Ju; Jianhong
Patent Applications and Registrations
Patent applications and USPTO patent grants for Ju; Jianhong.The latest application filed is for "stacked dual-die packages, methods of making, and systems incorporating said packages".
- Ju; Jianhong - Gorham ME
| Patent | Date |
|---|---|
| Stacked dual-die packages, methods of making, and systems incorporating said packages Grant 7,768,123 - Liu , et al. August 3, 2 | 2010-08-03 |
| Stacked Dual-Die Packages, Methods of Making, and Systems Incorporating Said Packages App 20090079092 - Liu; Yong ; et al. | 2009-03-26 |
| Current transfer logic Grant 7,154,307 - Pradhan , et al. December 26, 2 | 2006-12-26 |
| Failsafe for differential circuit based on current sense scheme Grant 6,927,599 - Ju , et al. August 9, 2 | 2005-08-09 |
| Failsafe For Differential Circuit Based On Current Sense Scheme App 20050110515 - Ju, Jianhong ; et al. | 2005-05-26 |
| Current transfer logic App 20050110529 - Pradhan, Pravas ; et al. | 2005-05-26 |
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