Jung; Jin-San

Patent Applications and Registrations

Patent applications and USPTO patent grants for Jung; Jin-San.The latest application filed is for "stage structure for semiconductor fabrication process, system of picking up semiconductor chip, and method of controlling tilting angle of pickup head".

Company Profile

1.8.10

Jung; Jin-San - Cheonan-si KR
Jung; Jin-San - Asan-si N/A KR
Jung; Jin-San - Chungcheongnam-do KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Stage structure for semiconductor fabrication process, system of picking up semiconductor chip, and method of controlling tilting angle of pickup head Grant 11,456,202 - Jung , et al. September 27, 2	2022-09-27
Semiconductor packages Grant 11,444,070 - Park , et al. September 13, 2	2022-09-13
Stage Structure For Semiconductor Fabrication Process, System Of Picking Up Semiconductor Chip, And Method Of Controlling Tilting Angle Of Pickup Head App 20220130709 - JUNG; Jin-San ; et al.	2022-04-28
Semiconductor Packages App 20210343689 - PARK; YONGJIN ; et al.	2021-11-04
Slot-mounted printed circuit board having small insertion force Grant 9,313,891 - Jung , et al. April 12, 2	2016-04-12
Semiconductor Package Module Having Self-assembled Insulation Thin Film And Method Of Manufacturing The Semiconductor Package Module App 20140334108 - JUNG; Jin-San ; et al.	2014-11-13
Reprocessing method of a semiconductor device Grant 8,759,189 - Jung June 24, 2	2014-06-24
Memory module and method of manufacturing a memory module Grant 8,641,453 - Jung , et al. February 4, 2	2014-02-04
Slot-Mounted Printed Circuit Board Having Small Insertion Force App 20130314887 - Jung; Jin-San ; et al.	2013-11-28
Reprocessing Method Of A Semiconductor Device App 20130178040 - Jung; Jin-San	2013-07-11
Working Panel And Working Panel Set Comprising Array Board Patterns App 20120318562 - Kim; Kyu-Tae ; et al.	2012-12-20
Memory Module And Method Of Manufacturing A Memory Module App 20120083139 - Jung; Jin-San ; et al.	2012-04-05
Semiconductor Package Module Having Self-assembled Insulation Thin Film And Method Of Manufacturing The Semiconductor Package Module App 20110194260 - Jung; Jin-san ; et al.	2011-08-11

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