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Patent applications and USPTO patent grants for Jung; Iksu.The latest application filed is for "hinge structure and foldale electronic device including the same".
Patent | Date |
---|---|
Electronic device with bonding structure Grant 11,402,872 - Park , et al. August 2, 2 | 2022-08-02 |
Electronic device having expandable internal space Grant 11,399,086 - Jung , et al. July 26, 2 | 2022-07-26 |
Hinge Structure And Foldale Electronic Device Including The Same App 20220206543 - Kim; Hyungsoo ;   et al. | 2022-06-30 |
Electronic Apparatus Comprising Speaker Module, And Lighting Apparatus App 20210372595 - JUNG; Iksu ;   et al. | 2021-12-02 |
Multi-foldable electronic device Grant 11,178,264 - Kim , et al. November 16, 2 | 2021-11-16 |
Electronic Device With Bonding Structure App 20210089085 - PARK; Daehyeong ;   et al. | 2021-03-25 |
Electronic device with bonding structure Grant 10,860,061 - Park , et al. December 8, 2 | 2020-12-08 |
Multi-foldable Electronic Device App 20200366770 - KIM; Seonghoon ;   et al. | 2020-11-19 |
Electronic Device Having Expandable Internal Space App 20200329132 - JUNG; Iksu ;   et al. | 2020-10-15 |
Electronic Device With Bonding Structure App 20200183455 - PARK; Daehyeong ;   et al. | 2020-06-11 |
Electronic device including heat radiating structure Grant 10,681,439 - Kim , et al. | 2020-06-09 |
Mobile terminal case and method of manufacturing the same Grant 9,729,183 - Bae , et al. August 8, 2 | 2017-08-08 |
Mobile Terminal Case And Method Of Manufacturing The Same App 20140100005 - BAE; Kwangjin ;   et al. | 2014-04-10 |
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