Jobetto; Hiroyasu

Patent Applications and Registrations

Patent applications and USPTO patent grants for Jobetto; Hiroyasu.The latest application filed is for "semiconductor device provided with tin diffusion inhibiting layer, and manufacturing method of the same".

Company Profile

0.37.37

Jobetto; Hiroyasu - Hachioji JP
JOBETTO; Hiroyasu - Hachioji-shi JP
JOBETTO; Hiroyasu - Tokyo JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor device and method for manufacturing the same Grant 8,268,674 - Jobetto September 18, 2	2012-09-18
Semiconductor device provided with tin diffusion inhibiting layer, and manufacturing method of the same Grant 8,237,277 - Jobetto August 7, 2	2012-08-07
Semiconductor device including semiconductor element surrounded by an insulating member and wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereof Grant RE43,380 - Wakisaka , et al. May 15, 2	2012-05-15
Semiconductor device including semiconductor constituent Grant 8,063,490 - Jobetto November 22, 2	2011-11-22
Semiconductor Device Provided With Tin Diffusion Inhibiting Layer, And Manufacturing Method Of The Same App 20110233769 - JOBETTO; Hiroyasu	2011-09-29
Semiconductor device having wiring line and manufacturing method thereof Grant 8,004,089 - Jobetto August 23, 2	2011-08-23
Semiconductor device having wiring line and manufacturing method thereof Grant 7,972,903 - Jobetto July 5, 2	2011-07-05
Semiconductor device having adhesion increasing film to prevent peeling Grant 7,910,405 - Okada , et al. March 22, 2	2011-03-22
Method of fabricating a semiconductor device including forming an insulating layer with a hard sheet buried therein Grant 7,867,828 - Jobetto January 11, 2	2011-01-11
Semiconductor Device Manufacturing Method App 20110001247 - JOBETTO; Hiroyasu	2011-01-06
Semiconductor Device Including Sealing Film For Encapsulating Semiconductor Chip And Projection Electrodes And Manufacturing Method Thereof App 20110001245 - JOBETTO; Hiroyasu	2011-01-06
Semiconductor Device And Method For Manufacturing The Same App 20100317154 - Jobetto; Hiroyasu	2010-12-16
Semiconductor device including wiring and manufacturing method thereof Grant 7,843,071 - Jobetto November 30, 2	2010-11-30
Semiconductor device with no base member and method of manufacturing the same Grant 7,790,515 - Jobetto September 7, 2	2010-09-07
Semiconductor Device Including Semiconductor Constituent And Manufacturing Method Thereof App 20100193938 - JOBETTO; Hiroyasu	2010-08-05
Semiconductor device and method of manufacturing the same Grant 7,737,543 - Jobetto , et al. June 15, 2	2010-06-15
Semiconductor device and method of manufacturing the same Grant RE41,369 - Jobetto June 8, 2	2010-06-08
Semiconductor device including semiconductor constituent and manufacturing method thereof Grant 7,727,862 - Jobetto June 1, 2	2010-06-01
Semiconductor package, including connected upper and lower interconnections Grant 7,709,942 - Jobetto May 4, 2	2010-05-04
Semiconductor device including semiconductor element surrounded by an insulating member wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereof Grant 7,692,282 - Wakisaka , et al. April 6, 2	2010-04-06
Semiconductor device and method of manufacturing the same Grant 7,618,886 - Jobetto , et al. November 17, 2	2009-11-17
Semiconductor package including connected upper and lower interconnections, and manufacturing method thereof Grant 7,615,411 - Jobetto November 10, 2	2009-11-10
Method of fabricating a semiconductor device incorporating a semiconductor constructing body and an interconnecting layer which is connected to a ground layer via a vertical conducting portion Grant 7,608,480 - Jobetto October 27, 2	2009-10-27
Method of fabricating semiconductor device having conducting portion of upper and lower conductive layers on a peripheral surface of the semiconductor device Grant 7,582,512 - Jobetto September 1, 2	2009-09-01
Semiconductor Device And Method Of Manufacturing The Same App 20090200665 - Jobetto; Hiroyasu ; et al.	2009-08-13
Semiconductor Device Including Wiring And Manufacturing Method Thereof App 20090194888 - JOBETTO; Hiroyasu	2009-08-06
Semiconductor Device Having Wiring Line And Manufacturing Method Thereof App 20090194885 - JOBETTO; Hiroyasu	2009-08-06
Semiconductor Device Having Wiring Line And Manufacturing Method Thereof App 20090194866 - JOBETTO; Hiroyasu	2009-08-06
Semiconductor device including semiconductor element surrounded by an insulating member and wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereof Grant 7,563,640 - Wakisaka , et al. July 21, 2	2009-07-21
Semiconductor device and method of manufacturing the same Grant 7,547,967 - Jobetto , et al. June 16, 2	2009-06-16
Semiconductor Device Including Semiconductor Constituent And Manufacturing Method Thereof App 20090051038 - Jobetto; Hiroyasu	2009-02-26
Semiconductor Device And Method For Manufacturing The Same App 20090039514 - Jobetto; Hiroyasu	2009-02-12
Semiconductor Device And Manufacturing Method Thereof App 20090039510 - JOBETTO; Hiroyasu	2009-02-12
Semiconductor device including a hard sheet to reduce warping of a base plate and method of fabricating the same Grant 7,489,032 - Jobetto February 10, 2	2009-02-10
Semiconductor device and method of manufacturing the same Grant 7,445,964 - Mihara , et al. November 4, 2	2008-11-04
Semiconductor device with increased number of external connection electrodes Grant 7,427,812 - Wakisaka , et al. September 23, 2	2008-09-23
Semiconductor Package Including Connected Upper And Lower Interconnections, And Manufacturing Method Thereof App 20080166836 - JOBETTO; Hiroyasu	2008-07-10
Semiconductor device with no base member and method of manufacturing the same App 20080122087 - Jobetto; Hiroyasu	2008-05-29
Optical sensor module with semiconductor device for drive Grant 7,378,645 - Mihara , et al. May 27, 2	2008-05-27
Semiconductor device including semiconductor element surrounded by an insulating member and wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereof Grant 7,368,813 - Wakisaka , et al. May 6, 2	2008-05-06
Semiconductor device having conducting portion of upper and lower conductive layers Grant 7,352,054 - Jobetto April 1, 2	2008-04-01
Semiconductor Device Including Semiconductor Element Surrounded By An Insulating Member And Wiring Structures On Upper And Lower Surfaces Of The Semiconductor Element And Insulating Member, And Manufacturing Method Thereof App 20080044944 - WAKISAKA; Shinji ; et al.	2008-02-21
Method Of Fabricating Semiconductor Device Having Conducting Portion Of Upper And Lower Conductive Layers On A Peripheral Surface Of The Semiconductor Device App 20080020513 - JOBETTO; Hiroyasu	2008-01-24
Semiconductor Device Including A Hard Sheet To Reduce Warping Of A Base Plate And Method Of Fabricating The Same App 20080014681 - JOBETTO; Hiroyasu	2008-01-17
Semiconductor Device Including Semiconductor Element Surrounded By An Insulating Member And Wiring Structures On Upper And Lower Surfaces Of The Semiconductor Element And Insulating Member, And Manufacturing Method Thereof App 20080006943 - WAKISAKA; Shinji ; et al.	2008-01-10
Method of fabricating a semiconductor device incorporating a semiconductor constructing body and an interconnecting layer which is connected to a ground layer via a vertical conducting portion App 20070264754 - Jobetto; Hiroyasu	2007-11-15
Semiconductor device and method of manufacturing the same Grant 7,294,922 - Jobetto , et al. November 13, 2	2007-11-13
Semiconductor device incorporating a semiconductor constructing body and an interconnecting layer which is connected to a ground layer via a vertical conducting portion Grant 7,279,750 - Jobetto October 9, 2	2007-10-09
Semiconductor device having adhesion increasing film to prevent peeling Grant 7,256,496 - Okada , et al. August 14, 2	2007-08-14
Semiconductor Device And Method Of Manufacturing The Same App 20070126127 - Jobetto; Hiroyasu ; et al.	2007-06-07
Semiconductor Device And Method Of Manufacturing The Same App 20070126128 - Jobetto; Hiroyasu ; et al.	2007-06-07
Semiconductor Device And Method Of Manufacturing The Same App 20070099409 - Mihara; Ichiro ; et al.	2007-05-03
Semiconductor device and method of manufacturing the same Grant 7,192,805 - Jobetto March 20, 2	2007-03-20
Semiconductor device and method of manufacturing the same Grant 7,183,639 - Mihara , et al. February 27, 2	2007-02-27
Semiconductor device Grant 7,064,440 - Jobetto , et al. June 20, 2	2006-06-20
Semiconductor device having heat dissipation layer Grant 7,042,081 - Wakisaka , et al. May 9, 2	2006-05-09
Semiconductor device having adhesion increasing film and method of fabricating the same App 20050269698 - Okada, Osamu ; et al.	2005-12-08
Semiconductor device incorporating semiconductor constructing body and method of fabricating the same App 20050218451 - Jobetto, Hiroyasu	2005-10-06
Semiconductor device with increased number of external connection electrodes App 20050200018 - Wakisaka, Shinji ; et al.	2005-09-15
Semiconductor device App 20050161823 - Jobetto, Hiroyasu ; et al.	2005-07-28
Optical sensor module with semiconductor device for drive App 20050161587 - Mihara, Ichiro ; et al.	2005-07-28
Semiconductor device having conducting portion of upper and lower conductive layers, and method of fabricating the same App 20050161799 - Jobetto, Hiroyasu	2005-07-28
Semiconductor device and method of manufacturing the same App 20050146051 - Jobetto, Hiroyasu	2005-07-07
Semiconductor device and manufacturing method thereof App 20050140021 - Wakisaka, Shinji ; et al.	2005-06-30
Semiconductor device and method of fabricating the same App 20050140007 - Jobetto, Hiroyasu	2005-06-30
Semiconductor package and method of fabricating the same Grant 6,888,209 - Jobetto May 3, 2	2005-05-03
Semiconductor device and method of manufacturing the same Grant 6,882,054 - Jobetto April 19, 2	2005-04-19
Semiconductor device having heat dissipation layer App 20050062147 - Wakisaka, Shinji ; et al.	2005-03-24
Semiconductor device and method of manufacturing the same App 20050051886 - Mihara, Ichiro ; et al.	2005-03-10
Semiconductor package having semiconductor constructing body and method of manufacturing the same App 20040245614 - Jobetto, Hiroyasu	2004-12-09
Semiconductor device and method of manufacturing the same App 20040195686 - Jobetto, Hiroyasu ; et al.	2004-10-07
Semiconductor device and method of manufacturing the same App 20040124547 - Jobetto, Hiroyasu	2004-07-01
Semiconductor package and method of fabricating the same App 20040056340 - Jobetto, Hiroyasu	2004-03-25
Light emitting device used for display device Grant 6,057,647 - Kurosawa , et al. May 2, 2	2000-05-02

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