JOH; Cheol Ho

Patent Applications and Registrations

Patent applications and USPTO patent grants for JOH; Cheol Ho.The latest application filed is for "semiconductor packages including side shielding parts".

Company Profile

0.14.17

JOH; Cheol Ho - Icheon-si Gyeonggi-do KR
Joh; Cheol Ho - Icheon-si KR
Joh; Cheol Ho - Seoul KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor Packages Including Side Shielding Parts App 20170162516 - JOH; Cheol Ho	2017-06-08
Semiconductor package on which semiconductor chip is mounted on substrate with window Grant 9,490,187 - Joh November 8, 2	2016-11-08
Stack package and method for manufacturing the same Grant 9,305,912 - Shin , et al. April 5, 2	2016-04-05
Stacked package and method for manufacturing the same Grant 9,165,899 - Joh October 20, 2	2015-10-20
Semiconductor Package On Which Semiconductor Chip Is Mounted On Substrate With Window App 20150279758 - JOH; Cheol Ho	2015-10-01
Stack Package And Method For Manufacturing The Same App 20150270252 - SHIN; Hee Min ; et al.	2015-09-24
Semiconductor packages including semiconductor chips having protrusions and methods of fabricating the same Grant 9,093,441 - Kim , et al. July 28, 2	2015-07-28
Stack package and method for manufacturing the same Grant 9,082,634 - Shin , et al. July 14, 2	2015-07-14
Methods for forming interconnection line using screen printing technique Grant 8,951,810 - Lee , et al. February 10, 2	2015-02-10
Stacked Package And Method For Manufacturing The Same App 20150008580 - JOH; Cheol Ho	2015-01-08
Method and apparatus for manufacturing chip package Grant 8,822,271 - Joh September 2, 2	2014-09-02
Semiconductor Packages Including Semiconductor Chips Having Protrusions And Methods Of Fabricating The Same App 20140175638 - KIM; Ji Eun ; et al.	2014-06-26
Method And Apparatus For Manufacturing Chip Package App 20140170812 - JOH; Cheol Ho	2014-06-19
Methods For Forming Interconnection Line Using Screen Printing Technique App 20140057369 - LEE; Kyu Won ; et al.	2014-02-27
Chip unit and stack package having the same Grant 8,564,141 - Lee , et al. October 22, 2	2013-10-22
Stacked Semiconductor Package And Method For Manufacturing The Same App 20130256887 - LEE; Kyu Won ; et al.	2013-10-03
Stacked semiconductor package and method for manufacturing the same Grant 8,476,751 - Lee , et al. July 2, 2	2013-07-02
Stack Package And Method For Manufacturing The Same App 20120018879 - SHIN; Hee-Min ; et al.	2012-01-26
Chip Unit And Stack Package Having The Same App 20110272798 - LEE; Kyu Won ; et al.	2011-11-10
Stacked Semiconductor Package And Method For Manufacturing The Same App 20110272820 - LEE; Kyu Won ; et al.	2011-11-10
Wafer Mount Tape, Wafer Processing Apparatus And Method Of Using The Same For Use In Thinning Wafers App 20110189928 - SHIN; Hee Min ; et al.	2011-08-04
Flip chip package and method for manufacturing the same Grant 7,859,108 - Lee , et al. December 28, 2	2010-12-28
Stacked semiconductor package that prevents damage to semiconductor chip when wire-bonding and method for manufacturing the same Grant 7,705,468 - Joh April 27, 2	2010-04-27
Wafer Mount Tape, Wafer Processing Apparatus And Method Of Using The Same For Use In Thinning Wafers App 20100092718 - SHIN; Hee Min ; et al.	2010-04-15
Flip Chip Package And Method For Manufacturing The Same App 20090140426 - LEE; Woong Sun ; et al.	2009-06-04
Stacked Semiconductor Package That Prevents Damage To Semiconductor Chip When Wire-bonding And Method For Manufacturing The Same App 20090096075 - JOH; Cheol Ho	2009-04-16
Semiconductor Package Having Electromagnetic Shielding Part App 20080061406 - JOH; Cheol Ho	2008-03-13
Chip-stacked package App 20040262773 - Joh, Cheol Ho ; et al.	2004-12-30

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.