Jung; Dongjin

Patent Applications and Registrations

Patent applications and USPTO patent grants for Jung; Dongjin.The latest application filed is for "tunable baluns for multimode power amplification".

Company Profile

2.9.10

Jung; Dongjin - Thousand Oaks CA
Jung; Dongjin - Suwon-si KR
Jung; Dongjin - Yongin-si KR
Jung; Dongjin - Icheon-si KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Capacitive-coupled bandpass filter Grant 11,211,911 - Jung , et al. December 28, 2	2021-12-28
Tunable Baluns For Multimode Power Amplification App 20210175865 - LEE; Hanseung ; et al.	2021-06-10
Capacitive-coupled Bandpass Filter App 20200228085 - Jung; Dongjin ; et al.	2020-07-16
Electronic Apparatus, Controlling Method Of Electronic Apparatus, And Computer Readable Medium App 20200186703 - Choi; Junkwon ; et al.	2020-06-11
Semiconductor devices including device isolation structures and methods of manufacturing the same Grant 9,865,453 - Moon , et al. January 9, 2	2018-01-09
Methods of fabricating semiconductor devices Grant 9,825,142 - Seo , et al. November 21, 2	2017-11-21
Semiconductor Devices Including Device Isolation Structures And Methods Of Manufacturing The Same App 20170018552 - MOON; DAEHYUN ; et al.	2017-01-19
Methods of Fabricating Semiconductor Devices App 20160181258 - Seo; HyeoungWon ; et al.	2016-06-23
Integrated circuit packaging system having a cavity Grant 8,704,365 - Park , et al. April 22, 2	2014-04-22
Integrated Circuit Packaging System Having A Cavity App 20110272807 - Park; DongSam ; et al.	2011-11-10
Integrated circuit package system with interposer Grant 8,035,210 - Yang , et al. October 11, 2	2011-10-11
Integrated circuit packaging system having a cavity Grant 7,989,950 - Park , et al. August 2, 2	2011-08-02
Package-on-package system with internal stacking module interposer Grant 7,901,987 - Yang , et al. March 8, 2	2011-03-08
Integrated circuit packaging system with layered packaging and method of manufacture thereof Grant 7,863,100 - Yang , et al. January 4, 2	2011-01-04
Integrated Circuit Packaging System With Layered Packaging And Method Of Manufacture Thereof App 20100237482 - Yang; JoungIn ; et al.	2010-09-23
Integrated Circuit Packaging System Having A Cavity App 20100038781 - Park; DongSam ; et al.	2010-02-18
Package-on-package System With Internal Stacking Module Interposer App 20090236718 - Yang; Joungin ; et al.	2009-09-24
Integrated Circuit Package System With Interposer App 20090166835 - Yang; Joungin ; et al.	2009-07-02

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