| Patent | Date |
|---|
One-pot Biosensor And Immunoassay Method Using The Same
App 20210405042 - KIM; Min Gon ; et al. | 2021-12-30 |
Composite compound comprising upconverting nanoparticle and specific receptor
Grant 10,871,496 - Kim , et al. December 22, 2 | 2020-12-22 |
Fan-out semiconductor package including stacked chips
Grant 10,734,324 - Lee , et al. | 2020-08-04 |
Manufacturing method of an electronic component module
Grant 10,667,419 - Yoo , et al. | 2020-05-26 |
Fan-out semiconductor package
Grant 10,580,759 - Jo , et al. | 2020-03-03 |
Semiconductor package
Grant 10,483,197 - Jo , et al. Nov | 2019-11-19 |
Fan-out Semiconductor Package
App 20190326223 - LEE; Yun Tae ; et al. | 2019-10-24 |
Fan-out Semiconductor Package
App 20190267351 - JO; Eun Jung ; et al. | 2019-08-29 |
Semiconductor Package
App 20190189549 - Jo; Eun Jung ; et al. | 2019-06-20 |
Fan-out Semiconductor Package And Package On Package Including The Same
App 20190189600 - LIM; Jae Hyun ; et al. | 2019-06-20 |
Fan-out semiconductor package and package on package including the same
Grant 10,325,891 - Lim , et al. | 2019-06-18 |
Semiconductor Package
App 20190164893 - KIM; Han ; et al. | 2019-05-30 |
Fan-out semiconductor package
Grant 10,304,807 - Park , et al. | 2019-05-28 |
Fan-out semiconductor package
Grant 10,157,886 - Park , et al. Dec | 2018-12-18 |
Fan-out semiconductor package
Grant 10,096,552 - Kim , et al. October 9, 2 | 2018-10-09 |
Fan-out Semiconductor Package
App 20180233489 - PARK; Dae Hyun ; et al. | 2018-08-16 |
Fan-out Semiconductor Package
App 20180190591 - KIM; Han ; et al. | 2018-07-05 |
Complex for detecting target material and method of detecting target material using the same
Grant 9,995,741 - Kim , et al. June 12, 2 | 2018-06-12 |
Electronic Component Module And Manufacturing Method Thereof
App 20180110147 - YOO; Do Jae ; et al. | 2018-04-19 |
Fan-out Semiconductor Package
App 20180076178 - PARK; Dae Hyun ; et al. | 2018-03-15 |
Electronic component module and manufacturing method thereof
Grant 9,894,790 - Yoo , et al. February 13, 2 | 2018-02-13 |
Electronic component module and manufacturing method thereof
Grant 9,585,260 - Lim , et al. February 28, 2 | 2017-02-28 |
Complex For Detecting Target Material And Method Of Detecting Target Material Using The Same
App 20170038375 - KIM; Min-Gon ; et al. | 2017-02-09 |
Method For Detecting Cadmium And Kit For Detecting Cadmium Using Fluorescence Intensity According To Formation Of Cadmium Nanocluster
App 20170010249 - KIM; Min-Gon ; et al. | 2017-01-12 |
Semiconductor package and method of manufacturing the same
Grant 9,508,565 - Lim , et al. November 29, 2 | 2016-11-29 |
Composite Compound Comprising Upconverting Nanoparticle And Specific Receptor
App 20160209429 - Kim; Min-Gon ; et al. | 2016-07-21 |
Contact pin and power module package having the same
Grant 9,318,828 - Sohn , et al. April 19, 2 | 2016-04-19 |
Semiconductor Package And Method Of Manufacturing The Same
App 20160020171 - LIM; Jae Hyun ; et al. | 2016-01-21 |
Semiconductor Package And Method Of Manufacturing The Same
App 20150228625 - Lim; Jae Hyun ; et al. | 2015-08-13 |
External connection terminal, semiconductor package having external connection terminal, and methods for manufacturing the same
Grant 9,105,616 - Hong , et al. August 11, 2 | 2015-08-11 |
Electronic Component Module And Manufacturing Method Thereof
App 20150223361 - LIM; Jae Hyun ; et al. | 2015-08-06 |
Semiconductor Package Module
App 20150181708 - Ryu; Jong In ; et al. | 2015-06-25 |
Nested Module Package, And Method For Manufacturing Same
App 20150163913 - Jo; Eun Jung ; et al. | 2015-06-11 |
Micro Electro Mechanical Systems Sensor Module Package And Method Of Manufacturing The Same
App 20150153378 - KIM; Tae Hyun ; et al. | 2015-06-04 |
Electronic Component Module And Manufacturing Method Thereof
App 20150131235 - YOO; Do Jae ; et al. | 2015-05-14 |
Electronic Component Module And Manufacturing Method Thereof
App 20150131231 - YOO; Do Jae ; et al. | 2015-05-14 |
External Connection Terminal, Semiconductor Package Having External Connection Terminal, And Methods For Manufacturing The Same
App 20150091177 - Hong; Chang Seob ; et al. | 2015-04-02 |
External Connection Terminal, Semiconductor Package Having External Connection Terminal And Method Of Manufacturing The Same
App 20150091152 - JO; Eun Jung ; et al. | 2015-04-02 |
Semiconductor device with micro electromechanical system die
Grant 08921955 - | 2014-12-30 |
Semiconductor device with micro electromechanical system die
Grant 8,921,955 - Lee , et al. December 30, 2 | 2014-12-30 |
Semiconductor device
Grant D717,253 - Jo , et al. November 11, 2 | 2014-11-11 |
Semiconductor device
Grant D717,254 - Jo , et al. November 11, 2 | 2014-11-11 |
Semiconductor Module And Method Of Manufacturing The Same
App 20140160691 - SOHN; Young Ho ; et al. | 2014-06-12 |
Contact Pin And Power Module Package Having The Same
App 20140146487 - Sohn; Young Ho ; et al. | 2014-05-29 |
Heat Sink And Cooling System Including The Same
App 20140116670 - Kwak; Young Hoon ; et al. | 2014-05-01 |
Semiconductor Package
App 20140001611 - Jo; Eun Jung ; et al. | 2014-01-02 |
Power Module Package And Method For Manufacturing The Same
App 20130105956 - Jo; Eun Jung ; et al. | 2013-05-02 |
Semiconductor Package And Method Of Manufacturing The Semiconductor Package
App 20130001759 - Kim; Tae Hyun ; et al. | 2013-01-03 |
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