Jun; Byung Ho

Patent Applications and Registrations

Patent applications and USPTO patent grants for Jun; Byung Ho.The latest application filed is for "conductive paste for external electrodes and multilayer ceramic electronic component manufactured using the same".

Company Profile

2.11.24

Jun; Byung Ho - Suwon-Si KR
JUN; Byung Ho - Suwon KR
Jun; Byung-Ho - Seoul N/A KR
Jun; Byung Ho - Gyeonggi-do KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Conductive paste for external electrodes and multilayer ceramic electronic component manufactured using the same Grant 9,330,847 - Jun , et al. May 3, 2	2016-05-03
Conductive Paste For External Electrodes And Multilayer Ceramic Electronic Component Manufactured Using The Same App 20150213953 - JUN; Byung Ho ; et al.	2015-07-30
Static-protective Component And Static-protective Composition App 20150103464 - KOO; Bon Seok ; et al.	2015-04-16
Method And Apparatus For Controlling Failure Of Motor-driven Power Steering System App 20130332029 - Kim; Min Jung ; et al.	2013-12-12
Inkjet ink composition Grant 8,389,601 - Kim , et al. March 5, 2	2013-03-05
Apparatus and method for manufacturing metal nanoparticles Grant 8,388,725 - Lee , et al. March 5, 2	2013-03-05
Conductive Metal Paste Composition And Method Of Manufacturing The Same App 20120219787 - JUN; Byung Ho ; et al.	2012-08-30
Copper Nano Paste, Method For Forming The Copper Nano Paste, And Method For Forming Electrode Using The Copper Nano Paste App 20120220072 - KIM; Dong Hoon ; et al.	2012-08-30
Method Of Forming Conductive Electrode Structure And Method Of Manufacturing Solar Cell With The Same, And Solar Cell Manufactured By The Method Of Manufacturing Solar Cell App 20120060912 - Cho; Su Hwan ; et al.	2012-03-15
Metal ink composition and method for forming the metal line using the same, and conductive pattern formed by using the metal ink composition App 20110315436 - Kim; Tae Hoon ; et al.	2011-12-29
Metal ink composition and method for forming the metal line using the same, and conductive pattern formed by using the metal ink composition App 20110318541 - Kim; Tae Hoon ; et al.	2011-12-29
Method for manufacturing metal nanoparticles comprising rod-shaped nanoparticles Grant 7,988,761 - Jun , et al. August 2, 2	2011-08-02
Method for manufacturing copper-based nanoparticles Grant 7,935,170 - Jun , et al. May 3, 2	2011-05-03
Apparatus and method for manufacturing metal nanoparticles Grant 7,935,169 - Lee , et al. May 3, 2	2011-05-03
Inkjet Ink Composition App 20110040014 - Kim; Tae-Hoon ; et al.	2011-02-17
Method of manufacturing metal nanoparticles Grant 7,867,316 - Jun , et al. January 11, 2	2011-01-11
Apparatus And Method For Manufacturing Metal Nanoparticles App 20100319489 - LEE; Young-Il ; et al.	2010-12-23
Method for manufaturing copper-based nanoparticles App 20100282022 - Jun; Byung-Ho ; et al.	2010-11-11
Method for manufacturing metal nanoparticles comprising rod-shaped nanoparticles App 20100275729 - Jun; Byung-Ho ; et al.	2010-11-04
Method for manufacturing metal nanoparticles Grant 7,744,834 - Lee , et al. June 29, 2	2010-06-29
Printed Circuit Board And Method Of Manufacturing The Same App 20100051329 - KIM; Tae-Hoon ; et al.	2010-03-04
Apparatus and method for manufacturing metal nanoparticles App 20100031774 - Lee; Young-Il ; et al.	2010-02-11
Method for producing silver nanoparticles and conductive ink Grant 7,591,872 - Jun , et al. September 22, 2	2009-09-22
Method For Producing Silver Nanoparticles And Conductive Ink App 20090223410 - Jun; Byung-Ho ; et al.	2009-09-10
Method of manufacturing metal nanoparticles App 20090120238 - Jun; Byung-Ho ; et al.	2009-05-14
Wiring forming method of printed circuit board App 20080282537 - Lee; Kwi-Jong ; et al.	2008-11-20
Method for manufacturing copper nanoparticles and copper nanoparticles manufactured using the same App 20080138643 - Lee; Kwi-Jong ; et al.	2008-06-12
Method for manufacturing metal nanoparticles App 20080041270 - Lee; Kwi-Jong ; et al.	2008-02-21
Method of producing metal nanoparticles and metal nanoparticles produced thereby App 20070275259 - Lee; Kwi-Jong ; et al.	2007-11-29
Conductive ink, preparation method thereof and conductive board App 20060261316 - Jun; Byung-Ho ; et al.	2006-11-23
Metal nano particle and method for manufacturing them and conductive ink App 20060254387 - Lee; Kwi-Jong ; et al.	2006-11-16
Method for manufacturing printed circuit board using Ag-Pd alloy nanoparticles App 20060208230 - Cho; Hye-Jin ; et al.	2006-09-21
Multi-layer ceramic capacitor and production method thereof App 20060203423 - Lee; Kwi-Jong ; et al.	2006-09-14

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