Johnson; Hale

Patent Applications and Registrations

Patent applications and USPTO patent grants for Johnson; Hale.The latest application filed is for "apparatus, system, and method for handling aligned wafer pairs".

Company Profile

6.18.23

Johnson; Hale - Jericho VT
- Jericho VT US

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
System and related techniques for handling aligned substrate pairs Grant 11,183,401 - Johnson , et al. November 23, 2	2021-11-23
Apparatus, System, And Method For Handling Aligned Wafer Pairs App 20210013079 - Johnson; Hale ; et al.	2021-01-14
Apparatus, system, and method for handling aligned wafer pairs Grant 10,825,705 - Johnson , et al. November 3, 2	2020-11-03
Apparatus and method for semiconductor wafer leveling, force balancing and contact sensing Grant 10,580,678 - Johnson , et al.	2020-03-03
Semiconductor bonding apparatus and related techniques Grant 10,319,615 - George , et al.	2019-06-11
Semiconductor Bonding Apparatus and Related Techniques App 20180108547 - George; Gregory ; et al.	2018-04-19
Apparatus and Method for Semiconductor Wafer Leveling, Force Balancing and Contact Sensing App 20180102270 - Johnson; Hale ; et al.	2018-04-12
Semiconductor bonding apparatus and related techniques Grant 9,875,917 - George , et al. January 23, 2	2018-01-23
Apparatus and method for aligning and centering wafers Grant 9,859,141 - Johnson , et al. January 2, 2	2018-01-02
System And Related Techniques For Handling Aligned Substrate Pairs App 20170372925 - Johnson; Hale ; et al.	2017-12-28
Apparatus and method for semiconductor wafer leveling, force balancing and contact sensing Grant 9,837,295 - Johnson , et al. December 5, 2	2017-12-05
Semiconductor Bonding Apparatus and Related Techniques App 20170243769 - George; Gregory ; et al.	2017-08-24
Apparatus, system, and method for handling aligned wafer pairs Grant 9,640,418 - Johnson , et al. May 2, 2	2017-05-02
Apparatus, System, And Method For Handling Aligned Wafer Pairs App 20160336208 - Johnson; Hale ; et al.	2016-11-17
Apparatus, System, And Method For Handling Aligned Wafer Pairs App 20160336212 - Johnson; Hale ; et al.	2016-11-17
Method for thermal-slide debonding of temporary bonded semiconductor wafers Grant 9,281,229 - George , et al. March 8, 2	2016-03-08
System Amd Method For Substrate Holding App 20150206783 - JOHNSON; HALE ; et al.	2015-07-23
Method For Thermal-slide Debonding Of Temporary Bonded Semiconductor Wafers App 20150083342 - GEORGE; GREGORY ; et al.	2015-03-26
Apparatus for thermal-slide debonding of temporary bonded semiconductor wafers Grant 08919412 -	2014-12-30
Apparatus for thermal-slide debonding of temporary bonded semiconductor wafers Grant 8,919,412 - George , et al. December 30, 2	2014-12-30
Apparatus And Method For Semiconductor Wafer Leveling, Force Balancing And Contact Sensing App 20140318683 - JOHNSON; HALE ; et al.	2014-10-30
Apparatus And Method For Aligning And Centering Wafers App 20140319786 - JOHNSON; HALE ; et al.	2014-10-30
Device for centering wafers Grant 8,764,026 - George , et al. July 1, 2	2014-07-01
Apparatus for mechanically debonding temporary bonded semiconductor wafers Grant 8,267,143 - George , et al. September 18, 2	2012-09-18
Apparatus for temporary wafer bonding and debonding Grant 8,181,688 - Johnson , et al. May 22, 2	2012-05-22
Apparatus and method for semiconductor wafer bumping via injection molded solder Grant 8,088,684 - Johnson , et al. January 3, 2	2012-01-03
Apparatus For Thermal-slide Debonding Of Temporary Bonded Semiconductor Wafers App 20110010908 - GEORGE; GREGORY ; et al.	2011-01-20
Apparatus For Temporary Wafer Bonding And Debonding App 20110014774 - JOHNSON; HALE ; et al.	2011-01-20
Device For Centering Wafers App 20100266373 - GEORGE; GREGORY ; et al.	2010-10-21
Apparatus For Mechanically Debonding Temporary Bonded Semiconductor Wafers App 20100263794 - GEORGE; GREGORY ; et al.	2010-10-21
Apparatus and method for semiconductor wafer bumping via injection molded solder Grant 7,790,596 - Johnson , et al. September 7, 2	2010-09-07
Apparatus and method for semiconductor wafer bumping via injection molded solder Grant 7,732,320 - Johnson , et al. June 8, 2	2010-06-08
Method And Apparatus For Wafer Bonding App 20100089978 - HUGHLETT; EMMETT ; et al.	2010-04-15
Apparatus And Method For Semiconductor Wafer Bumping Via Injection Molded Solder App 20080188070 - JOHNSON; HALE ; et al.	2008-08-07
Apparatus And Method For Semiconductor Wafer Bumping Via Injection Molded Solder App 20080188069 - Johnson; Hale ; et al.	2008-08-07
Apparatus And Method For Semiconductor Wafer Bumping Via Injection Molded Solder App 20080188072 - Johnson; Hale ; et al.	2008-08-07

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