Ju; Sang A

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ju; Sang A.The latest application filed is for "pressure detection sensor and pressure detection insole including same".

Company Profile

1.8.10

Ju; Sang A - Seoul KR
Ju; Sang A - Gyeonggi-do KR
JU; SANG A. - GYEONGGI-DO KR
Ju; Sang A. - Seoul KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Pressure detection sensor and pressure detection insole including same Grant 10,918,156 - Jo , et al. February 16, 2	2021-02-16
Pressure Detection Sensor And Pressure Detection Insole Including Same App 20190289951 - JO; Hyun Jin ; et al.	2019-09-26
Inorganic filler, epoxy resin composition including the same and light emitting element including insulating layer using the composition Grant 10,392,499 - Yun , et al. A	2019-08-27
Inorganic filler, resin composition comprising the same and heat radiation substrate using the same Grant 9,902,841 - Ju , et al. February 27, 2	2018-02-27
Broadband antenna in the crash pad for vehicle Grant 9,899,730 - Yang , et al. February 20, 2	2018-02-20
Broadband Antenna In The Crash Pad For Vehicle App 20170346174 - YANG; TAE HOON ; et al.	2017-11-30
Inorganic Filler, Resin Composition Comprising The Same And Heat Radiation Substrate Using The Same App 20170233554 - JU; Sang A ; et al.	2017-08-17
Inorganic filler, resin composition comprising the same and heat radiation substrate using the same Grant 9,670,340 - Ju , et al. June 6, 2	2017-06-06
Inorganic Filler, Epoxy Resin Composition Including The Same And Light Emitting Element Including Insulating Layer Using The Composition App 20170130033 - YUN; Sung Jin ; et al.	2017-05-11
Inorganic Filler, Resin Composition Comprising The Same And Heat Radiation Substrate Using The Same App 20170058107 - Ju; Sang A ; et al.	2017-03-02
Inorganic filler, resin composition comprising the same and heat radiation substrate using the same Grant 9,505,914 - Ju , et al. November 29, 2	2016-11-29
Epoxy resin composition and printed circuit board including insulating layer using the epoxy resin composition Grant 9,462,689 - Kil , et al. October 4, 2	2016-10-04
Inorganic Filler, Resin Composition Comprising The Same And Heat Radiation Substrate Using The Same App 20160222195 - JU; Sang A ; et al.	2016-08-04
Epoxy Resin Composition And Printed Circuit Board Including Insulating Layer Using The Epoxy Resin Composition App 20150305152 - KIL; Geon Young ; et al.	2015-10-22
Transparent Conductive Film, Method of Manufacturing the Same, and Touch Panel Having the Same App 20140202734 - Ju; Sang A ; et al.	2014-07-24

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