Judy; Michael W.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Judy; Michael W..The latest application filed is for "magnetic multi-turn sensor and method of manufacture".
Company Profile
4.30.29
- Judy; Michael W. - Ipswich MA
- - Ipswich MA US
- Judy; Michael W. - Wakefield MA
- Judy; Michael W. - North Andover MA
Patent Activity
| Patent | Date |
|---|---|
| Magnetic Multi-turn Sensor And Method Of Manufacture App 20220075010 - Meehan; Peter ; et al. | 2022-03-10 |
| Multiple-axis resonant accelerometers Grant 10,545,167 - Zhang , et al. Ja | 2020-01-28 |
| Stress isolation platform for MEMS devices Grant 10,167,189 - Zhang , et al. J | 2019-01-01 |
| MEMS device with stress relief structures Grant 9,676,614 - Johari-Galle , et al. June 13, 2 | 2017-06-13 |
| Multiple-axis Resonant Accelerometers App 20170108529 - Zhang; Xin ; et al. | 2017-04-20 |
| MEMS sensor with dynamically variable reference capacitance Grant 9,410,981 - Zhang , et al. August 9, 2 | 2016-08-09 |
| Silicon-Based MEMS Devices Including Wells Embedded with High Density Metal App 20160178656 - Zhang; Xin ; et al. | 2016-06-23 |
| Time Multiplexed Electrodes in MEMS Inertial Sensors App 20160131480 - Gregory; Jeffrey A. ; et al. | 2016-05-12 |
| Stress Isolation Platform for MEMS Devices App 20160090297 - Zhang; Xin ; et al. | 2016-03-31 |
| Tilt mode accelerometer with improved offset and noise performance Grant 9,297,825 - Zhang , et al. March 29, 2 | 2016-03-29 |
| MEMS Sensor With Dynamically Variable Reference Capacitance App 20150355222 - Zhang; Xin ; et al. | 2015-12-10 |
| Apparatus and method of wafer bonding using compatible alloy Grant 8,956,904 - Martin , et al. February 17, 2 | 2015-02-17 |
| MEMS sensor with movable Z-axis sensing element Grant 8,939,029 - Zhang , et al. January 27, 2 | 2015-01-27 |
| Apparatus and method for anchoring electrodes in MEMS devices Grant 08919199 - | 2014-12-30 |
| Apparatus and method for anchoring electrodes in MEMS devices Grant 8,919,199 - Judy , et al. December 30, 2 | 2014-12-30 |
| Tilt Mode Accelerometer with improved Offset and Noise Performance App 20140251011 - Zhang; Xin ; et al. | 2014-09-11 |
| MEMS Device With Stress Relief Structures App 20140217521 - Johari-Galle; Houri ; et al. | 2014-08-07 |
| Non-degenerate mode MEMS gyroscope Grant 8,794,068 - Judy , et al. August 5, 2 | 2014-08-05 |
| Multi-stage stopper system for MEMS devices Grant 8,516,891 - Zhang , et al. August 27, 2 | 2013-08-27 |
| Microphone with variable low frequency cutoff Grant 8,447,054 - Bharatan , et al. May 21, 2 | 2013-05-21 |
| Apparatus and Method of Wafer Bonding Using Compatible Alloy App 20130023082 - Martin; John R. ; et al. | 2013-01-24 |
| Multi-Stage Stopper System for MEMS Devices App 20120228725 - Zhang; Xin ; et al. | 2012-09-13 |
| MEMS Sensor with Movable Z-Axis Sensing Element App 20120223726 - Zhang; Xin ; et al. | 2012-09-06 |
| Non-Degenerate Mode MEMS Gyroscope App 20120137774 - Judy; Michael W. ; et al. | 2012-06-07 |
| Apparatus and Method for Anchoring Electrodes in MEMS Devices App 20120137773 - Judy; Michael W. ; et al. | 2012-06-07 |
| MEMS sensor with movable z-axis sensing element Grant 8,146,425 - Zhang , et al. April 3, 2 | 2012-04-03 |
| Microphone with pressure relief Grant 8,111,871 - Zhang , et al. February 7, 2 | 2012-02-07 |
| Microphone with Variable Low Frequency Cutoff App 20110110550 - Bharatan; Sushil ; et al. | 2011-05-12 |
| Sensor system Grant 7,821,084 - Martin , et al. October 26, 2 | 2010-10-26 |
| Capped sensor Grant 7,795,723 - Chau , et al. September 14, 2 | 2010-09-14 |
| MEMS Sensor with Movable Z-Axis Sensing Element App 20100058865 - Zhang; Xin ; et al. | 2010-03-11 |
| Microphone with Pressure Relief App 20080175418 - Zhang; Xin ; et al. | 2008-07-24 |
| Inertial sensor Grant 7,363,816 - Judy , et al. April 29, 2 | 2008-04-29 |
| Sensor System App 20080087086 - Martin; John R. ; et al. | 2008-04-17 |
| Sensor system Grant 7,327,003 - Martin , et al. February 5, 2 | 2008-02-05 |
| Inertial sensor App 20070180912 - Judy; Michael W. ; et al. | 2007-08-09 |
| Packaged microchip with premolded-type package Grant 7,166,911 - Karpman , et al. January 23, 2 | 2007-01-23 |
| Apparatus and method for anchoring micromachined structures Grant 7,134,340 - Samuels , et al. November 14, 2 | 2006-11-14 |
| Sensor system App 20060180896 - Martin; John R. ; et al. | 2006-08-17 |
| Bonded wafer optical MEMS process Grant 7,083,997 - Brosnihhan , et al. August 1, 2 | 2006-08-01 |
| Apparatus and method for anchoring micromachined structures App 20050262942 - Samuels, Howard R. ; et al. | 2005-12-01 |
| Apparatus and method of forming a device layer Grant 6,964,894 - Wachtmann , et al. November 15, 2 | 2005-11-15 |
| Fabricating complex micro-electromechanical systems using a flip bonding technique Grant 6,964,882 - Yun , et al. November 15, 2 | 2005-11-15 |
| Capped sensor App 20050205959 - Chau, Kevin H.-L. ; et al. | 2005-09-22 |
| Fabricating integrated micro-electromechanical systems using an intermediate electrode layer Grant 6,933,163 - Yun , et al. August 23, 2 | 2005-08-23 |
| Fiber-attached optical devices with in-plane micromachined mirrors Grant 6,931,170 - Yun , et al. August 16, 2 | 2005-08-16 |
| Stress sensitive microchip with premolded-type package App 20050056870 - Karpman, Maurice S. ; et al. | 2005-03-17 |
| Packaged microchip with premolded-type package App 20050035446 - Karpman, Maurice S. ; et al. | 2005-02-17 |
| Apparatus and method of forming a device layer App 20040256689 - Wachtmann, Bruce K. ; et al. | 2004-12-23 |
| Fiber-attached optical devices with in-plane micromachined mirrors App 20040076366 - Yun, Chang-Han ; et al. | 2004-04-22 |
| Fabricating complex micro-electromechanical systems using a flip bonding technique App 20040061192 - Yun, Chang-Han ; et al. | 2004-04-01 |
| Fabricating complex micro-electromechanical systems using a dummy handling substrate App 20040063237 - Yun, Chang-Han ; et al. | 2004-04-01 |
| Fabricating complex micro-electromechanical systems using an intermediate electrode layer App 20040063239 - Yun, Chang-Han ; et al. | 2004-04-01 |
| Bonded wafer optical MEMS process App 20020117728 - Brosnihhan, Timothy J. ; et al. | 2002-08-29 |
| Apparatus and method for multi-axis capacitive sensing Grant 5,939,633 - Judy August 17, 1 | 1999-08-17 |
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