; JinHee ; et al.	2014-04-10

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