Joo; You Ock

Patent Applications and Registrations

Patent applications and USPTO patent grants for Joo; You Ock.The latest application filed is for "semiconductor device package and manufacturing method thereof".

Company Profile

0.6.10

Joo; You Ock - Kaohsiung TW
Joo; You Ock - Kaohsing TW
Joo; You-Ock - Paju-Si KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Chip scale package and method for manufacturing the same Grant 7,833,837 - Yang , et al. November 16, 2	2010-11-16
Semiconductor device package and manufacturing method Grant 7,700,411 - Yang , et al. April 20, 2	2010-04-20
Semiconductor device package and manufacturing method Grant 7,656,047 - Yang , et al. February 2, 2	2010-02-02
Semiconductor device package and manufacturing method thereof Grant 7,633,170 - Yang , et al. December 15, 2	2009-12-15
Semiconductor package for encapsulating multiple dies and method of manufacturing the same Grant 7,439,098 - Yang , et al. October 21, 2	2008-10-21
Semiconductor Device Package And Manufacturing Method Thereof App 20080174013 - YANG; Jun Young ; et al.	2008-07-24
Semiconductor Device Package And Manufacturing Method App 20080061407 - Yang; Jun Young ; et al.	2008-03-13
Semiconductor device package and manufacturing method App 20080042301 - Yang; Jun Young ; et al.	2008-02-21
Chip Scale Package And Method For Manufacturing The Same App 20080032452 - YANG; Jun Young ; et al.	2008-02-07
Semiconductor package and method of manufacturing the same App 20070087471 - Yang; Jun-Young ; et al.	2007-04-19
Semiconductor package having passive component disposed between semiconductor device and substrate Grant 7,166,917 - Yang , et al. January 23, 2	2007-01-23
Package structure and fabrication thereof App 20060216868 - Yang; Jun-Young ; et al.	2006-09-28
Chip scale package and method for manufacturing the same App 20060170096 - Yang; Jun Young ; et al.	2006-08-03
Semiconductor package App 20060145339 - Yang; Jun Young ; et al.	2006-07-06
Semiconductor device package and manufacturing method thereof App 20060145361 - Yang; Jun Young ; et al.	2006-07-06
Image sensor package module with a leadless leadframe between chips App 20050258518 - Yang, Jun-Young ; et al.	2005-11-24

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