Joshi; Jaydutt Jagdish
Patent Applications and Registrations
Patent applications and USPTO patent grants for Joshi; Jaydutt Jagdish.The latest application filed is for "radio-frequency package with overmold structure".
- Joshi; Jaydutt Jagdish - Irvine CA
| Patent | Date |
|---|---|
| Flip-chip amplifier with termination circuit Grant 10,141,901 - Zhang , et al. Nov | 2018-11-27 |
| Radio-frequency Package With Overmold Structure App 20180198436 - JOSHI; Jaydutt Jagdish | 2018-07-12 |
| Methods for improving thermal performance of flip chip packages Grant 9,691,683 - Joshi June 27, 2 | 2017-06-27 |
| Flip-chip Amplifier With Termination Circuit App 20160380603 - Zhang; Guohao ; et al. | 2016-12-29 |
| Flip-chip linear power amplifier with high power added efficiency Grant 9,467,940 - Zhang , et al. October 11, 2 | 2016-10-11 |
| Electronic devices with improved thermal performance Grant 9,401,316 - Joshi July 26, 2 | 2016-07-26 |
| Electronic Devices With Improved Thermal Performance App 20150243579 - Joshi; Jaydutt Jagdish | 2015-08-27 |
| Methods For Improving Thermal Performance Of Flip Chip Packages App 20150243580 - Joshi; Jaydutt Jagdish | 2015-08-27 |
| Flip-chip Linear Power Amplifier With High Power Added Efficiency App 20130130752 - Zhang; Guohao ; et al. | 2013-05-23 |
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