Jung; Eun-Taek

Patent Applications and Registrations

Patent applications and USPTO patent grants for Jung; Eun-Taek.The latest application filed is for "vertical type semiconductor devices and methods of manufacturing the same".

Company Profile

8.6.8

Jung; Eun-Taek - Seongnam-Si KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Vertical Type Semiconductor Devices And Methods Of Manufacturing The Same App 20220199642 - Jung; Eun-Taek ; et al.	2022-06-23
Vertical type semiconductor devices and methods of manufacturing the same Grant 11,276,709 - Jung , et al. March 15, 2	2022-03-15
Vertical Type Semiconductor Devices And Methods Of Manufacturing The Same App 20210005628 - JUNG; Eun-Taek ; et al.	2021-01-07
Vertical memory devices and methods of manufacturing the same Grant 10,854,632 - Kanamori , et al. December 1, 2	2020-12-01
Three-dimensional semiconductor device having a peripheral connection plug in a through region below a gate stack structure Grant 10,777,571 - Jung , et al. Sept	2020-09-15
Vertical type semiconductor devices and methods of manufacturing the same Grant 10,741,575 - Jung , et al. A	2020-08-11
Vertical Memory Devices And Methods Of Manufacturing The Same App 20200144288 - Kanamori; Kohji ; et al.	2020-05-07
Vertical memory devices and methods of manufacturing the same Grant 10,559,591 - Kanamori , et al. Feb	2020-02-11
Semiconductor device Grant 10,515,819 - Park , et al. Dec	2019-12-24
Vertical Memory Devices App 20190378850 - YOON; Seon-Ho ; et al.	2019-12-12
Three-dimensional Semiconductor Device App 20190237475 - JUNG; EUN TAEK ; et al.	2019-08-01
Vertical Memory Devices And Methods Of Manufacturing The Same App 20190157294 - KANAMORI; Kohji ; et al.	2019-05-23
Vertical Type Semiconductor Devices And Methods Of Manufacturing The Same App 20190148399 - Jung; Eun-Taek ; et al.	2019-05-16
Semiconductor Device App 20190013206 - PARK; Ji Hoon ; et al.	2019-01-10

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