JONG; Mankyo
Patent Applications and Registrations
Patent applications and USPTO patent grants for JONG; Mankyo.The latest application filed is for "semiconductor package and related methods".
- JONG; Mankyo - Bucheon KR
- Jong; Mankyo - Bucheon-si KR
| Patent | Date |
|---|---|
| Semiconductor Package And Related Methods App 20210265318 - IM; Seungwon ; et al. | 2021-08-26 |
| Semiconductor package and related methods Grant 11,037,907 - Im , et al. June 15, 2 | 2021-06-15 |
| Vertically stacked multichip modules Grant 10,658,342 - Jong , et al. | 2020-05-19 |
| Semiconductor die package and manufacturing method Grant 10,586,754 - Im , et al. | 2020-03-10 |
| Vertically Stacked Multichip Modules App 20190393196 - JONG; Mankyo ; et al. | 2019-12-26 |
| Vertically stacked multichip modules Grant 10,483,237 - Jong , et al. Nov | 2019-11-19 |
| Semiconductor Package And Related Methods App 20190348399 - IM; Seungwon ; et al. | 2019-11-14 |
| Semiconductor package and related methods Grant 10,403,601 - Im , et al. Sep | 2019-09-03 |
| Stray inductance reduction in packaged semiconductor devices and modules Grant 10,090,279 - Im , et al. October 2, 2 | 2018-10-02 |
| Stray Inductance Reduction In Packaged Semiconductor Devices And Modules App 20180254262 - IM; Seungwon ; et al. | 2018-09-06 |
| Vertically Stacked Multichip Modules App 20180138152 - JONG; Mankyo ; et al. | 2018-05-17 |
| Semiconductor Die Package And Manufacturing Method App 20180122725 - IM; Seungwon ; et al. | 2018-05-03 |
| Semiconductor Package And Related Methods App 20170365583 - IM; Seungwon ; et al. | 2017-12-21 |
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