loadpatents
name:-0.016340017318726
name:-0.1692419052124
name:-0.00054097175598145
Joyner; Keith A. Patent Filings

Joyner; Keith A.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Joyner; Keith A..The latest application filed is for "methods and apparatus for inducing stress in a semiconductor device".

Company Profile
0.20.8
  • Joyner; Keith A. - Dallas TX
  • Joyner; Keith A. - Richardson TX
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Method for manufacturing and structure for transistors with reduced gate to contact spacing
Grant 7,459,734 - Joyner , et al. December 2, 2
2008-12-02
Methods and apparatus for inducing stress in a semiconductor device
Grant 7,339,214 - Wasshuber , et al. March 4, 2
2008-03-04
Means for forming SOI
Grant 7,101,772 - Houston , et al. September 5, 2
2006-09-05
Methods and apparatus for inducing stress in a semiconductor device
App 20050029560 - Wasshuber, Christoph ;   et al.
2005-02-10
Method for manufacturing and structure for transistors with reduced gate to contact spacing
App 20040211992 - Joyner, Keith A. ;   et al.
2004-10-28
Methods and apparatus for inducing stress in a semiconductor device
Grant 6,806,151 - Wasshuber , et al. October 19, 2
2004-10-19
Semiconductor device with fully self-aligned local interconnects, and method for fabricating the device
App 20040192027 - Houston, Theodore W. ;   et al.
2004-09-30
Process to improve Nwell-Nwell isolation with a blanket low dose high energy implant
App 20040169236 - Sridhar, Seetharaman ;   et al.
2004-09-02
Method for manufacturing and structure for transistors with reduced gate to contact spacing including etching to thin the spacers
Grant 6,767,777 - Joyner , et al. July 27, 2
2004-07-27
Semiconductor device with fully self-aligned local interconnects, and method for fabricating the device
Grant 6,737,347 - Houston , et al. May 18, 2
2004-05-18
Methods and apparatus for inducing stress in a semiconductor device
App 20030111699 - Wasshuber, Christoph ;   et al.
2003-06-19
Method for manufacturing and structure for transistors with reduced gate to contact spacing
App 20020106875 - Joyner, Keith A. ;   et al.
2002-08-08
Process to improve Nwell-Nwell isolation with a blanket low dose high energy implant
App 20020086499 - Sridhar, Seetharaman ;   et al.
2002-07-04
Means for forming SOI
App 20020086463 - Houston, Theodore W. ;   et al.
2002-07-04
Annealed porous silicon with epitaxial layer for SOI
Grant 6,376,285 - Joyner , et al. April 23, 2
2002-04-23
Variable porosity porous silicon isolation
Grant 6,376,859 - Swanson , et al. April 23, 2
2002-04-23
Organic sidewall spacers used with resist
Grant 6,228,747 - Joyner May 8, 2
2001-05-08
Method for forming an isolation structure in a substrate
Grant 6,214,699 - Joyner April 10, 2
2001-04-10
Self-aligned trenched-channel lateral-current-flow transistor
Grant 6,207,511 - Chapman , et al. March 27, 2
2001-03-27
Trench isolation of a CMOS structure
Grant 6,114,741 - Joyner , et al. September 5, 2
2000-09-05
Implant enhancement of titanium silicidation
Grant 6,004,871 - Kittl , et al. December 21, 1
1999-12-21
Mesa isolation Refill Process for Silicon on Insulator Technology Using Flowage Oxides as the Refill Material
Grant 5,882,981 - Rajgopal , et al. March 16, 1
1999-03-16
Varying the thickness of the surface silicon layer in a silicon-on-insulator substrate
Grant 5,548,149 - Joyner August 20, 1
1996-08-20
Systems and methods for controlling the temperature and uniformity of a wafer during a SIMOX implantation process
Grant 5,440,132 - Joyner , et al. August 8, 1
1995-08-08
Method for constructing semiconductor-on-insulator
Grant 5,429,955 - Joyner , et al. July 4, 1
1995-07-04
Varying the thickness of the surface silicon layer in a silicon-on-insulator substrate
Grant 5,364,800 - Joyner November 15, 1
1994-11-15
Reducing leakage current in silicon-on-insulator substrates
Grant 5,352,341 - Joyner October 4, 1
1994-10-04
Process for forming an electrical interconnection system on a semiconductor
Grant 4,507,851 - Joyner , et al. April 2, 1
1985-04-02

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