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Patent applications and USPTO patent grants for Juang; Jeng-En.The latest application filed is for "microelectroforming mold using a preformed metal as the substrate and the fabrication method of the same".
Patent | Date |
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Microelectroforming mold using a preformed metal as the substrate and the fabrication method of the same Grant 6,881,369 - Lee , et al. April 19, 2 | 2005-04-19 |
Micro fabrication with vortex shaped spirally topographically tapered spirally patterned conductor layer and method for fabrication thereof Grant 6,734,074 - Chen , et al. May 11, 2 | 2004-05-11 |
Microelectroforming mold using a preformed metal as the substrate and the fabrication method of the same App 20030199163 - Lee, Yuh-Wen ;   et al. | 2003-10-23 |
Micro fabrication with vortex shaped spirally topographically tapered spirally patterned conductor layer and method for fabrication thereof App 20030139015 - Chen, Wei-Su ;   et al. | 2003-07-24 |
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