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name:-0.012672901153564
name:-0.005385160446167
name:-0.00048303604125977
Juang; Aruong Patent Filings

Juang; Aruong

Patent Applications and Registrations

Patent applications and USPTO patent grants for Juang; Aruong.The latest application filed is for "module card ejecting mechanism".

Company Profile
0.4.9
  • Juang; Aruong - Taoyuan Hsien TW
  • Juang; Aruong - Ping-Chen TW
  • Juang; Aruong - Pingjhen City TW
  • Juang, Aruong - Ping-Jenn City TW
  • Juang, Aruong - Ping-Chen City TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Anti-misinsertion mechanism of card connector
Grant 8,056,811 - Chen , et al. November 15, 2
2011-11-15
Compound connector for two different types of electronic packages
Grant 7,390,205 - Wang , et al. June 24, 2
2008-06-24
Compound connector for two different types of electronic packages
Grant 7,367,826 - Wang , et al. May 6, 2
2008-05-06
Module Card Ejecting Mechanism
App 20070243735 - Juang; Aruong
2007-10-18
Sensor module for card connector and card connector having such sensor module
Grant 7,186,124 - Chen , et al. March 6, 2
2007-03-06
Compound connector for two different types of electronic packages
App 20060276066 - Wang; Leland ;   et al.
2006-12-07
Sensor module for card connector and card connector having such sensor module
App 20060105599 - Chen; Benny ;   et al.
2006-05-18
Anti-misinsertion mechanism of card connector
App 20060091211 - Chen; Arthur ;   et al.
2006-05-04
Low-profile stacked media card connector
App 20060054696 - Juang; Aruong
2006-03-16
Compound connector for two different types of electronic packages
App 20050208835 - Wang, Leland ;   et al.
2005-09-22
Compound connector for two different types of electronic packages
App 20050130500 - Wang, Leland ;   et al.
2005-06-16
Compound connector for two different types of electronic packages
App 20050026468 - Wang, Leland ;   et al.
2005-02-03
Compound connector for two different types of electronic packages
App 20040087194 - Wang, Leland ;   et al.
2004-05-06

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