Joyner, II; Burton Lee

Patent Applications and Registrations

Patent applications and USPTO patent grants for Joyner, II; Burton Lee.The latest application filed is for "planar heater stack and method for making planar heater stack with cavity within planar heater substrata above substrate".

Company Profile

0.15.14

Joyner, II; Burton Lee - Lexington KY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Planar heater stack and method for making planar heater stack with cavity within planar heater substrata above substrate Grant 8,888,251 - Guan , et al. November 18, 2	2014-11-18
Planar heater stack and method for making planar heater stack with cavity within planar heater substrata above substrate Grant 8,414,786 - Guan , et al. April 9, 2	2013-04-09
Planar Heater Stack And Method For Making Planar Heater Stack With Cavity Within Planar Heater Substrata Above Substrate App 20130076837 - Guan; Yimin ; et al.	2013-03-28
Fin-shaped heater stack and method for formation Grant 8,366,245 - Guan , et al. February 5, 2	2013-02-05
Process for making a micro-fluid ejection head structure Grant 8,158,336 - Bell , et al. April 17, 2	2012-04-17
Heater chips with silicon die bonded on silicon substrate Grant 8,087,756 - Anderson , et al. January 3, 2	2012-01-03
Heater stack and method for making heater stack with cavity between heater element and substrate Grant 8,079,672 - Guan , et al. December 20, 2	2011-12-20
Heater stack having resistive layer with underlying insulative gap and method for making heater stack Grant 8,042,912 - Guan , et al. October 25, 2	2011-10-25
Heater Chips With Silicon Die Bonded On Silicon Substrate App 20110205305 - Anderson; Frank Edward ; et al.	2011-08-25
Method For Forming A Fluid Ejection Device App 20110123932 - Guan; Yimin ; et al.	2011-05-26
Heater chips with silicon die bonded on silicon substrate and methods of fabricating the heater chips Grant 7,938,513 - Anderson , et al. May 10, 2	2011-05-10
Protective Layers For Micro-fluid Ejection Devices And Methods For Depositing Same App 20100321447 - Cornell; Robert Wilson ; et al.	2010-12-23
Heater stack and method for making heater stack with heater element decoupled from substrate Grant 7,841,702 - Guan , et al. November 30, 2	2010-11-30
Process For Making A Micro-fluid Ejection Head Structure App 20100229392 - Bell; Byron Vencent ; et al.	2010-09-16
Process for making a micro-fluid ejection head structure Grant 7,784,917 - Bell , et al. August 31, 2	2010-08-31
Fin-Shaped Heater Stack And Method For Formation App 20100165054 - Guan; Yimin ; et al.	2010-07-01
Heater Stack Having Resistive Layer with Underlying Insulative Gap and Method for Making Heater Stack App 20100165052 - Guan; Yimin ; et al.	2010-07-01
Heater Stack And Method For Making Heater Stack With Heater Element Decoupled From Substrate App 20100110145 - Guan; Yimin ; et al.	2010-05-06
Heater Stack And Method For Making Heater Stack With Cavity Between Heater Element And Substrate App 20100110146 - Guan; Yimin ; et al.	2010-05-06
Planar Heater Stack And Method For Making Planar Heater Stack With Cavity Within Planar Heater Substrata Above Substrate App 20100111509 - Guan; Yimin ; et al.	2010-05-06
Heater Chips With Silicon Die Bonded On Silicon Substrate And Methods Of Fabricating The Heater Chips App 20090256891 - Anderson; Frank Edward ; et al.	2009-10-15
Method For Forming An Ink Jetting Device App 20090233386 - Guan; Yimin ; et al.	2009-09-17
Substantially planar fluid ejection actuators and methods related thereto Grant 7,559,630 - Bell , et al. July 14, 2	2009-07-14
Process For Making A Micro-fluid Ejection Head Structure App 20090091604 - Bell; Byron Vencent ; et al.	2009-04-09
Substantially planar ejection actuators and methods relating thereto Grant 7,452,058 - Cornell , et al. November 18, 2	2008-11-18

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