Jung; Eunhee

Patent Applications and Registrations

Patent applications and USPTO patent grants for Jung; Eunhee.The latest application filed is for "semiconductor package including an interposer and method of fabricating the same".

Company Profile

6.6.6

Jung; Eunhee - Hwaseong-si KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor package including an in interposer and method of fabricating the same Grant 11,367,679 - Kim , et al. June 21, 2	2022-06-21
Sensor package, method of manufacturing the same, and method of manufacturing lid structure Grant 11,131,568 - Jo , et al. September 28, 2	2021-09-28
Gas sensor package Grant 11,125,734 - Choi , et al. September 21, 2	2021-09-21
Gas sensor package and sensing apparatus including the same Grant 11,067,554 - Kim , et al. July 20, 2	2021-07-20
Semiconductor Package Including An Interposer And Method Of Fabricating The Same App 20210183757 - KIM; JI HWANG ; et al.	2021-06-17
Semiconductor package having second pad electrically connected through the interposer chip to the first pad Grant 10,923,428 - Kim , et al. February 16, 2	2021-02-16
Sensor Package, Method Of Manufacturing The Same, And Method Of Manufacturing Lid Structure App 20200386585 - JO; Sungeun ; et al.	2020-12-10
Sensor package, method of manufacturing the same, and method of manufacturing lid structure Grant 10,760,930 - Jo , et al. Sep	2020-09-01
Semiconductor Package App 20200020637 - KIM; JI HWANG ; et al.	2020-01-16
Gas Sensor Package And Sensing Apparatus Including The Same App 20190212312 - KIM; Minjin ; et al.	2019-07-11
Gas Sensor Package App 20190204281 - CHOI; INHO ; et al.	2019-07-04
Sensor Package, Method Of Manufacturing The Same, And Method Of Manufacturing Lid Structure App 20190186960 - JO; Sungeun ; et al.	2019-06-20

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