Jones; Frank Tim
Patent Applications and Registrations
Patent applications and USPTO patent grants for Jones; Frank Tim.The latest application filed is for "dual-flag stacked die package".
- Jones; Frank Tim - Gilbert AZ
- Jones; Frank Tim - Chandler AZ
| Patent | Date |
|---|---|
| Dual-flag stacked die package Grant 9,379,048 - Jones , et al. June 28, 2 | 2016-06-28 |
| Dual-flag Stacked Die Package App 20140239472 - Jones; Frank Tim ; et al. | 2014-08-28 |
| Semiconductor package Grant 8,384,206 - St. Germain , et al. February 26, 2 | 2013-02-26 |
| Semiconductor Package App 20110169152 - St. Germain; Stephen ; et al. | 2011-07-14 |
| Method of forming a semiconductor package and structure therefor Grant 7,935,575 - St. Germain , et al. May 3, 2 | 2011-05-03 |
| Method Of Forming A Semiconductor Package And Structure Therefor App 20090250794 - ST. GERMAIN; STEPHEN ; et al. | 2009-10-08 |
| Microelectronic package including a polymer encapsulated die Grant 6,093,972 - Carney , et al. July 25, 2 | 2000-07-25 |
| Microelectronic package including a polymer encapsulated die, and method for forming same Grant 5,895,229 - Carney , et al. April 20, 1 | 1999-04-20 |
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