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Patent applications and USPTO patent grants for Jung; Dai Hyun.The latest application filed is for "semiconductor package and method for manufacturing the same".
Patent | Date |
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Semiconductor package and method for manufacturing the same Grant 8,829,678 - Lee , et al. September 9, 2 | 2014-09-09 |
Semiconductor Package And Method For Manufacturing The Same App 20130328192 - Lee; Jeong Seok ;   et al. | 2013-12-12 |
Peptide derivatives and cosmetic composition comprising the same Grant 8,435,548 - Jung , et al. May 7, 2 | 2013-05-07 |
Caffeoylalphaneoendorphin Peptide Derivative And Use Thereof As Anti-itching And Anti-atopic Agents App 20130079287 - JUNG; Dai Hyun ;   et al. | 2013-03-28 |
Peptide Derivatives And Cosmetic Composition Comprising The Same App 20100261879 - JUNG; Dai Hyun ;   et al. | 2010-10-14 |
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