Patent | Date |
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Trench Contact Structures For Advanced Integrated Circuit Structure Fabrication App 20210249524 - JOSHI; Subhash M. ;   et al. | 2021-08-12 |
Trench contact structures for advanced integrated circuit structure fabrication Grant 11,088,261 - Joshi , et al. August 10, 2 | 2021-08-10 |
Self-aligned Contacts App 20210134673 - BOHR; Mark T. ;   et al. | 2021-05-06 |
Trench contact structures for advanced integrated circuit structure fabrication Grant 10,957,782 - Joshi , et al. March 23, 2 | 2021-03-23 |
Self-aligned contacts Grant 10,930,557 - Bohr , et al. February 23, 2 | 2021-02-23 |
Source/drain Contacts For Non-planar Transistors App 20200357916 - PRADHAN; Sameer S. ;   et al. | 2020-11-12 |
Source/drain contacts for non-planar transistors Grant 10,770,591 - Pradhan , et al. Sep | 2020-09-08 |
Self-aligned Contacts App 20200251387 - Kind Code | 2020-08-06 |
Self-aligned contacts Grant 10,629,483 - Bohr , et al. | 2020-04-21 |
Trench Contact Structures For Advanced Integrated Circuit Structure Fabrication App 20200027965 - JOSHI; Subhash M. ;   et al. | 2020-01-23 |
Fin sculpting and cladding during replacement gate process for transistor channel applications Grant 10,403,626 - Glass , et al. Sep | 2019-09-03 |
Pre-sculpting of Si fin elements prior to cladding for transistor channel applications Grant 10,396,203 - Glass , et al. A | 2019-08-27 |
Source/drain Contacts For Non-planar Transistors App 20190221662 - PRADHAN; Sameer S. ;   et al. | 2019-07-18 |
Trench Contact Structures For Advanced Integrated Circuit Structure Fabrication App 20190165136 - JOSHI; Subhash M. ;   et al. | 2019-05-30 |
Source/drain contacts for non-planar transistors Grant 10,283,640 - Pradhan , et al. | 2019-05-07 |
Self-aligned Contacts App 20190051558 - Bohr; Mark T. ;   et al. | 2019-02-14 |
Pre-sculpting Of Si Fin Elements Prior To Cladding For Transistor Channel Applications App 20190006508 - GLASS; Glenn A. ;   et al. | 2019-01-03 |
Self-aligned contacts Grant 10,141,226 - Bohr , et al. Nov | 2018-11-27 |
Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same Grant 10,037,956 - Datta , et al. July 31, 2 | 2018-07-31 |
Non-planar transistors and methods of fabrication thereof Grant 10,032,915 - Joshi , et al. July 24, 2 | 2018-07-24 |
Pre-sculpting of Si fin elements prior to cladding for transistor channel applications Grant 10,014,412 - Glass , et al. July 3, 2 | 2018-07-03 |
Self-aligned Contacts App 20180096891 - Bohr; Mark T. ;   et al. | 2018-04-05 |
Self-aligned contacts Grant 9,892,967 - Bohr , et al. February 13, 2 | 2018-02-13 |
Source/drain contacts for non-planar transistors Grant 9,853,156 - Pradhan , et al. December 26, 2 | 2017-12-26 |
Source/drain Contacts For Non-planar Transistors App 20170323966 - Pradhan; Sameer S. ;   et al. | 2017-11-09 |
Transistor Fabrication Technique Including Sacrificial Protective Layer For Source/drain At Contact Location App 20170229342 - GLASS; GLENN A. ;   et al. | 2017-08-10 |
Pre-sculpting Of Si Fin Elements Prior To Cladding For Transistor Channel Applications App 20170222035 - GLASS; Glenn A. ;   et al. | 2017-08-03 |
Copper-containing C4 Ball-limiting Metallurgy Stack For Enhanced Reliability Of Packaged Structures And Method Of Making Same App 20170141062 - Datta; Madhav ;   et al. | 2017-05-18 |
Pre-sculpting of Si fin elements prior to cladding for transistor channel applications Grant 9,653,584 - Glass , et al. May 16, 2 | 2017-05-16 |
Fin Sculpting And Cladding During Replacement Gate Process For Transistor Channel Applications App 20170133376 - GLASS; GLENN A. ;   et al. | 2017-05-11 |
Transistor fabrication technique including sacrificial protective layer for source/drain at contact location Grant 9,633,835 - Glass , et al. April 25, 2 | 2017-04-25 |
Self-aligned Contacts App 20170040218 - Bohr; Mark T. ;   et al. | 2017-02-09 |
Non-planar Transistors And Methods Of Fabrication Thereof App 20160351716 - Joshi; Subhash M. ;   et al. | 2016-12-01 |
Self-aligned contacts Grant 9,508,821 - Bohr , et al. November 29, 2 | 2016-11-29 |
Pre-sculpting Of Si Fin Elements Prior To Cladding For Transistor Channel Applications App 20160308032 - GLASS; Glenn A. ;   et al. | 2016-10-20 |
Self-aligned contacts Grant 9,466,565 - Bohr , et al. October 11, 2 | 2016-10-11 |
Source/drain contacts for non-planar transistors Grant 9,425,316 - Pradhan , et al. August 23, 2 | 2016-08-23 |
Non-planar transistors and methods of fabrication thereof Grant 9,419,106 - Joshi , et al. August 16, 2 | 2016-08-16 |
Self-aligned contacts App 20160155815 - BOHR; Mark T. ;   et al. | 2016-06-02 |
Source/drain Contacts For Non-planar Transistors App 20160111532 - Pradhan; Sameer S. ;   et al. | 2016-04-21 |
Self-aligned Contacts App 20150270216 - Bohr; Mark T. ;   et al. | 2015-09-24 |
Self-aligned contacts Grant 9,093,513 - Bohr , et al. July 28, 2 | 2015-07-28 |
Self-aligned contacts Grant 9,054,178 - Bohr , et al. June 9, 2 | 2015-06-09 |
Source/drain Contacts For Non-planar Transistors App 20150155385 - Pradhan; Sameer S. ;   et al. | 2015-06-04 |
Copper-containing C4 Ball-limiting Metallurgy Stack For Enhanced Reliability Of Packaged Structures And Method Of Making Same App 20150132940 - Datta; Madhav ;   et al. | 2015-05-14 |
Source/drain contacts for non-planar transistors Grant 8,981,435 - Pradhan , et al. March 17, 2 | 2015-03-17 |
Transistor Fabrication Technique Including Sacrificial Protective Layer For Source/drain At Contact Location App 20150069473 - Glass; Glenn A. ;   et al. | 2015-03-12 |
Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same Grant 8,952,550 - Datta , et al. February 10, 2 | 2015-02-10 |
Non-planar Transitor Fin Fabrication App 20140339646 - Joshi; Subhash M. ;   et al. | 2014-11-20 |
Self-aligned Contacts App 20140151817 - Bohr; Mark T. ;   et al. | 2014-06-05 |
Non-planar Transistors And Methods Of Fabrication Thereof App 20130264617 - Joshi; Subhash M. ;   et al. | 2013-10-10 |
Self-aligned Contacts App 20130178033 - Bohr; Mark T. ;   et al. | 2013-07-11 |
Self-aligned contacts Grant 8,436,404 - Bohr , et al. May 7, 2 | 2013-05-07 |
Recessed workfunction metal in CMOS transistor gates Grant 8,377,771 - Rachmady , et al. February 19, 2 | 2013-02-19 |
Recessed Workfunction Metal In Cmos Transistor Gates App 20120264285 - Rachmady; Willy ;   et al. | 2012-10-18 |
Recessed workfunction metal in CMOS transistor gates Grant 8,193,641 - Rachmady , et al. June 5, 2 | 2012-06-05 |
Self-aligned contacts App 20110156107 - Bohr; Mark T. ;   et al. | 2011-06-30 |
Dual Silicide Flow For Cmos App 20110147855 - Joshi; Subhash M. ;   et al. | 2011-06-23 |
Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same App 20100117229 - Datta; Madhav ;   et al. | 2010-05-13 |
Recessed workfunction metal in CMOS transistor gates App 20070262451 - Rachmady; Willy ;   et al. | 2007-11-15 |
Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same Grant 7,250,678 - Datta , et al. July 31, 2 | 2007-07-31 |
Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same Grant 7,196,001 - Datta , et al. March 27, 2 | 2007-03-27 |
Edge arrangements for integrated circuit chips Grant 7,087,452 - Joshi , et al. August 8, 2 | 2006-08-08 |
Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same App 20060148233 - Datta; Madhav ;   et al. | 2006-07-06 |
Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same Grant 6,853,076 - Datta , et al. February 8, 2 | 2005-02-08 |
Edge arrangements for integrated circuit chips App 20040212047 - Joshi, Subhash M. ;   et al. | 2004-10-28 |
Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same App 20040159947 - Datta, Madhav ;   et al. | 2004-08-19 |
Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same App 20040159944 - Datta, Madhav ;   et al. | 2004-08-19 |
Thermo-mechanically robust C4 ball-limiting metallurgy to prevent failure due to die-package interaction and method of making same Grant 6,740,427 - Datta , et al. May 25, 2 | 2004-05-25 |
Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same App 20030057551 - Datta, Madhav ;   et al. | 2003-03-27 |
Dual-stack, ball-limiting metallurgy and method of making same App 20030060041 - Datta, Madhav ;   et al. | 2003-03-27 |
Thermo-mechanically robust C4 ball-limiting metallurgy to prevent failure due to die-package interaction and method of making same App 20030059644 - Datta, Madhav ;   et al. | 2003-03-27 |