Johnson; Farrah J.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Johnson; Farrah J..The latest application filed is for "flip chip dip coating encapsulant".
- Johnson; Farrah J. - Boise ID
| Patent | Date |
|---|---|
| Method of coating contacts on a surface of a flip chip Grant 7,578,056 - Johnson , et al. August 25, 2 | 2009-08-25 |
| Flip chip dip coating encapsulant App 20070102491 - Johnson; Farrah J. ; et al. | 2007-05-10 |
| Flip chip dip coating encapsulant Grant 7,150,390 - Johnson , et al. December 19, 2 | 2006-12-19 |
| Flip chip dip coating encapsulant Grant 6,551,863 - Johnson , et al. April 22, 2 | 2003-04-22 |
| Flip chip dip coating encapsulant App 20030062400 - Johnson, Farrah J. ; et al. | 2003-04-03 |
| Flip Chip Dip Coating Encapsulant App 20030045027 - Johnson, Farrah J. ; et al. | 2003-03-06 |
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