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name:-0.028604984283447
name:-0.014389038085938
name:-0.011631965637207
Jun; Kyoung Jin Patent Filings

Jun; Kyoung Jin

Patent Applications and Registrations

Patent applications and USPTO patent grants for Jun; Kyoung Jin.The latest application filed is for "laminated electronic component and circuit board for mounting the same".

Company Profile
5.9.15
  • Jun; Kyoung Jin - Suwon-si KR
  • Jun; Kyoung-Jin - Siheung KR
  • Jun; Kyoung Jin - Gyunggi-do KR
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Laminated electronic component and circuit board for mounting the same
Grant 10,714,265 - Son , et al.
2020-07-14
Electronic component and board having electronic component mounted thereon
Grant 10,448,502 - Kim , et al. Oc
2019-10-15
Multi-layer ceramic capacitor assembly
Grant 10,319,525 - Lee , et al.
2019-06-11
Laminated Electronic Component And Circuit Board For Mounting The Same
App 20190172651 - SON; Soo Hwan ;   et al.
2019-06-06
Composite electronic component and board having the same
Grant 10,229,790 - Park , et al.
2019-03-12
Multi-layer Ceramic Capacitor Assembly
App 20180114646 - LEE; Soon-Ju ;   et al.
2018-04-26
Multilayer ceramic electronic component and board having the same
Grant 9,818,541 - Park , et al. November 14, 2
2017-11-14
Multilayer ceramic component having metal frames connected to external electrodes thereof and board having the same
Grant 9,775,244 - Park , et al. September 26, 2
2017-09-26
Multilayer ceramic electronic component and board having the same
Grant 9,697,953 - Park , et al. July 4, 2
2017-07-04
Electronic Component And Board Having Electronic Component Mounted Thereon
App 20170105283 - KIM; Ho Yoon ;   et al.
2017-04-13
Laminated Electronic Component And Circuit Board For Mounting The Same
App 20170011854 - SON; Soo Hwan ;   et al.
2017-01-12
Electronic component and board having the same
Grant 9,520,233 - Jun , et al. December 13, 2
2016-12-13
Electronic Component And Board Having The Same
App 20160217926 - JUN; Kyoung Jin ;   et al.
2016-07-28
Multi-layer Ceramic Capacitor Assembly
App 20160217929 - Lee; Soon-Ju ;   et al.
2016-07-28
Multilayer Ceramic Component And Board Having The Same
App 20160217928 - PARK; Heung Kil ;   et al.
2016-07-28
Composite Electronic Component And Board Having The Same
App 20160133386 - PARK; Sang Soo ;   et al.
2016-05-12
Multilayer Ceramic Electronic Component And Board Having The Same
App 20160126013 - PARK; Heung Kil ;   et al.
2016-05-05
Multilayer Ceramic Electronic Component And Board Having The Same
App 20160120027 - PARK; Heung Kil ;   et al.
2016-04-28
Multilayer Ceramic Electronic Component And Board Having The Same
App 20160118190 - PARK; Heung Kil ;   et al.
2016-04-28
Multilayer Ceramic Electronic Component And Board Having The Same
App 20160086730 - PARK; Heung Kil ;   et al.
2016-03-24
Multilayer ceramic capacitor
Grant 8,248,752 - Hur , et al. August 21, 2
2012-08-21
Multilayer Ceramic Capacitor And Method Of Manufacturing The Same
App 20120147517 - HUR; Kang Heon ;   et al.
2012-06-14
Multilayer Ceramic Capacitor
App 20110157767 - HUR; Kang Heon ;   et al.
2011-06-30
Multilayer Ceramic Capacitor
App 20110141658 - NA; Eun Sang ;   et al.
2011-06-16

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