Jung; Doo-Sung

Patent Applications and Registrations

Patent applications and USPTO patent grants for Jung; Doo-Sung.The latest application filed is for "semiconductor device including air gaps and method for fabricating the same".

Company Profile

4.7.10

Jung; Doo-Sung - Gyeonggi-do KR
Jung; Doo Sung - Suwon-si KR
Jung; Doo Sung - Gyunggi-do KR
Jung; Doo-Sung - Suwon KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor device including air gaps and method for fabricating the same Grant 11,296,088 - Hwang , et al. April 5, 2	2022-04-05
Semiconductor Device Including Air Gaps And Method For Fabricating The Same App 20190348418 - HWANG; Chang-Youn ; et al.	2019-11-14
Semiconductor device including air gaps and method for fabricating the same Grant 10,411,014 - Hwang , et al. Sept	2019-09-10
Coil type unit for wireless power transmission, wireless power transmission device, electronic device and manufacturing method of coil type unit for wireless power transmission Grant 10,186,875 - Park , et al. Ja	2019-01-22
Coil type unit for wireless power transmission, wireless power transmission device, electronic device and manufacturing method of coil type unit for wireless power transmission Grant 9,761,371 - Park , et al. September 12, 2	2017-09-12
Shield part, method of fabricating the same, and contactless power transmission device having the shield part Grant 9,502,173 - Park , et al. November 22, 2	2016-11-22
Semiconductor Device Including Air Gaps And Method For Fabricating The Same App 20160329337 - HWANG; Chang-Youn ; et al.	2016-11-10
Semiconductor device including air gaps and method for fabricating the same Grant 9,425,200 - Hwang , et al. August 23, 2	2016-08-23
Common mode filter Grant 9,236,182 - Sim , et al. January 12, 2	2016-01-12
Common Mode Filter App 20150130581 - SIM; Won-Chul ; et al.	2015-05-14
Semiconductor Device Including Air Gaps And Method For Fabricating The Same App 20150126013 - HWANG; Chang-Youn ; et al.	2015-05-07
Ceramic Substrate, Firing Setter, And Manufacturing Method Of Ceramic Substrate Using The Same App 20150111164 - Park; Seung Wook ; et al.	2015-04-23
Coil Type Unit For Wireless Power Transmission, Wireless Power Transmission Device, Electronic Device And Manufacturing Method Of Coil Type Unit For Wireless Power Transmission App 20150076919 - PARK; Seung Wook ; et al.	2015-03-19
Coil Type Unit For Wireless Power Transmission, Wireless Power Transmission Device, Electronic Device And Manufacturing Method Of Coil Type Unit For Wireless Power Transmission App 20150028686 - PARK; No Il ; et al.	2015-01-29
Shield Part, Method Of Fabricating The Same, And Contactless Power Transmission Device Having The Shield Part App 20150001951 - PARK; Seung Wook ; et al.	2015-01-01
Printed Circuit Board Having Copper Plated Layer With Roughness And Method Of Manufacturing The Same App 20140186651 - Han; Sung ; et al.	2014-07-03
Method Of Manufacturing Wafer Level Package App 20110097856 - KIM; Hong Won ; et al.	2011-04-28

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